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JPS5868060U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5868060U
JPS5868060U JP16293581U JP16293581U JPS5868060U JP S5868060 U JPS5868060 U JP S5868060U JP 16293581 U JP16293581 U JP 16293581U JP 16293581 U JP16293581 U JP 16293581U JP S5868060 U JPS5868060 U JP S5868060U
Authority
JP
Japan
Prior art keywords
resin base
printed board
printed pattern
carbon layer
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16293581U
Other languages
Japanese (ja)
Inventor
坂口 祐紀雄
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP16293581U priority Critical patent/JPS5868060U/en
Publication of JPS5868060U publication Critical patent/JPS5868060U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のプリント基板の断面図、第2図は本考案
実施例のプリント基板の断面図セある。 1・・・樹脂基台、2.2・・・プリントパターン、3
゜3・・・カーボン層、5. 5−・・レジスト層。
FIG. 1 is a sectional view of a conventional printed circuit board, and FIG. 2 is a sectional view of a printed circuit board according to an embodiment of the present invention. 1...Resin base, 2.2...Print pattern, 3
゜3...Carbon layer, 5. 5--Resist layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂基台と、樹脂基台に積層されたプリントパターンと
、所望のプリントパターン上に設けられたカーボン層と
、これら樹脂基台、プリントパターン、カーボン層の表
面を覆い表面に微細な凹凸を有したレジスト層とを具備
した事を特徴とするプリント基板。
A resin base, a printed pattern laminated on the resin base, a carbon layer provided on the desired printed pattern, and a surface that covers the resin base, printed pattern, and carbon layer and has fine irregularities on the surface. A printed circuit board characterized by comprising a resist layer.
JP16293581U 1981-10-30 1981-10-30 Printed board Pending JPS5868060U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16293581U JPS5868060U (en) 1981-10-30 1981-10-30 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16293581U JPS5868060U (en) 1981-10-30 1981-10-30 Printed board

Publications (1)

Publication Number Publication Date
JPS5868060U true JPS5868060U (en) 1983-05-09

Family

ID=29955241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16293581U Pending JPS5868060U (en) 1981-10-30 1981-10-30 Printed board

Country Status (1)

Country Link
JP (1) JPS5868060U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125472A (en) * 1978-03-22 1979-09-28 Fujitsu Ltd Method of soldering printed board
JPS56127633A (en) * 1980-01-30 1981-10-06 Siemens Ag Matte finish of high brilliant resin surface of conductor plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125472A (en) * 1978-03-22 1979-09-28 Fujitsu Ltd Method of soldering printed board
JPS56127633A (en) * 1980-01-30 1981-10-06 Siemens Ag Matte finish of high brilliant resin surface of conductor plate

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