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JPS5818369U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5818369U
JPS5818369U JP11034481U JP11034481U JPS5818369U JP S5818369 U JPS5818369 U JP S5818369U JP 11034481 U JP11034481 U JP 11034481U JP 11034481 U JP11034481 U JP 11034481U JP S5818369 U JPS5818369 U JP S5818369U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
chip
patterned surface
circuit elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11034481U
Other languages
Japanese (ja)
Inventor
上野 良友
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP11034481U priority Critical patent/JPS5818369U/en
Publication of JPS5818369U publication Critical patent/JPS5818369U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の印刷配線板の一部断面図、第2図はこの
考案の印刷配線板の一部断面図を示す。 図中、11は印刷配線板、12は配線回路、14はプリ
フラックス層、15はチップ状回路素子、16は接着剤
を示す。
FIG. 1 is a partial sectional view of a conventional printed wiring board, and FIG. 2 is a partial sectional view of the printed wiring board of this invention. In the figure, 11 is a printed wiring board, 12 is a wiring circuit, 14 is a preflux layer, 15 is a chip-shaped circuit element, and 16 is an adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パターン面に形成された配線回路にチップ状回路素子を
半田付けする印刷配線板において、前記パターン面には
、スクリーン印刷などで前記チップ状回路素子の接着個
所を除いてプリフラックスが塗布されていることを特徴
とする印刷配線板。
In a printed wiring board in which chip-shaped circuit elements are soldered to a wiring circuit formed on a patterned surface, preflux is applied to the patterned surface by screen printing or the like except for the bonding locations of the chip-shaped circuit elements. A printed wiring board characterized by:
JP11034481U 1981-07-27 1981-07-27 printed wiring board Pending JPS5818369U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11034481U JPS5818369U (en) 1981-07-27 1981-07-27 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11034481U JPS5818369U (en) 1981-07-27 1981-07-27 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5818369U true JPS5818369U (en) 1983-02-04

Family

ID=29904709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11034481U Pending JPS5818369U (en) 1981-07-27 1981-07-27 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5818369U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234447U (en) * 1985-08-20 1987-02-28
JPS63296271A (en) * 1987-05-27 1988-12-02 Nec Corp Solid-state image pickup device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234447U (en) * 1985-08-20 1987-02-28
JPS63296271A (en) * 1987-05-27 1988-12-02 Nec Corp Solid-state image pickup device

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