JPS5815374U - circuit printed circuit board - Google Patents
circuit printed circuit boardInfo
- Publication number
- JPS5815374U JPS5815374U JP10728681U JP10728681U JPS5815374U JP S5815374 U JPS5815374 U JP S5815374U JP 10728681 U JP10728681 U JP 10728681U JP 10728681 U JP10728681 U JP 10728681U JP S5815374 U JPS5815374 U JP S5815374U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- circuit
- board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の実施例の回路プリント、基板の断面図を
示す。
符号、１・・・接着剤、２・・・金属箔、３・・・回路
金属箔、４・・・回路プリント板、５・・・接着剤、６
・・・金属板。The drawing shows a cross-sectional view of a circuit printed circuit board according to an embodiment of the present invention. Code, 1...Adhesive, 2...Metal foil, 3...Circuit metal foil, 4...Circuit printed board, 5...Adhesive, 6
...Metal plate.
Claims (1)
プリント板が接着剤１を介して金属箔２と回路金属箔３
とを接合したものから構成されたことを特徴とする回路
プリント基板。In a board in which a printed circuit board is provided on a metal plate, the printed circuit board is bonded to a metal foil 2 and a circuit metal foil 3 via an adhesive 1.
A printed circuit board characterized in that it is composed of a bonded circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10728681U JPS5815374U (en) | 1981-07-21 | 1981-07-21 | circuit printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10728681U JPS5815374U (en) | 1981-07-21 | 1981-07-21 | circuit printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5815374U true JPS5815374U (en) | 1983-01-31 |
Family
ID=29901733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10728681U Pending JPS5815374U (en) | 1981-07-21 | 1981-07-21 | circuit printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815374U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62135464U (en) * | 1986-02-19 | 1987-08-26 |
-
1981
- 1981-07-21 JP JP10728681U patent/JPS5815374U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62135464U (en) * | 1986-02-19 | 1987-08-26 |
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