JPS5822332Y2 - Piezoelectric element retention spring - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a holding spring that holds a piezoelectric element such as a crystal resonator.

Conventionally, for example, a retaining spring in a crystal oscillator or the like has been attached to a pin implanted on a base by spot welding or solder welding, making it troublesome to attach.

Particularly in cases where IC or LSI chips are sealed in the same container, if you attempt to attach the retaining spring after wire bonding the IC or LSI chip to the pins on the base, the wire may be spot welded or soldered. On the other hand, if the retaining spring was attached first, wire bonding would become difficult.

The present invention eliminates the above-mentioned drawbacks of the prior art, and the retaining spring of this invention will be described in detail below with reference to embodiments shown in the drawings.

In FIGS. 1 and 2, 1 is a T-shaped holding spring for holding a piezoelectric element such as a crystal resonator, which will be described later. The upper half of this holding spring has a slit 2 for holding the piezoelectric element in a horizontal direction. The holding portion 1a is provided with a hole.

The left and right side portions of the holding portion 1a are bent diagonally backward by an appropriate length to facilitate the installation of the piezoelectric element from the side.

A leg plate 3 hangs integrally from the lower half of the holding spring 1, and a support portion 1b is formed at the lower end of the leg plate to be coupled to a pin protruding from a base, which will be described later.

The shape of the support part 1b is as shown in the second figure, with the plate parts 4 on the left and right sides thereof.
, 5 are bent to form a roughly triangular space.

The size of this triangular space should be such that when it is fitted into the pin described later, the circumferential surface of the pin is in close contact with the pin, and its shape is not limited to a triangular shape. It may have a shape that can be wrapped, such as a rectangular shape, a quadrilateral shape, or other polygonal shape.

In addition, as another embodiment of the support part 1b, as shown in FIG. 3, the left and right plate parts 4a and 5a of the support part 1b are formed into a tooth shape,
The spring force may be weakened so that it can be lightly press-fitted.

Although the holding part 1a is shown as an embodiment in which the piezoelectric element is held horizontally, for example, as shown in FIG. slits 1-2a may be provided.

An example of how this holding spring is used will be explained. As shown in Fig. 5, a large number of pins 7゜7... are arranged in a circle on the base 6, penetrating the airtight glass 8, and some pins are arranged in a circular manner in a corresponding positional relationship. Two pins 7a, 7
There is a.

Further, an IC chip 9 is placed and fixed on the base 6.
The chip and pins 7 are connected via bonding wires 10.

By the way, the support portion 1b of the holding spring 1 is fitted into the upper end portions of the pins 7a, 7a.

After arranging the retaining spring 1 correctly, pin 7
As shown in the second figure, a conductive adhesive 11 is poured into the space between the pin a and the support part 1b to firmly fix the pin and the support part 1b.

A piezoelectric element 12 such as a crystal resonator is inserted and assembled between the slits 2, 2 of the two holding springs 1, 1 arranged as described above.

Finally, the cap 13 is fitted onto the base 6, and the inside is replaced with a vacuum or nitrogen gas to seal it.

According to the holding spring of this invention, which is incorporated as described above, the IC or LSI chip is first assembled on the base, and then the holding spring is fixed to the pin to hold the piezoelectric element, so there is no need for soldering etc. No additional work is required.

Therefore, contamination from outgas and splash generated during soldering or spot welding will not have any negative effect on IC or LSI chips, and there is no risk of damage or cracks to the airtight glass. Installation is easy and reliable, and has great practical effects.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a front view;
2 is a sectional view taken along line II-II in FIG. 1, FIG. 3 is a front view showing another embodiment of the holding spring, FIG. 4 is a front view showing still another embodiment, and FIG. 5 is a front view showing another embodiment of the holding spring. FIG. 1... Holding spring, 1a... Holding part, 1
b... Support part, 2, 2a... Slit, 3... Leg plate, 4, 5... Plate part, 12
······Piezoelectric element.

Claims (1)

[Scope of utility model registration request] A support section consisting of a holding section that holds a voltage element such as a crystal oscillator, a leg plate vertically disposed below the holding section, and a plate section extending from the left and right sides of the flat end of this leg plate, which are layered inward. The support part has a non-circular cross-sectional shape that fits into the pin implanted on the base and makes approximately linear contact with the pin at multiple locations, and has gaps at multiple locations between the support section and the pin. A retaining spring for a piezoelectric element, characterized in that it is formed.