JPS58138352U - Lead terminal for semiconductor package - Google Patents
Lead terminal for semiconductor packageInfo
- Publication number
- JPS58138352U JPS58138352U JP3565182U JP3565182U JPS58138352U JP S58138352 U JPS58138352 U JP S58138352U JP 3565182 U JP3565182 U JP 3565182U JP 3565182 U JP3565182 U JP 3565182U JP S58138352 U JPS58138352 U JP S58138352U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- semiconductor package
- sealing
- bent
- base body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリード端子を用いた半導体装置の封止状
態を説明するための分解斜視図、第２図は第１図に示し
た半導体装置の封止後の側断面図、第３図は本考案によ
る半導体パッケージ用のリード端子の一実施例を適用し
たリードフレームを示す平面図、第４図ＡおよびＢは本
考案によるリード端子を示す側面図および平面図である
。
１１・・・基体、１３・・・蓋体、１５，１５０・・・
リードフレーム、１７，１７０・・・リード端子、４１
・・・側端面、４３・・・切れ目。Fig. 1 is an exploded perspective view for explaining the sealed state of a semiconductor device using conventional lead terminals, Fig. 2 is a side sectional view of the semiconductor device shown in Fig. 1 after sealing, and Fig. 3 4 is a plan view showing a lead frame to which an embodiment of the lead terminal for a semiconductor package according to the present invention is applied, and FIGS. 4A and 4B are a side view and a plan view showing the lead terminal according to the present invention. 11...Base body, 13...Lid body, 15,150...
Lead frame, 17, 170... Lead terminal, 41
... Side end surface, 43... Cut.
Claims (1)
半導体素子を外部回路に電気的に接続すると共に封止後
に折り曲げられる半導体パッケージ用のリード端子にお
いて、該リード端子を長手板状で形成し、封止後に折り
曲げるべき位置で且つ長手方向における両側端面の少な
くとも一方に切れ目を付けたことを特徴とする半導体パ
ッケージ用のリード端子。A lead terminal for a semiconductor package that is sandwiched between a base body and a lid body, electrically connects a semiconductor element sealed with the base body and lid body to an external circuit, and is bent after sealing. 1. A lead terminal for a semiconductor package, which is formed into a longitudinal plate shape and has a cut at a position to be bent after sealing and at least one of both end faces in the longitudinal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3565182U JPS58138352U (en) | 1982-03-12 | 1982-03-12 | Lead terminal for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3565182U JPS58138352U (en) | 1982-03-12 | 1982-03-12 | Lead terminal for semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138352U true JPS58138352U (en) | 1983-09-17 |
Family
ID=30047112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3565182U Pending JPS58138352U (en) | 1982-03-12 | 1982-03-12 | Lead terminal for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138352U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62163352A (en) * | 1986-01-14 | 1987-07-20 | Toshiba Corp | Semiconductor device |
| JP2006080350A (en) * | 2004-09-10 | 2006-03-23 | Denso Corp | Semiconductor device, and mounting structure thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240063A (en) * | 1975-09-26 | 1977-03-28 | Hitachi Ltd | Lead frame |
| JPS5252370A (en) * | 1976-08-27 | 1977-04-27 | Hitachi Ltd | Fabrication of glass-sealed semiconductor device |
| JPS5390868A (en) * | 1977-01-21 | 1978-08-10 | Hitachi Ltd | Semiconductor device of glass ceramic package type |
-
1982
- 1982-03-12 JP JP3565182U patent/JPS58138352U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240063A (en) * | 1975-09-26 | 1977-03-28 | Hitachi Ltd | Lead frame |
| JPS5252370A (en) * | 1976-08-27 | 1977-04-27 | Hitachi Ltd | Fabrication of glass-sealed semiconductor device |
| JPS5390868A (en) * | 1977-01-21 | 1978-08-10 | Hitachi Ltd | Semiconductor device of glass ceramic package type |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62163352A (en) * | 1986-01-14 | 1987-07-20 | Toshiba Corp | Semiconductor device |
| JP2006080350A (en) * | 2004-09-10 | 2006-03-23 | Denso Corp | Semiconductor device, and mounting structure thereof |
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