JPS58196021A - Inspection of reticle for defect - Google Patents
Inspection of reticle for defectInfo
- Publication number
- JPS58196021A JPS58196021A JP57079362A JP7936282A JPS58196021A JP S58196021 A JPS58196021 A JP S58196021A JP 57079362 A JP57079362 A JP 57079362A JP 7936282 A JP7936282 A JP 7936282A JP S58196021 A JPS58196021 A JP S58196021A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- foreign matter
- light
- laser beam
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 title claims description 16
- 238000007689 inspection Methods 0.000 title claims description 13
- 230000001678 irradiating effect Effects 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000011268 retreatment Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はレチクルの欠陥検査方法にかかり、特にレチク
ルに付着したゴミ、異物等の検出を行いレチクルの欠陥
検査を行うレチクルの欠陥検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a reticle defect inspection method, and more particularly to a reticle defect inspection method for detecting dust, foreign matter, etc. attached to a reticle and inspecting the reticle for defects.
手書図面からアートワークを経て実パターン図形を約1
0倍した大きさのレチクルはこの状態で表面に付着した
ゴミや異物による欠陥検査を行うのが通例である。From hand-drawn drawings to artwork, the actual pattern shape is approximately 1
It is customary to inspect a reticle with a size multiplied by 0 in this state for defects due to dust or foreign matter attached to the surface.
その欠陥検査は各種方法により行なわれているが、一般
的方法としては第1図に示す方法による。The defect inspection is carried out by various methods, but the method shown in FIG. 1 is generally used.
第1図は従来のレチクルの光学的欠陥検査方法の原理説
明図である。図において、lはレチクル、2および2′
はレチクルの表面に形成きれたクロームパターン、3お
よび3′はそれぞれA面、B面側に設けられたレーザビ
ーム投射装置、4および4′はそれぞれ3および3′の
光を受光するディテクターである。また5および5Iは
A面およびB面に付着した異物とする。異物5および5
′の検出は次のように行なわれていた。すなわちA面に
おいてはレーザビーム投射装置3より発した光Xはレチ
クルの平滑表面にあたると入射角と同じ反射角でY方向
に反射する。ディテクターは前記反射光線上にないので
光を受光しない。ところが入面上に異物5が存在すると
入射光Xは異物の不整面上で乱反射をして光は各方面に
分散する。分散するとZ方向の光はディテクター4にあ
たり受光し信号が得られ異物の確認ができる。またB面
においては異物が存在するとレーザビーム投射装置より
発した光X′は異物で乱反射し正規の方向Y’に集中せ
ずZ′方向に乱反射した光はディテクタ4′により受光
され信号が得られB面の異物の確認ができる。すなわち
従来のレチクルへ付着したゴミや異物の検出は表面およ
び裏面を光で走査し存在する異物で乱反射させ、乱反射
光をディテクタで受光し異物の存在を知り、異物やゴミ
が存在したレチクルは欠陥製品と断定し、洗滌尋の異物
除去工程が加えられる。FIG. 1 is a diagram explaining the principle of a conventional reticle optical defect inspection method. In the figure, l is the reticle, 2 and 2'
is a chrome pattern formed on the surface of the reticle, 3 and 3' are laser beam projection devices provided on the A side and B side, respectively, and 4 and 4' are detectors that receive the lights of 3 and 3', respectively. . Further, 5 and 5I are foreign substances attached to the A side and the B side. Foreign objects 5 and 5
’ was detected as follows. That is, on the A plane, when the light X emitted from the laser beam projection device 3 hits the smooth surface of the reticle, it is reflected in the Y direction at the same reflection angle as the incident angle. Since the detector is not on the reflected beam, it does not receive any light. However, if a foreign object 5 exists on the entrance surface, the incident light X is diffusely reflected on the irregular surface of the foreign object, and the light is dispersed in various directions. When dispersed, the light in the Z direction hits the detector 4 and is received, a signal is obtained and the foreign object can be confirmed. Furthermore, if there is a foreign object on the B plane, the light X' emitted from the laser beam projection device will be diffusely reflected by the foreign object, and the light that is diffusely reflected in the Z' direction without being concentrated in the normal direction Y' will be received by the detector 4' and a signal will be obtained. foreign matter on side B can be confirmed. In other words, conventional methods for detecting dust and foreign matter attached to a reticle scan the front and back surfaces with light, diffuse the reflected light from the foreign matter, and detect the presence of foreign matter by receiving the diffusely reflected light with a detector.A reticle with foreign matter or foreign matter is determined to be defective. It is determined that the product is a product, and a cleaning process is added to remove foreign substances.
しかるにレチクルにゴミや異物が付着存在しても無光用
の光に対し透過性のものであれば、機能的に何等問題に
する必要はなく、従って工数のかかる洗滌等の再処理を
施す必要はない。しかるに前記した検査方法によりゴミ
や異物の存在が確認されるとすべて欠陥品として扱われ
、面倒なゴミや異物の除去作業が実施された。そのため
多くの工数を要し生産管理上の問題点となっていた。However, even if there is dust or foreign matter on the reticle, as long as it is transparent to non-light light, there is no need for it to be functionally problematic; therefore, it is necessary to perform reprocessing such as cleaning, which takes a lot of man-hours. There isn't. However, if the presence of dust or foreign matter is confirmed by the above-mentioned inspection method, it is treated as a defective product, and a troublesome work to remove the dust or foreign matter is carried out. This required a large amount of man-hours and caused problems in production management.
従って本発明は以上の問題点に対処してなされたもので
、無光用の光を透過しマスクとして機能上側岬間馳のな
いレチクルは良品として処理することを可能にしたレチ
クルの欠陥検査方法を提供するにある。Therefore, the present invention has been made to address the above problems, and is a reticle defect inspection method that allows a reticle that transmits non-light light and functions as a mask to be treated as a non-defective item. is to provide.
すなわち本発明の要旨は、レチクルの両面にそれぞれレ
ーザビームを照射し、該レーザビームの散乱光を検出す
る工程と、他のレーザビームをレチクルに画直に照射し
、レチクルからの透過光を検出する工程とを含むことを
IVf6とするレチクルの欠陥検査方法にある。That is, the gist of the present invention is to irradiate each side of a reticle with a laser beam and detect the scattered light of the laser beam, and to irradiate the reticle with another laser beam directly and detect the transmitted light from the reticle. The reticle defect inspection method includes the step of IVf6.
以下図面を参照して本発明の詳細な説明る。The present invention will be described in detail below with reference to the drawings.
第2図は本発明によるレチクルの欠陥検査方法を示す原
理説明図である。第1図の場合と同様に第2図において
もレチクル1の裏面(B面)にはクロムパターン2およ
び2′が形成されており、レチクルの表面(A面)と裏
面の上方ノおよび下方にはレーザビーム投射装置3.3
′が設置され、これより発したレーザビームによりそれ
ぞれの表面を走査する。今図示のようにA面に異物5が
存在するとレーザビーム投射装置より発した光Xは本来
ならY方向に反射し、この光路上にないディテクタ4に
は光は入らないが異物5にあったレーザビー▲光は異物
ラで乱反射し、その散乱孔の一部はA面のディテクタ4
に入射する。すなわちA面に異物有りの信号が感知でき
る。また下面(B面)にはこの場合異物がないのでレー
ザビーム投射装置より発した光X′は平滑面で正規方向
Y′に全部反射しディテクタ4′は何部受光することな
く裏面にはゴず異物が存在しないことが確認できる。FIG. 2 is a diagram explaining the principle of the reticle defect inspection method according to the present invention. As in the case of Fig. 1, in Fig. 2 as well, chrome patterns 2 and 2' are formed on the back surface (B surface) of the reticle 1, and chrome patterns 2 and 2' are formed on the upper and lower sides of the front surface (A surface) and the back surface of the reticle. is a laser beam projection device 3.3
' is installed, and each surface is scanned by a laser beam emitted from this. As shown in the figure, if there is a foreign object 5 on the A side, the light X emitted from the laser beam projection device would normally be reflected in the Y direction, and the light would not enter the detector 4, which is not on this optical path, but it would be on the foreign object 5. Laser beam▲The light is diffusely reflected by the foreign object L, and a part of the scattering hole is reflected by the detector 4 on the A side.
incident on . In other words, a signal indicating the presence of foreign matter on the A side can be detected. In addition, since there is no foreign matter on the bottom surface (surface B) in this case, the light X' emitted from the laser beam projection device is completely reflected in the normal direction Y' by the smooth surface, and some portion of the light is not received by the detector 4', and the back surface It can be confirmed that no foreign matter is present.
また本発明の一実施例の第2図においてはJIE3のレ
ーザビーム投射装置6をA面の上方に準備し、この装置
よりの光はレチクル面に垂直にあたるように用意され、
その光はレチクルを透過し、その直下に設けられている
ディテクタ7にあたるよう配置されている。もしレチク
ルの表面のレーザビーム投射装置の経路の平面上に異物
やゴミが存在しないときは光はディテクタに完全に受光
される。Further, in FIG. 2 of an embodiment of the present invention, a JIE3 laser beam projection device 6 is prepared above the A surface, and the light from this device is prepared so as to strike perpendicularly to the reticle surface.
The light is arranged so as to pass through the reticle and strike the detector 7 provided directly below it. If there is no foreign object or dirt on the plane of the path of the laser beam projection device on the surface of the reticle, the light will be completely received by the detector.
ところが不透明の異物が存在するときは、それにさえぎ
られディテクタ7への入力はない。しかし異物が半透明
又はビーム径より小さいときは光は減衰されて7に到達
する。また異物5が光の透過性物体であるときは光は殆
んど全部異物を透過してディテクタ7に到達する。従っ
てこの異物はiスフ作用に何等悪影轡を与えないので工
数のかかる異物除去のプロセスを実施する必要はない。However, when an opaque foreign object is present, it blocks the input and there is no input to the detector 7. However, when the foreign object is semitransparent or smaller than the beam diameter, the light is attenuated and reaches 7. Further, when the foreign object 5 is a light-transmitting object, almost all of the light passes through the foreign object and reaches the detector 7. Therefore, since this foreign material does not have any adverse effect on the i-splash action, there is no need to carry out a time-consuming process for removing the foreign material.
また異物が存在すれに受光した光は減衰が多かれ少なか
れされるので不良品とする信号レベルを決めておき、限
度以上の減衰をしたときは欠陥として再処理すればよい
。Furthermore, since light received before a foreign object is present will be more or less attenuated, the signal level for determining a defective product can be determined, and if the attenuation exceeds the limit, it can be reprocessed as a defect.
すなわち本発明においてはレチクルの表面上の異物の存
在は従来方法により確認し、その機能的な面のチエ,り
を垂直方向からの光の透過により行えに洗滌処理尋の再
処理工程は必要なときにのみ行うと云う改善された検査
方法を得る仁とができる。In other words, in the present invention, the presence of foreign matter on the surface of the reticle is confirmed by the conventional method, and the functional surface can be checked by transmitting light from the vertical direction. It is possible to obtain improved testing methods that are only occasionally performed.
第3図は本発明方法における検出領号の信号処理回路図
である。図において11および12はA面およびB面の
異物存在信号の入力端子,13は画論透過光の信号入力
端子である。また14.15はNOT回路、16はAN
D回路、1 7Fi.OR回路、18はAND回路であ
り、19は出力端子である。すなわち受光したときを“
1fとすると11゜12の端子にはゴミや異物が存在す
ると、散乱光がディテクタに入り“1mの信号が送られ
、ゴミや異物が存在しないときは0#の信号が送られる
。FIG. 3 is a signal processing circuit diagram of a detection region in the method of the present invention. In the figure, 11 and 12 are input terminals for foreign matter presence signals on the A side and B side, and 13 is a signal input terminal for image transmission light. Also, 14.15 is NOT circuit, 16 is AN
D circuit, 1 7Fi. An OR circuit, 18 an AND circuit, and 19 an output terminal. In other words, when light is received “
Assuming 1f, if there is dust or foreign matter at the terminals 11° and 12, scattered light enters the detector and a signal of "1m" is sent, and when there is no dust or foreign matter, a signal of 0# is sent.
一方13の端子にはゴミや異物が存在すると光は遮蔽さ
れ透過光がないのでディテクタは受光しない。従って信
号は“0”となり、またゴξや異物が存在しないときは
ディテクタは受光するので“1″の信号が送られる。On the other hand, if there is dust or foreign matter at the terminal 13, the light will be blocked and no transmitted light will be present, so the detector will not receive any light. Therefore, the signal becomes "0", and when there is no gore or foreign object, the detector receives light, so a signal of "1" is sent.
これらの信号は第3図に示した信号処理回路で処理すれ
ば、ゴミや異物の除去処理は19の端子に“ビの信号が
出力されたときに集札すればよい。If these signals are processed by the signal processing circuit shown in FIG. 3, dust and foreign matter can be removed by collecting the tickets when the "B" signal is output to the terminal 19.
以下にゴミ、異物の付着条件と信号処理回路の出力の関
係につき説明する。第4図(a)〜(e)は信号処理回
路の各段における信号の入出力符号を示す図である。第
4図(a)は18のAND回路、第4図(b)は15O
NOT回路、第4図(C)は17のOR回路、第4図(
d)は14のNOT回路、第4図(e)は16のAND
回路の状況を示した。The relationship between the adhesion conditions of dust and foreign matter and the output of the signal processing circuit will be explained below. FIGS. 4(a) to 4(e) are diagrams showing input/output codes of signals at each stage of the signal processing circuit. Figure 4(a) is an 18 AND circuit, Figure 4(b) is a 15O
The NOT circuit, Figure 4 (C) is the 17 OR circuit, Figure 4 (
d) shows 14 NOT circuits, and Figure 4(e) shows 16 AND circuits.
The status of the circuit is shown.
wJ4図(1)カらAND回路18の出力が1#となる
条件は、これに入る信号が何れも“1#となる必要があ
るので15の出力と17の出力の双方が“1#となる場
合である。15の出力が“1#となる第1の条件は第4
図(b)から13の出力が“0”となる場合、すなわち
垂直に入力させた光がゴミや異物により遮蔽され透過光
がないか又は限度以下の光しか透過しない場合である。From figure (1) of wJ4, the condition for the output of the AND circuit 18 to be 1# is that all the signals input to it must be ``1#'', so both the outputs of 15 and 17 must be ``1#''. This is the case. The first condition for the output of 15 to be “1#” is the 4th
As shown in Figure (b), the output of 13 is "0", that is, the vertically input light is blocked by dust or foreign matter, and no light is transmitted, or only light below the limit is transmitted.
17の出力が1”とな為第2の条件は第4図(C)から
11の出力と16の出力の何れか一方、又は双方が“1
”となる場合である。すなわち双方の出力が何れも0”
となる場合は除かれることになる。Since the output of 17 is "1", the second condition is that one or both of the outputs of 11 and 16 are "1" from FIG. 4(C).
”.In other words, both outputs are 0.”
If so, it will be excluded.
ここで、双方の出力が倒れも0#となる場合を考える。Here, consider a case where both outputs fall to 0#.
まず、11の出力が“0”どなる場合は第4図(d)か
ら14の出力は“1”となる。次に16の出力が10”
となるのは第4図(e)から14の出力と12の出力の
いずれか一方又は双方が“0”となる場合であるが、1
4の出力は“1”であるために12の出力が“0#の場
合にのみ16の出力が“θ′となる。すなわち11の出
力と16の出力が何れも“0#となるのは11と12の
双方の出力が“0”となる場合である。First, when the output of 11 becomes "0", the output of 14 becomes "1" from FIG. 4(d). Then the output of 16 is 10”
This is the case where either or both of the outputs 14 and 12 are "0" from FIG. 4(e), but 1
Since the output of No. 4 is "1", the output of No. 16 becomes "θ' only when the output of No. 12 is "0#". That is, the outputs of 11 and 16 both become "0#" when the outputs of both 11 and 12 become "0".
ここで18の出力が“1”となる第2の条件は、11の
出力と16の出力が何れも“O”となる場合であるから
、11と12の何れか一方が“1”又は双方が“1”と
なる場合となる。すなわちA面又はB面の少なくとも一
方にゴミ、異物が存在し、投射した光が異物で乱反射し
、ディテクタで検知され、11又は12の端子又は双方
に1”の信号を送る時である。Here, the second condition for the output of 18 to be "1" is when both the output of 11 and the output of 16 are "O", so either one of 11 and 12 is "1" or both are "1". is "1". That is, when there is dust or a foreign object on at least one of the A side or the B side, the projected light is diffusely reflected by the foreign object, is detected by the detector, and a 1'' signal is sent to the terminal 11 or 12 or both.
以上のことから、本発明はレチクルの何れか一方にゴミ
、異物が存在し、かつそのコ゛ミ、異物が非透性を有す
るか、或は限度以下の光しか透過しない場合にのみ欠陥
として判定するので%無光用の光を透過し、マスクとし
て機能上側等問題のないレチクルは良品として処理する
ことができる。Based on the above, the present invention determines it as a defect only when dust or foreign matter is present on either side of the reticle and the dust or foreign matter is non-transparent or only transmits less than a limit of light. Therefore, a reticle that transmits % non-lighting light and has no problems in functioning as a mask can be treated as a good product.
すなわちディテクタに検知された信号を第3図に示した
信号処理回路で処理すれば、本発明の結果の判定は迅速
容易となり、工程の合理化を一段と進めることができる
。That is, if the signal detected by the detector is processed by the signal processing circuit shown in FIG. 3, the results of the present invention can be quickly and easily determined, and the process can be further streamlined.
なお上記実施例の説明では、レチクルの両面にそれぞれ
レーザビーム投射装置を設置したが、反射鏡を使え11
台で両面に光を投射することが容易である。In the explanation of the above embodiment, laser beam projection devices were installed on both sides of the reticle, but it is also possible to use a reflector.
It is easy to project light onto both sides with a stand.
また検知結果をレベル別に表示すれば、ゴミ。Also, if you display the detection results by level, it's garbage.
異物の判定が正確になると共に、その除去作業を合理化
することができる。Not only can the determination of foreign matter become more accurate, but also the removal work can be streamlined.
以上説明したとおり、本発明によれば、レチクル面上に
ゴきや異物が存在しても11晃用の光を透過し、マスク
として機能上何部問題のないレチクルは不良品として扱
わないことにより不必要にレチクルの交換、洗滌勢を行
なわずに済すことができるので、工数の大幅な軽減が可
能となった。As explained above, according to the present invention, even if there is dirt or foreign matter on the reticle surface, a reticle that transmits the 11-day light and has no functional problems as a mask will not be treated as a defective product. This eliminates the need for unnecessary reticle replacement and cleaning, resulting in a significant reduction in man-hours.
第1図は従来のレチクルの光学的欠陥検査方法の原理説
明図、第2図は本発明の一寮施例によるレチクルの光学
的欠陥検査方法の原理説明図、第3図は本発明の検出信
号の信号処理回路図、第4図(a)〜(e)は信号処理
回路の各段に於ける信号の入出力符号を示す図である。
1・・・・・・レチクル、2.2’・・・・・・クロム
パターン、3s3’s6・・・・・・レーザビーム投射
装置、4,4’。
7・・・・・・ディテクタ、5.5’・・・・・・ゴミ
又は異物、11゜12.13・・・・・・入力端子、1
4.15・・・・・・NOT回路、16,18・・・・
・・AND回路、17・・・・・・OR回路、19・・
・・・・出力端子、x、x’・・・・・・レーザビーム
投射光、Y、Y’・・・・・・反射光、A面・・・・・
・クロムパターンのない面、B111!]・・・・・・
クロムパターンのある面。
ノ5
(イ)3図
第4区Fig. 1 is an explanatory diagram of the principle of a conventional reticle optical defect inspection method, Fig. 2 is an explanatory diagram of the principle of a reticle optical defect inspection method according to an embodiment of the present invention, and Fig. 3 is a diagram illustrating the principle of a reticle optical defect inspection method according to an embodiment of the present invention. The signal processing circuit diagrams of FIGS. 4(a) to 4(e) are diagrams showing the input/output codes of signals at each stage of the signal processing circuit. 1...Reticle, 2.2'...Chrome pattern, 3s3's6...Laser beam projection device, 4,4'. 7...Detector, 5.5'...Dust or foreign matter, 11°12.13...Input terminal, 1
4.15...NOT circuit, 16,18...
...AND circuit, 17...OR circuit, 19...
...Output terminal, x, x'...Laser beam projection light, Y, Y'...Reflected light, A side...
・Side without chrome pattern, B111! 】・・・・・・
Surface with chrome pattern. No. 5 (a) Figure 3 4th section
Claims (1)
ーザビームの散乱光を検出する工程と、他のレーザビー
ムをレチクルに垂直に照射しレチクルからの透過光を検
出する工程とを含むことを特徴とするレチクルの欠陥検
査方法。The method is characterized by including a step of irradiating each side of the reticle with a laser beam and detecting the scattered light of the wrinkled laser beam, and a step of irradiating another laser beam perpendicularly to the reticle and detecting the transmitted light from the reticle. A reticle defect inspection method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57079362A JPS58196021A (en) | 1982-05-12 | 1982-05-12 | Inspection of reticle for defect |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57079362A JPS58196021A (en) | 1982-05-12 | 1982-05-12 | Inspection of reticle for defect |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58196021A true JPS58196021A (en) | 1983-11-15 |
Family
ID=13687771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57079362A Pending JPS58196021A (en) | 1982-05-12 | 1982-05-12 | Inspection of reticle for defect |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58196021A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02140742A (en) * | 1988-02-25 | 1990-05-30 | Eastman Kodak Co | Reticle inspection method and apparatus |
-
1982
- 1982-05-12 JP JP57079362A patent/JPS58196021A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02140742A (en) * | 1988-02-25 | 1990-05-30 | Eastman Kodak Co | Reticle inspection method and apparatus |
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