JPS58184867U

JPS58184867U - Printed board

Info

Publication number: JPS58184867U
Application number: JP8138382U
Authority: JP
Inventors: 中西　政貴
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1982-05-31
Filing date: 1982-05-31
Publication date: 1983-12-08

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図はプリント配線体の一例を示す側断面図、第２図
はそれをシャーシベースに取付けた状態を示す側断面図
、第３図は半田ディツプによりスルーホールが半田で目
詰りした状態を示すプリント配線体の部分断面図、第４
図は従来の目詰り防止方法を示すブリット配線体の部分
断面図、第５図ａは従来の他の目詰り防止構造を示すプ
リント配線体の部分平面図、第５図すは第５図ａのＡ−
Ａ線に沿う断面図、第６図は本考案−実施例のプリント
基板の部分平面図、第７図はそれが半田デイツプ工程を
経た状態を示す側断面図である。１・・・電子部品、２・・・プリント基板、５ａ・・・
リード線、６・・・スルーホール、７・・・半田付部分
、８・・・半田、１０’・・・切り孔み、１１・・・配
線部分、１２・・・半田レジスト膜。Figure 1 is a side sectional view showing an example of a printed wiring body, Figure 2 is a side sectional view showing the state in which it is attached to a chassis base, and Figure 3 is a side sectional view showing a state where the through hole is clogged with solder due to solder dip. Partial sectional view of the printed wiring body shown in FIG.
The figure is a partial sectional view of a printed wiring body showing a conventional clogging prevention method, FIG. 5a is a partial plan view of a printed wiring body showing another conventional clogging prevention structure, and FIG. A-
6 is a partial plan view of a printed circuit board according to an embodiment of the present invention, and FIG. 7 is a side sectional view showing the printed circuit board after it has undergone a solder dip process. 1...Electronic component, 2...Printed circuit board, 5a...
Lead wire, 6... Through hole, 7... Soldering part, 8... Solder, 10'... Cut hole, 11... Wiring part, 12... Solder resist film.

Claims

[Scope of utility model registration request]

A printed circuit board having a conductive land including a soldered part formed at the opening periphery of a through hole through which a lead wire of an electronic component is inserted, and a wiring part connected to this soldered part and formed with a solder resist film, A printed circuit board characterized in that a slit-like cut extending from the through hole to the soldering portion and the wiring portion is formed in the conductive land.