JPS58158460U - semiconductor light emitting device - Google Patents
semiconductor light emitting deviceInfo
- Publication number
- JPS58158460U JPS58158460U JP1982056431U JP5643182U JPS58158460U JP S58158460 U JPS58158460 U JP S58158460U JP 1982056431 U JP1982056431 U JP 1982056431U JP 5643182 U JP5643182 U JP 5643182U JP S58158460 U JPS58158460 U JP S58158460U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- emitting device
- metal laminate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のこの種の半導体発光装置の断面構造図、
第2図は、この考案の一実施例による半導体発光装置の
断面構造図である。図中1は発光領域、2,3はオーミ
ック電極、4はエツチング溝、5は球レンズ、6は樹脂
、7はメッキ、8はメッキによって形成された溝である
。なお図中同一符号は同一または相当部分を示す。
補正 昭57.12. 6
実用新案登録請求の範囲を次のように補正する。
■実用新案登録請求の範囲
半導体発光素子の電極上に設けられた金属積層と、この
電極および金属積層に形成された穴と、この穴にはめこ
まれた球レンズを備えた半導体発光装置。
図面の簡単な説明を次のように補正する。
明細書第4頁第7行〜第8行、第9行に「溝」とあるの
を「穴」と訂正する。FIG. 1 is a cross-sectional structural diagram of a conventional semiconductor light emitting device of this type.
FIG. 2 is a cross-sectional structural diagram of a semiconductor light emitting device according to an embodiment of this invention. In the figure, 1 is a light emitting region, 2 and 3 are ohmic electrodes, 4 is an etched groove, 5 is a ball lens, 6 is a resin, 7 is a plating, and 8 is a groove formed by plating. Note that the same reference numerals in the figures indicate the same or corresponding parts. Correction 1982.12. 6. The scope of claims for utility model registration shall be amended as follows. ■Claims for Utility Model Registration A semiconductor light emitting device comprising a metal laminate provided on an electrode of a semiconductor light emitting element, a hole formed in the electrode and the metal laminate, and a ball lens fitted into the hole. The brief description of the drawing has been amended as follows. On page 4, lines 7 to 8, and line 9 of the specification, the word "groove" is corrected to "hole."
Claims (1)
の金属積層に形成された溝と1.この溝にはめこまれた
球レンズを備えた半導体発光装置。A metal laminate provided on an electrode of a semiconductor light emitting element, a groove formed in this metal laminate, and 1. A semiconductor light emitting device equipped with a ball lens fitted into this groove.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982056431U JPS58158460U (en) | 1982-04-16 | 1982-04-16 | semiconductor light emitting device |
GB08309856A GB2122418B (en) | 1982-04-16 | 1983-04-12 | Light emitting semi conductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982056431U JPS58158460U (en) | 1982-04-16 | 1982-04-16 | semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58158460U true JPS58158460U (en) | 1983-10-22 |
Family
ID=13026896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982056431U Pending JPS58158460U (en) | 1982-04-16 | 1982-04-16 | semiconductor light emitting device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS58158460U (en) |
GB (1) | GB2122418B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593930B1 (en) * | 1986-01-24 | 1989-11-24 | Radiotechnique Compelec | OPTO-ELECTRONIC DEVICE FOR SURFACE MOUNTING |
JPH06334262A (en) * | 1993-03-23 | 1994-12-02 | Mitsubishi Electric Corp | Semiconductor laser array device, semiconductor laser device, and their manufacture |
JP2022094172A (en) * | 2020-12-14 | 2022-06-24 | パナソニックIpマネジメント株式会社 | Light emitting device, manufacturing method, and waveguide structure |
CN112864298A (en) * | 2021-01-08 | 2021-05-28 | 厦门市信达光电科技有限公司 | Small-angle LED packaging structure and preparation method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4368481A (en) * | 1979-06-19 | 1983-01-11 | Tokyo Shibaura Denki Kabushiki Kaisha | Light-driven semiconductor device |
-
1982
- 1982-04-16 JP JP1982056431U patent/JPS58158460U/en active Pending
-
1983
- 1983-04-12 GB GB08309856A patent/GB2122418B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2122418A (en) | 1984-01-11 |
GB8309856D0 (en) | 1983-05-18 |
GB2122418B (en) | 1986-08-06 |
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