JPS5890685U

JPS5890685U - connection structure

Info

Publication number: JPS5890685U
Application number: JP1981184944U
Authority: JP
Inventors: 池端　昌夫; 荒尾　義範; 泰男井口
Original assignee: 沖電気工業株式会社
Priority date: 1981-12-14
Filing date: 1981-12-14
Publication date: 1983-06-20

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来例を示す斜視図、第２図は同断面図、第３
図は横ずれが生じた状態の従来例の断面図、第４図は本
考案の一来施例を示す斜視図、第５図は同断面図、第６
図は本考案の他の一実施例を示す断面図、第７図は接続
状態を示す同断面図である。？、　　８．　１４・・・基板、７ａ、　　８ａ、　　
１５．　１７・・・接続端子、９．１８・・・絶縁体、
１６・・・電子部品。補正　昭５７．６．　９図面の簡単な説明を次のように補正する。明細書第６頁第３行のｒ７．８．　１４・・・基板」を
ｒ７．　８．　１６・・・基板」と補正する。　　　　
゛明細書第６頁第４行の「１６・・−電子部品」を「１
４　　　′・・・電子部品」と補正する。Fig. 1 is a perspective view showing a conventional example, Fig. 2 is a sectional view of the same, and Fig. 3 is a sectional view of the same.
The figure is a cross-sectional view of the conventional example in a state where lateral displacement has occurred, FIG. 4 is a perspective view showing the original embodiment of the present invention, FIG.
The figure is a sectional view showing another embodiment of the present invention, and FIG. 7 is the same sectional view showing a connected state. ? , 8. 14... Substrate, 7a, 8a,
15. 17... Connection terminal, 9.18... Insulator,
16...Electronic parts. Correction 1984.6. 9 The brief description of the drawing is amended as follows. r7.8 on page 6, line 3 of the specification. 14... board" r7. 8. 16...Substrate".
゛Replace “16...-electronic parts” on page 6, line 4 of the specification with “1”
4'...electronic parts.''

Claims

[Scope of utility model registration request]

In a connection structure in which connecting terminals are formed on a substrate and a substrate or an electronic component, etc., and the connecting terminals are overlapped and connected, the connecting terminal is connected between the substrate and the connecting terminal of either the substrate or the electronic component, etc. A connection structure characterized in that an insulator is formed which is thicker than the thickness of the insulator and thinner than the thickness when the connection terminals are overlapped and connected.