JPS58130272U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS58130272U JPS58130272U JP2685382U JP2685382U JPS58130272U JP S58130272 U JPS58130272 U JP S58130272U JP 2685382 U JP2685382 U JP 2685382U JP 2685382 U JP2685382 U JP 2685382U JP S58130272 U JPS58130272 U JP S58130272U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed board
- printed circuit
- periphery
- predetermined number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は、本考案に係るプリント基板の第１
の実施例を示す図面、第３図は第２の実施例を示す図面
１．第４図は第３図Ｉ−Ｉ線に沿う部分拡大断面図、−
第５図は第２の実施例に係るプリント基板に半導体装置
を半田付けした状態を示す部分拡大断面図、第６図は第
２の実施例に係るプリント基板を切断した時の状態を示
す拡大断面図である。
Ａ・・・・・・プリント基板、Ｂ・・・・・・半導体装
置、Ｃ・・・・・・リード線、１・・・・・・接点、２
・・・・・・凸部、３・・・・・・リード部。
−−第３図 ７
−ノ
σσＪＪ
第６図
／′ヂ ／1 and 2 show the first part of the printed circuit board according to the present invention.
FIG. 3 is a drawing showing the second embodiment. FIG. 4 is a partially enlarged sectional view taken along line I-I in FIG.
FIG. 5 is a partially enlarged sectional view showing a state in which a semiconductor device is soldered to a printed circuit board according to the second embodiment, and FIG. 6 is an enlarged view showing a state when the printed circuit board according to the second embodiment is cut. FIG. A...Printed circuit board, B...semiconductor device, C...lead wire, 1...contact, 2
...Convex part, 3...Lead part. --Figure 3 7 -ノσσJJ Figure 6/'ji/
Claims (1)
ド線とそれぞれ接続する接点を形成し、周縁の一部に、
゛上記各接点とそれぞれ対応し、且つ電気的に接続され
たリード部を設けたことを特徴とするプリント基板。Contact points are formed on the surface of the printed circuit board to connect with each lead wire of a predetermined number of semiconductor devices, and a part of the periphery is
゛A printed circuit board characterized by being provided with lead portions corresponding to and electrically connected to each of the above-mentioned contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2685382U JPS58130272U (en) | 1982-02-25 | 1982-02-25 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2685382U JPS58130272U (en) | 1982-02-25 | 1982-02-25 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58130272U true JPS58130272U (en) | 1983-09-02 |
Family
ID=30038784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2685382U Pending JPS58130272U (en) | 1982-02-25 | 1982-02-25 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130272U (en) |
-
1982
- 1982-02-25 JP JP2685382U patent/JPS58130272U/en active Pending
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