JPS5796767A - Polishing device - Google Patents
Polishing deviceInfo
- Publication number
- JPS5796767A JPS5796767A JP55166710A JP16671080A JPS5796767A JP S5796767 A JPS5796767 A JP S5796767A JP 55166710 A JP55166710 A JP 55166710A JP 16671080 A JP16671080 A JP 16671080A JP S5796767 A JPS5796767 A JP S5796767A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- base plate
- seats
- plate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To prevent warping of work at the time of applying adhesive by providing cavities or penetration holes, to release excessive adhesive, to the base plate which holds work of thin plate by virtue of adhesive. CONSTITUTION:Seats 23 to stick wafers 2 on at equal intervals are located on the flat surface 22 of a disc type base plate 21. A number of penetration holes 24 are provided to the seat 23. Before wafers 2 are placed, the base plate 21 is put on a heating plate 32, heated, and paraffin is applied to the seats. On each seat a silicon wafer 2 is placed and then a pressing plate 36 is pressed down from above via a cushion 35. The subsequent cooling process establishes the adhesion of silicon wafers 2 to the seats 23. The base plate 21 is then mounted on a lapping machine where the wafers 2 are polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55166710A JPS5796767A (en) | 1980-11-28 | 1980-11-28 | Polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55166710A JPS5796767A (en) | 1980-11-28 | 1980-11-28 | Polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5796767A true JPS5796767A (en) | 1982-06-16 |
Family
ID=15836316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55166710A Pending JPS5796767A (en) | 1980-11-28 | 1980-11-28 | Polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5796767A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61100371A (en) * | 1984-10-23 | 1986-05-19 | Toshiba Ceramics Co Ltd | Wafer cambering method in time of polishing |
| JPS63180469A (en) * | 1987-01-19 | 1988-07-25 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for uniform pressing/bonding |
| JPH09166526A (en) * | 1995-12-14 | 1997-06-24 | Nec Corp | Preparation od sample for transmission type electron microscope |
| WO2001056742A1 (en) * | 2000-01-31 | 2001-08-09 | Shin-Etsu Handotai Co., Ltd. | Polishing device and method |
-
1980
- 1980-11-28 JP JP55166710A patent/JPS5796767A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61100371A (en) * | 1984-10-23 | 1986-05-19 | Toshiba Ceramics Co Ltd | Wafer cambering method in time of polishing |
| JPS63180469A (en) * | 1987-01-19 | 1988-07-25 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for uniform pressing/bonding |
| JPH09166526A (en) * | 1995-12-14 | 1997-06-24 | Nec Corp | Preparation od sample for transmission type electron microscope |
| WO2001056742A1 (en) * | 2000-01-31 | 2001-08-09 | Shin-Etsu Handotai Co., Ltd. | Polishing device and method |
| EP1614505A1 (en) * | 2000-01-31 | 2006-01-11 | Shin-Etsu Handotai Company Limited | Polishing device and method |
| KR100729022B1 (en) * | 2000-01-31 | 2007-06-14 | 신에쯔 한도타이 가부시키가이샤 | Polishing apparatus and method |
| US7513819B2 (en) | 2000-01-31 | 2009-04-07 | Shin-Eisu Handotai Co., Ltd | Polishing apparatus and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5964646A (en) | Grinding process and apparatus for planarizing sawed wafers | |
| GB1423490A (en) | Method of shaping semi conductor workpieces | |
| EP0870576A3 (en) | Polishing Apparatus | |
| EP0454362A3 (en) | Backing pad, method for precision surface machining thereof, and method for polishing semiconductor wafer by use of the backing pad | |
| JP2001353656A (en) | Stacked type polishing pad | |
| JPS5796767A (en) | Polishing device | |
| JPH081898B2 (en) | Wafer sticker | |
| GB1231416A (en) | ||
| JPS56140632A (en) | Method for giving strain to semiconductor wafer | |
| US3924361A (en) | Method of shaping semiconductor workpieces | |
| TW374039B (en) | Wafer processing apparatus | |
| US7156933B2 (en) | Configuration and method for mounting a backing film to a polish head | |
| JPS642857A (en) | Method and device for polishing wafer | |
| GB1505488A (en) | Cementing semiconductor discs to carrier plates | |
| GB2170042B (en) | Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base | |
| JPS5538024A (en) | Manufacturing of semiconductor device | |
| JPS6373638A (en) | Wafer bonding device | |
| JPS5548571A (en) | Machining equipment | |
| GB2193158A (en) | Applying heat-release transfers | |
| JPS639406Y2 (en) | ||
| JPS6464772A (en) | Tacky sheet for polishing | |
| JPS6464771A (en) | Method for polishing semiconductor wafer | |
| JPS63123645A (en) | Manufacture of semi-conductor device | |
| JPS57147241A (en) | Bonding method for crystal wafer | |
| JPS6319309B2 (en) |