[go: up one dir, main page]

JPS5780734A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5780734A
JPS5780734A JP15672280A JP15672280A JPS5780734A JP S5780734 A JPS5780734 A JP S5780734A JP 15672280 A JP15672280 A JP 15672280A JP 15672280 A JP15672280 A JP 15672280A JP S5780734 A JPS5780734 A JP S5780734A
Authority
JP
Japan
Prior art keywords
polysilicon
sio2
substrate
semiconductor device
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15672280A
Other languages
Japanese (ja)
Inventor
Junichi Matsunaga
Hiroshi Nozawa
Hisahiro Matsukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15672280A priority Critical patent/JPS5780734A/en
Publication of JPS5780734A publication Critical patent/JPS5780734A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To obtain a semiconductor device having preferable characteristics by selectively oxidizing P-adding polysilicon on an Si substrate, thereby forming an element isolating layer for remarkably short time. CONSTITUTION:An SiO2 2 and a polysilicon 3 are superposed on a P type Si substrate 1, an Si3N4 mask 4 is provided, and P 5 is added. Further, B ions are injected to form P<+> type channel stopper 6. Then, a thick interelement isolating SiO2 7 is formed by short oxidiation. Subsequently the mask 4 is removed, the polysilicon 3' is opened vertically by reactive sputter ion etching, and polysilicon 3'' remains at the overhang of the thick film 7. The SiO2 2 is removed, a gate oxidized film 8 is formed, and an MOSFET is completed by the ordinary method. According to this structure, the selective oxidation time can be remarkably shortened, the thermal influence to the Si substrate and the stress can be suppresed, thereby largely reducing the defects. Accordingly, defects in the depletion layer between the channel stopper and N<+> type layer can be reduced, thereby obtaining a semiconductor device of the prescribed characteristics.
JP15672280A 1980-11-07 1980-11-07 Manufacture of semiconductor device Pending JPS5780734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15672280A JPS5780734A (en) 1980-11-07 1980-11-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15672280A JPS5780734A (en) 1980-11-07 1980-11-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5780734A true JPS5780734A (en) 1982-05-20

Family

ID=15633899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15672280A Pending JPS5780734A (en) 1980-11-07 1980-11-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5780734A (en)

Similar Documents

Publication Publication Date Title
JPS56134757A (en) Complementary type mos semiconductor device and its manufacture
JPS56124270A (en) Manufacture of semiconductor device
JPS5780734A (en) Manufacture of semiconductor device
JPS5780733A (en) Manufacture of semiconductor device
JPS5780735A (en) Manufacture of semiconductor device
JPS56147466A (en) Semiconductor device
JPS5779642A (en) Manufacture of semiconductor device
JPS5538019A (en) Manufacturing of semiconductor device
JPS56125846A (en) Surface treatment of semiconductor
JPS56103445A (en) Production of semiconductor device
JPS56150860A (en) Manufacture of semiconductor memory device
JPS577153A (en) Preparation of semiconductor device
JPS57107050A (en) Manufacture of semiconductor device
JPS567482A (en) Manufacturing of semiconductor device
JPS56133844A (en) Semiconductor device
JPS5779644A (en) Manufacture of semiconductor device
JPS56115570A (en) Manufacture of semiconductor device
JPS5779641A (en) Manufacture of semiconductor device
JPS57115846A (en) Manufacture of semiconductor device
JPS5649573A (en) Semiconductor device
JPS5646571A (en) Manufacture of solid image pickup element
JPS5710949A (en) Manufacture of semiconductor device
JPS562670A (en) Manufacture of semiconductor memory device
JPS56134739A (en) Manufacture of semiconductor device
JPS5587479A (en) Insulated gate type field effect transistor