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JPS5731151A - Automatic continuous treating device for semiconductor substrate - Google Patents

Automatic continuous treating device for semiconductor substrate

Info

Publication number
JPS5731151A
JPS5731151A JP10642780A JP10642780A JPS5731151A JP S5731151 A JPS5731151 A JP S5731151A JP 10642780 A JP10642780 A JP 10642780A JP 10642780 A JP10642780 A JP 10642780A JP S5731151 A JPS5731151 A JP S5731151A
Authority
JP
Japan
Prior art keywords
substrates
vapor bath
semiconductor substrate
juxtaposing
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10642780A
Other languages
Japanese (ja)
Inventor
Terumi Rokushiya
Tatsumi Suganuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10642780A priority Critical patent/JPS5731151A/en
Publication of JPS5731151A publication Critical patent/JPS5731151A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To contrive mass production of substrates through continuous treatment at a fixed speed, by consecutively connecting a vapor bath for a surface reforming agent and a resist coating unit to a scribing device for a semiconductor substrate. CONSTITUTION:A vapor bath 10 containing organic chlorasilane or hexamethyldisilazan 13 is provided by juxtaposing with a scribing device for cleaning. The doors 15, 15' of the container move up and down in synchronization with sequential sending of semiconductor substrates, and the substrates pass through slits 14, 14'. A conveyor belt 16 is made of stainless steel wire and intermittently driven. High temperatures are not requested owing to the vapor bath, and the substrates cleaned in a short period are coated with resists by juxtaposed resist coating device. Each of the devices has the same sending speed, therefore any buffer for absorbing speed difference is absolutely unnecessary, and the vapor bath can perform treatment in an extremely short period and at a normal temperature or low temperature at about 50 deg.C. Therefore, a series of treatment facilitates can be obtained by juxtaposing other devices.
JP10642780A 1980-08-04 1980-08-04 Automatic continuous treating device for semiconductor substrate Pending JPS5731151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10642780A JPS5731151A (en) 1980-08-04 1980-08-04 Automatic continuous treating device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10642780A JPS5731151A (en) 1980-08-04 1980-08-04 Automatic continuous treating device for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5731151A true JPS5731151A (en) 1982-02-19

Family

ID=14433353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10642780A Pending JPS5731151A (en) 1980-08-04 1980-08-04 Automatic continuous treating device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5731151A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175122A (en) * 1983-03-23 1984-10-03 Nec Corp Before-coating processing device for semiconductor wafer
JPS6425535A (en) * 1987-07-22 1989-01-27 Matsushita Electronics Corp Treatment of substrate for forming resist film
JPH03119740U (en) * 1990-03-19 1991-12-10
KR101388504B1 (en) * 2007-07-27 2014-04-23 주식회사 케이씨텍 Cleaning apparatus for substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130890A (en) * 1974-09-10 1976-03-16 Japan Synthetic Rubber Co Ltd Ketsushosei 1 22 horiputajen no seizoho
JPS5413777A (en) * 1977-07-01 1979-02-01 Nec Corp Photo resist coater of semiconductor wafers
JPS5487477A (en) * 1977-12-23 1979-07-11 Kokusai Electric Co Ltd Device for etching and stripping semiconductor wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130890A (en) * 1974-09-10 1976-03-16 Japan Synthetic Rubber Co Ltd Ketsushosei 1 22 horiputajen no seizoho
JPS5413777A (en) * 1977-07-01 1979-02-01 Nec Corp Photo resist coater of semiconductor wafers
JPS5487477A (en) * 1977-12-23 1979-07-11 Kokusai Electric Co Ltd Device for etching and stripping semiconductor wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175122A (en) * 1983-03-23 1984-10-03 Nec Corp Before-coating processing device for semiconductor wafer
JPS6355860B2 (en) * 1983-03-23 1988-11-04 Nippon Electric Co
JPS6425535A (en) * 1987-07-22 1989-01-27 Matsushita Electronics Corp Treatment of substrate for forming resist film
JPH03119740U (en) * 1990-03-19 1991-12-10
KR101388504B1 (en) * 2007-07-27 2014-04-23 주식회사 케이씨텍 Cleaning apparatus for substrate

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