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JPS57207571A - Wafer holding mechanism of resist coating device - Google Patents

Wafer holding mechanism of resist coating device

Info

Publication number
JPS57207571A
JPS57207571A JP9232781A JP9232781A JPS57207571A JP S57207571 A JPS57207571 A JP S57207571A JP 9232781 A JP9232781 A JP 9232781A JP 9232781 A JP9232781 A JP 9232781A JP S57207571 A JPS57207571 A JP S57207571A
Authority
JP
Japan
Prior art keywords
wafer
holding
claws
turning
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9232781A
Other languages
Japanese (ja)
Inventor
Tsutomu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9232781A priority Critical patent/JPS57207571A/en
Publication of JPS57207571A publication Critical patent/JPS57207571A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To enable sure holding of a wafer so as to withstand quick acceleration by making the center of the wafer coincide with the rotating axis by a holding claw and holding the wafer to restrict turning of the wafer due to rotation.
CONSTITUTION: A wafer releasing device A is operated to turn holding claws 14a, 14b. After inserting a wafer 1 to a specified position, operation of the device A is stopped and the wafer 1 is held by three claws 14a, 14b, 14b by force of a tension spring 16. As the holding claw 14a is in contact with the orientation flat surface of the wafer 1, the center of the wafer 1 coincides easily with the rotation axis BC. When a rotation axis 11 is turned under this condition, holding claws 14a, 14b are subjected to turning force in the direction of arrows due to centrifugal force as they are pivotted to fulcrum pins below the center of gravity M allowing free turning. Thus, the claws hold the wafer 1 firmly, and turning of holding claws 14a, 14b is restricted by a stopper 17.
COPYRIGHT: (C)1982,JPO&Japio
JP9232781A 1981-06-17 1981-06-17 Wafer holding mechanism of resist coating device Pending JPS57207571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9232781A JPS57207571A (en) 1981-06-17 1981-06-17 Wafer holding mechanism of resist coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9232781A JPS57207571A (en) 1981-06-17 1981-06-17 Wafer holding mechanism of resist coating device

Publications (1)

Publication Number Publication Date
JPS57207571A true JPS57207571A (en) 1982-12-20

Family

ID=14051282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9232781A Pending JPS57207571A (en) 1981-06-17 1981-06-17 Wafer holding mechanism of resist coating device

Country Status (1)

Country Link
JP (1) JPS57207571A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057132U (en) * 1983-09-28 1985-04-20 株式会社日立製作所 Wafer gripping device
JPS60141130U (en) * 1984-02-28 1985-09-18 テル相模株式会社 plasma CVD
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
JPH02189949A (en) * 1989-01-18 1990-07-25 Tokyo Electron Ltd Transfer equipment
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057132U (en) * 1983-09-28 1985-04-20 株式会社日立製作所 Wafer gripping device
JPS60141130U (en) * 1984-02-28 1985-09-18 テル相模株式会社 plasma CVD
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
JPH02189949A (en) * 1989-01-18 1990-07-25 Tokyo Electron Ltd Transfer equipment
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader

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