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JPS57166062A - Gate controlled rectifier - Google Patents

Gate controlled rectifier

Info

Publication number
JPS57166062A
JPS57166062A JP56050313A JP5031381A JPS57166062A JP S57166062 A JPS57166062 A JP S57166062A JP 56050313 A JP56050313 A JP 56050313A JP 5031381 A JP5031381 A JP 5031381A JP S57166062 A JPS57166062 A JP S57166062A
Authority
JP
Japan
Prior art keywords
gate
board
gate controlled
piled
arms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56050313A
Other languages
Japanese (ja)
Other versions
JPS6230702B2 (en
Inventor
Hideaki Shizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp, Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Corp
Priority to JP56050313A priority Critical patent/JPS57166062A/en
Publication of JPS57166062A publication Critical patent/JPS57166062A/en
Publication of JPS6230702B2 publication Critical patent/JPS6230702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To realize an improved performance and simplified construction by a method wherein a case serving as a wind tunnel is formed wherein gate printed boards are used as side walls to shorten the distance between a gate controlled rectifying device and a gate printed board. CONSTITUTION:Gate controlled recrifier devices 1 and cooling fins 2 therefor are piled one upon another for the formation of a three phase bridge, wherein arms 14 of the U, V, and W phases are also piled with insulating seats 15 inserted between the arms 14, and they all are fastened by fitting metals 16 provided at the both ends. Connected to the both sides of a stack 17 installed on an insulator mounting board 4 is a closing board 18 with its width narrower than that of the mounting board 4 for the formation, together with gate print boards 10 inserted in the fixing parts 24, of a casing with an opening at its top and bottom ends serving as a wind tunnel. The distance between devices 1 and printed boards 10 is shortened, thereby realizing miniaturization and reduction of necessary components.
JP56050313A 1981-04-03 1981-04-03 Gate controlled rectifier Granted JPS57166062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56050313A JPS57166062A (en) 1981-04-03 1981-04-03 Gate controlled rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56050313A JPS57166062A (en) 1981-04-03 1981-04-03 Gate controlled rectifier

Publications (2)

Publication Number Publication Date
JPS57166062A true JPS57166062A (en) 1982-10-13
JPS6230702B2 JPS6230702B2 (en) 1987-07-03

Family

ID=12855397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56050313A Granted JPS57166062A (en) 1981-04-03 1981-04-03 Gate controlled rectifier

Country Status (1)

Country Link
JP (1) JPS57166062A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080956A (en) * 2008-09-08 2010-04-08 Converteam Technology Ltd Stack assembly mounting semiconductor device
EP3018709A1 (en) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Power converter
WO2022175748A1 (en) * 2021-02-18 2022-08-25 Abb Schweiz Ag Press-pack semiconductor fixtures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080956A (en) * 2008-09-08 2010-04-08 Converteam Technology Ltd Stack assembly mounting semiconductor device
EP3018709A1 (en) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Power converter
WO2022175748A1 (en) * 2021-02-18 2022-08-25 Abb Schweiz Ag Press-pack semiconductor fixtures
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Also Published As

Publication number Publication date
JPS6230702B2 (en) 1987-07-03

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