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JPS57155761A - Electronic component part - Google Patents

Electronic component part

Info

Publication number
JPS57155761A
JPS57155761A JP4034181A JP4034181A JPS57155761A JP S57155761 A JPS57155761 A JP S57155761A JP 4034181 A JP4034181 A JP 4034181A JP 4034181 A JP4034181 A JP 4034181A JP S57155761 A JPS57155761 A JP S57155761A
Authority
JP
Japan
Prior art keywords
lead
package
staged
electronic component
top end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4034181A
Other languages
Japanese (ja)
Inventor
Kazuo Shimizu
Takeo Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4034181A priority Critical patent/JPS57155761A/en
Publication of JPS57155761A publication Critical patent/JPS57155761A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate fitting to a mounting substrate with accurate positioning, by extending the projection tapered further at the top end of a plurality of staged leads projected from a package part toward the lower part. CONSTITUTION:A plurality of leads 2 are projected on the both sides of the package part 5 of a dual-in-line type IC part 1 and bent down. The lead at the joint of the package 5 has thick width to form the staged lead 3 on the narrower part continuous thereto. The narrower lead 4 is tapered with the projection 7 at the top end. Thus, the mounting substrate can be easily inserted into fitting holes for positioning.
JP4034181A 1981-03-23 1981-03-23 Electronic component part Pending JPS57155761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4034181A JPS57155761A (en) 1981-03-23 1981-03-23 Electronic component part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4034181A JPS57155761A (en) 1981-03-23 1981-03-23 Electronic component part

Publications (1)

Publication Number Publication Date
JPS57155761A true JPS57155761A (en) 1982-09-25

Family

ID=12577920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4034181A Pending JPS57155761A (en) 1981-03-23 1981-03-23 Electronic component part

Country Status (1)

Country Link
JP (1) JPS57155761A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202000007411A1 (en) * 2020-04-07 2021-10-07 St Microelectronics Srl Leadframe for semiconductor products
US20220157699A1 (en) * 2019-03-18 2022-05-19 Ampleon Netherlands B.V. Electronic Molded Package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333574A (en) * 1976-09-10 1978-03-29 Hitachi Ltd Semiconductor integrated circuit package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333574A (en) * 1976-09-10 1978-03-29 Hitachi Ltd Semiconductor integrated circuit package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220157699A1 (en) * 2019-03-18 2022-05-19 Ampleon Netherlands B.V. Electronic Molded Package
US12087678B2 (en) * 2019-03-18 2024-09-10 Ampleon Netherlands B.V. Electronic molded package
IT202000007411A1 (en) * 2020-04-07 2021-10-07 St Microelectronics Srl Leadframe for semiconductor products

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