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JPS57167665A - Soldering method for spare lead of circuit part - Google Patents

Soldering method for spare lead of circuit part

Info

Publication number
JPS57167665A
JPS57167665A JP56052360A JP5236081A JPS57167665A JP S57167665 A JPS57167665 A JP S57167665A JP 56052360 A JP56052360 A JP 56052360A JP 5236081 A JP5236081 A JP 5236081A JP S57167665 A JPS57167665 A JP S57167665A
Authority
JP
Japan
Prior art keywords
solder
circuit part
powdery
adhered
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56052360A
Other languages
Japanese (ja)
Inventor
Tsuguyuki Murakami
Masahiro Suzuki
Masaji Takizawa
Eiji Fujita
Hiroshi Touchi
Takao Miyazawa
Yoshihisa Nagasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56052360A priority Critical patent/JPS57167665A/en
Publication of JPS57167665A publication Critical patent/JPS57167665A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent both generation of solder bridge between leads and sticking of splash and excessive solder by a method wherein powdery solder is used for the soldering. CONSTITUTION:The powdery solder 8 is dropped from a nozzle 7 and adhered on the outer circumference of a roller 6 which is being rotated in the direction shown by the arrow P in the diagram, and a circuit part 2 is shifted in the direction shown by the arrow Q while the lead 3, whereon flux was adhered in advance, is contacted to the roller 6. As a result, the powdery solder 8 is adhered on the back side of the lead 3. In this instance, as the solder is in powdery form, there generates no gridge or splash when the soldering is performed.
JP56052360A 1981-04-09 1981-04-09 Soldering method for spare lead of circuit part Pending JPS57167665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052360A JPS57167665A (en) 1981-04-09 1981-04-09 Soldering method for spare lead of circuit part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052360A JPS57167665A (en) 1981-04-09 1981-04-09 Soldering method for spare lead of circuit part

Publications (1)

Publication Number Publication Date
JPS57167665A true JPS57167665A (en) 1982-10-15

Family

ID=12912633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052360A Pending JPS57167665A (en) 1981-04-09 1981-04-09 Soldering method for spare lead of circuit part

Country Status (1)

Country Link
JP (1) JPS57167665A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63148669A (en) * 1986-12-12 1988-06-21 Fuji Plant Kogyo Kk Solder cladding for lead frame
JPS63266896A (en) * 1987-04-23 1988-11-02 Asahi Chem Res Lab Ltd Bonding of electronic component
JPH03244186A (en) * 1990-02-21 1991-10-30 Fujitsu Ltd How to bond electronic components to printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63148669A (en) * 1986-12-12 1988-06-21 Fuji Plant Kogyo Kk Solder cladding for lead frame
JPS63266896A (en) * 1987-04-23 1988-11-02 Asahi Chem Res Lab Ltd Bonding of electronic component
JPH03244186A (en) * 1990-02-21 1991-10-30 Fujitsu Ltd How to bond electronic components to printed circuit boards

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