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JPS5735331A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5735331A
JPS5735331A JP11060380A JP11060380A JPS5735331A JP S5735331 A JPS5735331 A JP S5735331A JP 11060380 A JP11060380 A JP 11060380A JP 11060380 A JP11060380 A JP 11060380A JP S5735331 A JPS5735331 A JP S5735331A
Authority
JP
Japan
Prior art keywords
lead conductor
semiconductor chip
bump
neck
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11060380A
Other languages
Japanese (ja)
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11060380A priority Critical patent/JPS5735331A/en
Publication of JPS5735331A publication Critical patent/JPS5735331A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a gang-bonding method which prevents a semiconductor chip and a lead conductor from short circuit, by a method wherein a neck is provided between a bump of the lead conductor and the edge of the chip so that the lead conductor can easily be bent upward. CONSTITUTION:A lead conductor 3 is bonded to a bump 8 on a semiconductor chip 4 and a neck 10 is provided between the bump 8 and the edge of the semiconductor chip 4. When the semiconductor chip 4 is pushed up or the lead conductor 3 is pushed down, the lead conductor 3 is easily bent upward and the distance between the semiconductor chip 4 and the lead conductor 3 can be made far enough. The effect of the bending up of the lead conductor 3 is large especially when the width w of the neck 10 is less than 80% of the original width W of the lead conductor 3.
JP11060380A 1980-08-12 1980-08-12 Semiconductor device Pending JPS5735331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11060380A JPS5735331A (en) 1980-08-12 1980-08-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11060380A JPS5735331A (en) 1980-08-12 1980-08-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5735331A true JPS5735331A (en) 1982-02-25

Family

ID=14540024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11060380A Pending JPS5735331A (en) 1980-08-12 1980-08-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5735331A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169239U (en) * 1983-04-27 1984-11-13 愛知車輛株式会社 Traveling speed control device for self-propelled aerial work vehicles
JPS62181633U (en) * 1986-05-02 1987-11-18
JPH0243749A (en) * 1988-08-04 1990-02-14 Seiko Epson Corp Semiconductor device and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169239U (en) * 1983-04-27 1984-11-13 愛知車輛株式会社 Traveling speed control device for self-propelled aerial work vehicles
JPS647064Y2 (en) * 1983-04-27 1989-02-23
JPS62181633U (en) * 1986-05-02 1987-11-18
JPH0243749A (en) * 1988-08-04 1990-02-14 Seiko Epson Corp Semiconductor device and its manufacturing method

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