JPS57160189A - Semiconductor luminous device incorporated with photodetector - Google Patents
Semiconductor luminous device incorporated with photodetectorInfo
- Publication number
- JPS57160189A JPS57160189A JP4554681A JP4554681A JPS57160189A JP S57160189 A JPS57160189 A JP S57160189A JP 4554681 A JP4554681 A JP 4554681A JP 4554681 A JP4554681 A JP 4554681A JP S57160189 A JPS57160189 A JP S57160189A
- Authority
- JP
- Japan
- Prior art keywords
- emitting device
- light emitting
- laser diode
- photo detector
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
PURPOSE:To contrive the reduction of assembly cost, noise prevention and the facilitation of the control of received light quantity, by forming a light emitting device and photo detector in laminated structure so that the light receiving surface of the photodetector becomes parallel with the direction of luminous radiation from the semiconductor light emitting device. CONSTITUTION:A laser diode 3 as the light emitting device and photodiode 4 as the photo detector are positioned on the same main surface of a heat sink 2. As the result, the light receiving surface of the photo detector becomes parallel with the direction of luminous radiation from the light emitting device. In this case, the P-N junction surface of the laser diode and that of the photo diode are in parallel relation based on the main surface of the heat sink. A part of luminous radiation from the side surface of the laser diode makes oblique incidence on the upper surface of the photo diode at an angle theta to detect the output by the excitation of the P-N junction provided shallowly on the surface layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4554681A JPS57160189A (en) | 1981-03-30 | 1981-03-30 | Semiconductor luminous device incorporated with photodetector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4554681A JPS57160189A (en) | 1981-03-30 | 1981-03-30 | Semiconductor luminous device incorporated with photodetector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57160189A true JPS57160189A (en) | 1982-10-02 |
Family
ID=12722355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4554681A Pending JPS57160189A (en) | 1981-03-30 | 1981-03-30 | Semiconductor luminous device incorporated with photodetector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57160189A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198885A (en) * | 1984-03-23 | 1985-10-08 | Toshiba Corp | Integrated semiconductor laser |
JPS61159786A (en) * | 1985-01-07 | 1986-07-19 | Matsushita Electric Ind Co Ltd | Semiconductor laser device |
JPS61159788A (en) * | 1985-01-07 | 1986-07-19 | Matsushita Electric Ind Co Ltd | Semiconductor laser array device |
JPS62109383A (en) * | 1985-11-07 | 1987-05-20 | Matsushita Electric Ind Co Ltd | Optical integrated circuit device |
JPH01196885A (en) * | 1988-02-01 | 1989-08-08 | Fujitsu Ltd | semiconductor light emitting device |
JPH0284358U (en) * | 1988-12-19 | 1990-06-29 | ||
JPH0284359U (en) * | 1988-12-19 | 1990-06-29 | ||
JP2007324265A (en) * | 2006-05-31 | 2007-12-13 | Fuji Xerox Co Ltd | Electronic component, laser device, optical writing device and image forming apparatus |
JP2008027972A (en) * | 2006-07-18 | 2008-02-07 | Fuji Xerox Co Ltd | Electronic part, laser device, optical writing device, and image forming apparatus |
US7807954B2 (en) | 2007-03-29 | 2010-10-05 | Eudyna Devices Inc. | Light receiving element with upper and side light receiving faces and an optical semiconductor module with the light receiving element and a light emitting element mounted on the same mounting unit |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS543660U (en) * | 1977-06-13 | 1979-01-11 | ||
JPS5474688A (en) * | 1977-11-26 | 1979-06-14 | Sharp Corp | Manufacture for photo semiconducdtor device with monitor |
-
1981
- 1981-03-30 JP JP4554681A patent/JPS57160189A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS543660U (en) * | 1977-06-13 | 1979-01-11 | ||
JPS5474688A (en) * | 1977-11-26 | 1979-06-14 | Sharp Corp | Manufacture for photo semiconducdtor device with monitor |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198885A (en) * | 1984-03-23 | 1985-10-08 | Toshiba Corp | Integrated semiconductor laser |
JPS61159786A (en) * | 1985-01-07 | 1986-07-19 | Matsushita Electric Ind Co Ltd | Semiconductor laser device |
JPS61159788A (en) * | 1985-01-07 | 1986-07-19 | Matsushita Electric Ind Co Ltd | Semiconductor laser array device |
JPS62109383A (en) * | 1985-11-07 | 1987-05-20 | Matsushita Electric Ind Co Ltd | Optical integrated circuit device |
JPH01196885A (en) * | 1988-02-01 | 1989-08-08 | Fujitsu Ltd | semiconductor light emitting device |
JPH0284358U (en) * | 1988-12-19 | 1990-06-29 | ||
JPH0284359U (en) * | 1988-12-19 | 1990-06-29 | ||
JP2007324265A (en) * | 2006-05-31 | 2007-12-13 | Fuji Xerox Co Ltd | Electronic component, laser device, optical writing device and image forming apparatus |
US7671434B2 (en) | 2006-05-31 | 2010-03-02 | Fuji Xerox Co., Ltd. | Electronic component, laser device, optical writing device and image forming apparatus |
JP2008027972A (en) * | 2006-07-18 | 2008-02-07 | Fuji Xerox Co Ltd | Electronic part, laser device, optical writing device, and image forming apparatus |
US7807954B2 (en) | 2007-03-29 | 2010-10-05 | Eudyna Devices Inc. | Light receiving element with upper and side light receiving faces and an optical semiconductor module with the light receiving element and a light emitting element mounted on the same mounting unit |
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