JPS57153476A - Maufacture of field effect transistor - Google Patents
Maufacture of field effect transistorInfo
- Publication number
- JPS57153476A JPS57153476A JP56038468A JP3846881A JPS57153476A JP S57153476 A JPS57153476 A JP S57153476A JP 56038468 A JP56038468 A JP 56038468A JP 3846881 A JP3846881 A JP 3846881A JP S57153476 A JPS57153476 A JP S57153476A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- oxide film
- anode oxide
- gate electrode
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
Landscapes
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE:To facilitate close positioning of a gate electrode and an ohmic electrode by providing a metal gate electrode on a semiconductor crystal layer and forming a porous anode oxide film on the surface of the electrode and covering the entire surface of the a wafer with metal for the ohmic electrode thereby removing it at the same time with etching of the anode oxide film. CONSTITUTION:A messa-cut GaAs active layer 4 is formed on a high resistance GaAs layer 5 on a semi-insulative GaAs substrate 6 and Al31 of 0.5mm. thickness is evaporized. A gate electrode 33 is made by sputter etching Al using a resist mask 32 and is anodized by 2.5% oxalic acid to make a porous anode oxide film 34 on the surface of the electrode 33. Then AuGe/Ni35 for an ohmic electrode is vaporized over the entire surface of the wafer, and the metalic film 35 on the anode oxide film 34 is etched with fluoric acid buffer solution, and then a meassa region is covered with a resist and etched. By this method the distance between the electrode 1 and 36 is made equal to the thickness of Al anodized film 34 and is adjustable optionally preventing parasitic resistance in the region between electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56038468A JPS57153476A (en) | 1981-03-17 | 1981-03-17 | Maufacture of field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56038468A JPS57153476A (en) | 1981-03-17 | 1981-03-17 | Maufacture of field effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57153476A true JPS57153476A (en) | 1982-09-22 |
Family
ID=12526069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56038468A Pending JPS57153476A (en) | 1981-03-17 | 1981-03-17 | Maufacture of field effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57153476A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5248478A (en) * | 1975-10-16 | 1977-04-18 | Fujitsu Ltd | Process for production of semiconductor device |
-
1981
- 1981-03-17 JP JP56038468A patent/JPS57153476A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5248478A (en) * | 1975-10-16 | 1977-04-18 | Fujitsu Ltd | Process for production of semiconductor device |
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