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JPS57112062A - High density integrated circuit device - Google Patents

High density integrated circuit device

Info

Publication number
JPS57112062A
JPS57112062A JP56177772A JP17777281A JPS57112062A JP S57112062 A JPS57112062 A JP S57112062A JP 56177772 A JP56177772 A JP 56177772A JP 17777281 A JP17777281 A JP 17777281A JP S57112062 A JPS57112062 A JP S57112062A
Authority
JP
Japan
Prior art keywords
integrated circuit
high density
circuit device
density integrated
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56177772A
Other languages
English (en)
Inventor
Anri Mishieru Rur Jiyannpieeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANTERUNASHIYONARU PUURU RANFUORUMATEIKU SEE I I HANIIUERUBURU CO
Original Assignee
ANTERUNASHIYONARU PUURU RANFUORUMATEIKU SEE I I HANIIUERUBURU CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANTERUNASHIYONARU PUURU RANFUORUMATEIKU SEE I I HANIIUERUBURU CO filed Critical ANTERUNASHIYONARU PUURU RANFUORUMATEIKU SEE I I HANIIUERUBURU CO
Publication of JPS57112062A publication Critical patent/JPS57112062A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56177772A 1980-12-05 1981-11-05 High density integrated circuit device Pending JPS57112062A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8025859A FR2495834A1 (fr) 1980-12-05 1980-12-05 Dispositif a circuits integres de haute densite

Publications (1)

Publication Number Publication Date
JPS57112062A true JPS57112062A (en) 1982-07-12

Family

ID=9248717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177772A Pending JPS57112062A (en) 1980-12-05 1981-11-05 High density integrated circuit device

Country Status (6)

Country Link
JP (1) JPS57112062A (ja)
DE (1) DE3147932A1 (ja)
FR (1) FR2495834A1 (ja)
GB (1) GB2089120A (ja)
IT (1) IT1139896B (ja)
NL (1) NL8103882A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832445A (ja) * 1981-08-20 1983-02-25 Nec Corp 集積回路装置及びその製造方法
JPS58137229A (ja) * 1982-02-09 1983-08-15 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JPS58139445A (ja) * 1982-02-15 1983-08-18 Nec Corp 半導体集積回路装置
JPS58142545A (ja) * 1982-02-18 1983-08-24 Mitsubishi Electric Corp マスタスライス方式ゲ−トアレイ形半導体集積回路装置
JPS5954239A (ja) * 1982-09-22 1984-03-29 Toshiba Corp 半導体集積回路装置
JPS60142537A (ja) * 1983-12-29 1985-07-27 Sharp Corp 集積回路装置の製造方法
JPS60198749A (ja) * 1984-03-23 1985-10-08 Hitachi Comput Eng Corp Ltd 半導体集積回路装置
JPS6288337A (ja) * 1985-10-15 1987-04-22 Nec Corp 半導体集積回路装置
JPS63275141A (ja) * 1987-04-30 1988-11-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 個性化可能な半導体チップ

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154346B1 (en) * 1984-03-08 1991-09-18 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
JPS6289341A (ja) * 1985-10-15 1987-04-23 Mitsubishi Electric Corp マスタスライス方式大規模半導体集積回路装置の製造方法
JPS62261144A (ja) * 1986-05-07 1987-11-13 Mitsubishi Electric Corp 半導体集積回路
US5015600A (en) * 1990-01-25 1991-05-14 Northern Telecom Limited Method for making integrated circuits

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2212927A1 (de) * 1971-01-12 1972-10-19 Molekularelektronik Verfahren zur Gruppenintegration von integrierten Schaltungen unter Verbindungstechnik
US3981070A (en) * 1973-04-05 1976-09-21 Amdahl Corporation LSI chip construction and method
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
US4207556A (en) * 1976-12-14 1980-06-10 Nippon Telegraph And Telephone Public Corporation Programmable logic array arrangement
DE2823555A1 (de) * 1977-05-31 1978-12-07 Fujitsu Ltd Zellenfoermige integrierte schaltung

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832445A (ja) * 1981-08-20 1983-02-25 Nec Corp 集積回路装置及びその製造方法
JPH0114704B2 (ja) * 1982-02-09 1989-03-14 Nippon Telegraph & Telephone
JPS58137229A (ja) * 1982-02-09 1983-08-15 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JPS58139445A (ja) * 1982-02-15 1983-08-18 Nec Corp 半導体集積回路装置
JPH0250626B2 (ja) * 1982-02-15 1990-11-02 Nippon Electric Co
JPS58142545A (ja) * 1982-02-18 1983-08-24 Mitsubishi Electric Corp マスタスライス方式ゲ−トアレイ形半導体集積回路装置
JPH023549B2 (ja) * 1982-09-22 1990-01-24 Tokyo Shibaura Electric Co
JPS5954239A (ja) * 1982-09-22 1984-03-29 Toshiba Corp 半導体集積回路装置
JPS60142537A (ja) * 1983-12-29 1985-07-27 Sharp Corp 集積回路装置の製造方法
JPH0518264B2 (ja) * 1983-12-29 1993-03-11 Sharp Kk
JPS60198749A (ja) * 1984-03-23 1985-10-08 Hitachi Comput Eng Corp Ltd 半導体集積回路装置
JPS6288337A (ja) * 1985-10-15 1987-04-22 Nec Corp 半導体集積回路装置
JPH0588551B2 (ja) * 1985-10-15 1993-12-22 Nippon Electric Co
JPS63275141A (ja) * 1987-04-30 1988-11-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 個性化可能な半導体チップ

Also Published As

Publication number Publication date
FR2495834A1 (fr) 1982-06-11
NL8103882A (nl) 1982-07-01
DE3147932A1 (de) 1982-06-24
GB2089120A (en) 1982-06-16
IT1139896B (it) 1986-09-24
IT8125428A0 (it) 1981-12-03

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