JPS57108264A - Operating method for electrostatic adsorbing device - Google Patents
Operating method for electrostatic adsorbing deviceInfo
- Publication number
- JPS57108264A JPS57108264A JP18345880A JP18345880A JPS57108264A JP S57108264 A JPS57108264 A JP S57108264A JP 18345880 A JP18345880 A JP 18345880A JP 18345880 A JP18345880 A JP 18345880A JP S57108264 A JPS57108264 A JP S57108264A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adsorbed
- insulator
- electrodes
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To permit detection of an adsorbing and holding state of an object by measuring the change in the electrostatic capacity formed by an object to be adsorbed and electrodes in an electrostatic adsorbing device. CONSTITUTION:A pair of electrodes 13, 14 disposed flatly are insulated with an insulator 2, and, for example, a semiconductor wafer 11 is placed on the insulator 2. When about 1,000-5,000 voltage is applied from a DC power source 15, the wafer 11 contacts firmly with the insulator 12 and is adsorbed and held by this. When AC current is flowed at this time from an AC power source 16, electric current flows in inducing capacity between the wafer 11 and the electrodes 13, 14. The value of the capacity when the wafer 11 is accurately positioned and adsorbed is beforehand measured, and the reading of an ammeter 17 is observed, whereby whether the wafer 11 is accurately positioned, adsorbed and held or not is detected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18345880A JPS57108264A (en) | 1980-12-24 | 1980-12-24 | Operating method for electrostatic adsorbing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18345880A JPS57108264A (en) | 1980-12-24 | 1980-12-24 | Operating method for electrostatic adsorbing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57108264A true JPS57108264A (en) | 1982-07-06 |
JPS6311426B2 JPS6311426B2 (en) | 1988-03-14 |
Family
ID=16136125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18345880A Granted JPS57108264A (en) | 1980-12-24 | 1980-12-24 | Operating method for electrostatic adsorbing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57108264A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59129686A (en) * | 1983-01-10 | 1984-07-26 | 増田 閃一 | Electrostatic type minute body sucker |
JPS59129779A (en) * | 1983-01-13 | 1984-07-26 | Tokuda Seisakusho Ltd | Electrostatic chucking device of sputtering device |
JPS59129778A (en) * | 1983-01-13 | 1984-07-26 | Tokuda Seisakusho Ltd | Sputtering device |
US4848536A (en) * | 1987-03-31 | 1989-07-18 | Fujitsu Limited | Apparatus for transporting an electrically conductive wafer |
JP2008015435A (en) * | 2006-07-10 | 2008-01-24 | Ricoh Co Ltd | Image forming apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233828U (en) * | 1975-08-31 | 1977-03-10 | ||
JPS5279934A (en) * | 1975-12-26 | 1977-07-05 | Fuji Xerox Co Ltd | Contactless paper detector |
-
1980
- 1980-12-24 JP JP18345880A patent/JPS57108264A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233828U (en) * | 1975-08-31 | 1977-03-10 | ||
JPS5279934A (en) * | 1975-12-26 | 1977-07-05 | Fuji Xerox Co Ltd | Contactless paper detector |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59129686A (en) * | 1983-01-10 | 1984-07-26 | 増田 閃一 | Electrostatic type minute body sucker |
JPS59129779A (en) * | 1983-01-13 | 1984-07-26 | Tokuda Seisakusho Ltd | Electrostatic chucking device of sputtering device |
JPS59129778A (en) * | 1983-01-13 | 1984-07-26 | Tokuda Seisakusho Ltd | Sputtering device |
US4848536A (en) * | 1987-03-31 | 1989-07-18 | Fujitsu Limited | Apparatus for transporting an electrically conductive wafer |
JP2008015435A (en) * | 2006-07-10 | 2008-01-24 | Ricoh Co Ltd | Image forming apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6311426B2 (en) | 1988-03-14 |
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