JPS5629344A - Semiconductor integrated circuit device and manufacture thereof - Google Patents
Semiconductor integrated circuit device and manufacture thereofInfo
- Publication number
- JPS5629344A JPS5629344A JP10575279A JP10575279A JPS5629344A JP S5629344 A JPS5629344 A JP S5629344A JP 10575279 A JP10575279 A JP 10575279A JP 10575279 A JP10575279 A JP 10575279A JP S5629344 A JPS5629344 A JP S5629344A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- layer
- type
- polysilicon
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- 229920005591 polysilicon Polymers 0.000 abstract 3
- 239000012535 impurity Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a high speed semiconductor integrated circuit having high density by connecting a high resistance polysilicon layer directly to the semiconductor region of an MISFET. CONSTITUTION:A field oxide film 6 and a gate oxide film 5 are formed on a P type Si substrate 1, and an opening 7 is perforated at the oxide film 5. Polysilicon layers 28, 30 are selectively formed on the openings 7 and the film 5, N type impurity is introduced to form layers 8', 10, 3 and 4. Subsequently, O<+> or the like is selectively introduced into the N type layer 8' to form a high resistance layer 8a and a low resistance layer 8b. Thereafter, the entire surface is coated with an oxide film 11, openings 12, 13 are selectively formed thereat to form electrodes 14, 15 thereon. This configuration forms a resistance element body made of polysilicon connected directly to the N type layer of an MISFET to thereafter obtain a resistance element merely by introducing impurity and substance for lowering the conductivity thereof so as to easily enhance the density and operating speed as an entire device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54105752A JPS5814072B2 (en) | 1979-08-20 | 1979-08-20 | Semiconductor integrated circuit device and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54105752A JPS5814072B2 (en) | 1979-08-20 | 1979-08-20 | Semiconductor integrated circuit device and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5629344A true JPS5629344A (en) | 1981-03-24 |
JPS5814072B2 JPS5814072B2 (en) | 1983-03-17 |
Family
ID=14415963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54105752A Expired JPS5814072B2 (en) | 1979-08-20 | 1979-08-20 | Semiconductor integrated circuit device and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5814072B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5030588A (en) * | 1988-04-05 | 1991-07-09 | Seiko Instruments Inc. | Method of making semiconductor device with film resistor |
US5236851A (en) * | 1988-07-14 | 1993-08-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating semiconductor devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7172975B2 (en) | 2019-01-16 | 2022-11-16 | 信越化学工業株式会社 | Novel Onium Salt, Chemically Amplified Resist Composition, and Pattern Forming Method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128278A (en) * | 1975-04-30 | 1976-11-09 | Sony Corp | Integrated circuit with resistance element |
-
1979
- 1979-08-20 JP JP54105752A patent/JPS5814072B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128278A (en) * | 1975-04-30 | 1976-11-09 | Sony Corp | Integrated circuit with resistance element |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5030588A (en) * | 1988-04-05 | 1991-07-09 | Seiko Instruments Inc. | Method of making semiconductor device with film resistor |
US5236851A (en) * | 1988-07-14 | 1993-08-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
JPS5814072B2 (en) | 1983-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5688354A (en) | Semiconductor integrated circuit device | |
JPS5629344A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS5562771A (en) | Integrated circuit device | |
JPS54156483A (en) | Non-volatile semiconductor memory device | |
JPS51128278A (en) | Integrated circuit with resistance element | |
JPS56115557A (en) | Manufacture of semiconductor device | |
JPS55157241A (en) | Manufacture of semiconductor device | |
JPS54141585A (en) | Semiconductor integrated circuit device | |
JPS5768075A (en) | Manufacture of integrated circuit device | |
JPS5632757A (en) | Insulated gate type transistor and integrated circuit | |
JPS54102883A (en) | Manufacture for semiconductor device | |
JPS5513953A (en) | Complementary integrated circuit | |
JPS5664460A (en) | Semiconductor device | |
JPS54105979A (en) | Semiconductor device | |
JPS57128957A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS5642372A (en) | Manufacture of semiconductor device | |
JPS56147467A (en) | Cmos semiconductor device and manufacture thereof | |
JPS566464A (en) | Semiconductor device and manufacture thereof | |
JPS55108773A (en) | Insulating gate type field effect transistor | |
JPS5283073A (en) | Production of semiconductor device | |
JPS55143068A (en) | Insulated gate semiconductor device | |
JPS5490981A (en) | Semiconductor device | |
JPS55151365A (en) | Insulated gate type transistor and semiconductor integrated circuit | |
JPS5562760A (en) | Semiconductor device | |
JPS5629361A (en) | Manufacture of semiconductor integrated circuit |