JPS56158272A - Method and apparatus for joining building member - Google Patents
Method and apparatus for joining building memberInfo
- Publication number
- JPS56158272A JPS56158272A JP5939980A JP5939980A JPS56158272A JP S56158272 A JPS56158272 A JP S56158272A JP 5939980 A JP5939980 A JP 5939980A JP 5939980 A JP5939980 A JP 5939980A JP S56158272 A JPS56158272 A JP S56158272A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- plates
- rollers
- metallic
- plated layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 abstract 7
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
Abstract
PURPOSE: To perform soldering on the site simply in brazing metallic plate by forming a brazing plated layer at the joining part beforehand.
CONSTITUTION: In brazing metallic plates 1, 1, the seam part 18 of the metallic plates to be joined is plated beforehand with the brazing material. On the site, press- contacting is made from both sides of the seam part of the two plates with heating rollers 19, 19, and the metallic plates 1, 1 are brazed by melting the plated layer of the seam part through resistance heating the seam part 18 by applying voltage of 2W10V between the two rollers. Then, the brazed part is cooled by a cooling rollers 20 to complete brazing of the two metallic plate 1, 1. In case when a metallic plate 1' with a recess part is to be soldered to a pipe 14', brazing can be executed in the same manner as above-mentioned, forming a brazing metal plated layer on the joining surface of the two plates, and using the 1st and 2nd heating rollers 23, 21 and the cooling roller 22.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5939980A JPS56158272A (en) | 1980-05-07 | 1980-05-07 | Method and apparatus for joining building member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5939980A JPS56158272A (en) | 1980-05-07 | 1980-05-07 | Method and apparatus for joining building member |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56158272A true JPS56158272A (en) | 1981-12-05 |
JPS5733092B2 JPS5733092B2 (en) | 1982-07-15 |
Family
ID=13112158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5939980A Granted JPS56158272A (en) | 1980-05-07 | 1980-05-07 | Method and apparatus for joining building member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56158272A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5860873U (en) * | 1981-10-21 | 1983-04-23 | ソニー株式会社 | Wiring board connection device |
US20170274465A1 (en) * | 2014-09-09 | 2017-09-28 | Celltech Metals Inc. | Method of creating a bonded structure and apparatuses for same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103521870B (en) * | 2013-09-13 | 2015-07-22 | 浙江康盛股份有限公司 | Pipe brazing furnace of dislocation type hung arc power transmission groove wheel group |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4946690A (en) * | 1972-07-13 | 1974-05-04 | ||
JPS553191U (en) * | 1979-04-26 | 1980-01-10 |
-
1980
- 1980-05-07 JP JP5939980A patent/JPS56158272A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4946690A (en) * | 1972-07-13 | 1974-05-04 | ||
JPS553191U (en) * | 1979-04-26 | 1980-01-10 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5860873U (en) * | 1981-10-21 | 1983-04-23 | ソニー株式会社 | Wiring board connection device |
US20170274465A1 (en) * | 2014-09-09 | 2017-09-28 | Celltech Metals Inc. | Method of creating a bonded structure and apparatuses for same |
US10112248B2 (en) * | 2014-09-09 | 2018-10-30 | Celltech Metals, Inc. | Method of creating a bonded structure and apparatuses for same |
Also Published As
Publication number | Publication date |
---|---|
JPS5733092B2 (en) | 1982-07-15 |
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