JPS56146891A - Selective plating method - Google Patents
Selective plating methodInfo
- Publication number
- JPS56146891A JPS56146891A JP4975680A JP4975680A JPS56146891A JP S56146891 A JPS56146891 A JP S56146891A JP 4975680 A JP4975680 A JP 4975680A JP 4975680 A JP4975680 A JP 4975680A JP S56146891 A JPS56146891 A JP S56146891A
- Authority
- JP
- Japan
- Prior art keywords
- marker
- layer
- pattern
- case
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To plate only on the required area of a semiconductor plate surface by making a photoresist layer thick and the line width of a marker finer, and melt- sticking the resist sandwiching the marker line part at the time of heat treatment.
CONSTITUTION: A photomask 23 is superposed on an Si substrate 21 having beforehand been coated with a photoresist layer 22 in such a manner that said marker pattern 24 aligns to the marker 25 visible through the resist layer 22 on the substrate 21, after which ultraviolet rays 26 are irradiated. The ultraviolet rays 26 are shut off by the electrode pattern 27 and marker pattern 24 provided to the mask 23 and expose the resist layer 22 of other parts, thereby making the same insoluble to solvents. In this case, the thickness of the regist layer 22 is made several times that in an ordinary case so that the line width of the pattern 24 is made fairly finer than that of an ordinary case. As a result of development, windows 28, 29 are produced in the resist layer 22, but if heat treatment is applied in succession for the purpose of solidification, the window 28 of the marker part is melt-stuck by the swelling of the layer 22 on both sides, and in the case of forming bump electrodes 30 by electroplating, the plating on the marker 25 is prevented.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55049756A JPS6024189B2 (en) | 1980-04-15 | 1980-04-15 | Selective plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55049756A JPS6024189B2 (en) | 1980-04-15 | 1980-04-15 | Selective plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56146891A true JPS56146891A (en) | 1981-11-14 |
| JPS6024189B2 JPS6024189B2 (en) | 1985-06-11 |
Family
ID=12840025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55049756A Expired JPS6024189B2 (en) | 1980-04-15 | 1980-04-15 | Selective plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6024189B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054456A (en) * | 1983-09-05 | 1985-03-28 | Oki Electric Ind Co Ltd | Forming method of bump electrode |
-
1980
- 1980-04-15 JP JP55049756A patent/JPS6024189B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054456A (en) * | 1983-09-05 | 1985-03-28 | Oki Electric Ind Co Ltd | Forming method of bump electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6024189B2 (en) | 1985-06-11 |
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