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JPS56101755A - Device for feeding semiconductor element piece by piece - Google Patents

Device for feeding semiconductor element piece by piece

Info

Publication number
JPS56101755A
JPS56101755A JP505580A JP505580A JPS56101755A JP S56101755 A JPS56101755 A JP S56101755A JP 505580 A JP505580 A JP 505580A JP 505580 A JP505580 A JP 505580A JP S56101755 A JPS56101755 A JP S56101755A
Authority
JP
Japan
Prior art keywords
piece
spring
stopper
semiconductor element
consecutive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP505580A
Other languages
Japanese (ja)
Other versions
JPS5933977B2 (en
Inventor
Masaaki Yasunaga
Jiro Tsuchishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP55005055A priority Critical patent/JPS5933977B2/en
Publication of JPS56101755A publication Critical patent/JPS56101755A/en
Publication of JPS5933977B2 publication Critical patent/JPS5933977B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To feed accurately the semiconductor element piece by piece by providing the first stopper spring making contact with the second element consecutive to the semiconductor element stopped by the stopper of an oblique chute and the second stopper spring making contact with the element consecutive to the second element. CONSTITUTION:The semiconductor element dropped by its own weight leftwardly of the oblique chute 1 is received by the stopper 6, the first stopper spring 12 formed of elastic member is brought into contact with the side surface of the second element 3, and the second stopper spring 15 formed of elastic material is brought into contact with the side surface of the element 5 consecutive to the second element. When the element is newly dropped, a protective plate 17 protects the second spring 15. Thus, the spring 12 urges the element 3 downwardly and the spring 15 urges the element 5 upwardly, and accordingly they can release the interference between the elements, and feed the element accurately piece by piece.
JP55005055A 1980-01-19 1980-01-19 Individual feeding device for semiconductor devices Expired JPS5933977B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55005055A JPS5933977B2 (en) 1980-01-19 1980-01-19 Individual feeding device for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55005055A JPS5933977B2 (en) 1980-01-19 1980-01-19 Individual feeding device for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS56101755A true JPS56101755A (en) 1981-08-14
JPS5933977B2 JPS5933977B2 (en) 1984-08-20

Family

ID=11600706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55005055A Expired JPS5933977B2 (en) 1980-01-19 1980-01-19 Individual feeding device for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5933977B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184800A (en) * 1981-12-17 1983-10-28 三菱電機株式会社 Part conveying device
JPS59113776U (en) * 1983-01-21 1984-08-01 株式会社アドバンテスト IC escape mechanism
JPS6112238U (en) * 1984-06-25 1986-01-24 株式会社アドバンテスト IC intermittent feeding mechanism of IC testing equipment
US6156078A (en) * 1991-09-16 2000-12-05 Sgs-Thomson Microelectronics Sdn. Bhd. Testing and finishing apparatus for integrated circuit package units

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184800A (en) * 1981-12-17 1983-10-28 三菱電機株式会社 Part conveying device
JPS59113776U (en) * 1983-01-21 1984-08-01 株式会社アドバンテスト IC escape mechanism
JPS6112238U (en) * 1984-06-25 1986-01-24 株式会社アドバンテスト IC intermittent feeding mechanism of IC testing equipment
US6156078A (en) * 1991-09-16 2000-12-05 Sgs-Thomson Microelectronics Sdn. Bhd. Testing and finishing apparatus for integrated circuit package units

Also Published As

Publication number Publication date
JPS5933977B2 (en) 1984-08-20

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