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JPS52106678A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS52106678A
JPS52106678A JP2329976A JP2329976A JPS52106678A JP S52106678 A JPS52106678 A JP S52106678A JP 2329976 A JP2329976 A JP 2329976A JP 2329976 A JP2329976 A JP 2329976A JP S52106678 A JPS52106678 A JP S52106678A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
sealed type
resin sealed
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2329976A
Other languages
Japanese (ja)
Other versions
JPS5942457B2 (en
Inventor
Masao Yamaguchi
Fumiga Imai
Kazuo Kanbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2329976A priority Critical patent/JPS5942457B2/en
Publication of JPS52106678A publication Critical patent/JPS52106678A/en
Publication of JPS5942457B2 publication Critical patent/JPS5942457B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a pellet of a sealed type device sealed with resin from cracking by coating elastic material at a part of the side part on the surface of a header in a semiconductor pellet.
JP2329976A 1976-03-05 1976-03-05 Resin-encapsulated semiconductor device Expired JPS5942457B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2329976A JPS5942457B2 (en) 1976-03-05 1976-03-05 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2329976A JPS5942457B2 (en) 1976-03-05 1976-03-05 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS52106678A true JPS52106678A (en) 1977-09-07
JPS5942457B2 JPS5942457B2 (en) 1984-10-15

Family

ID=12106711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2329976A Expired JPS5942457B2 (en) 1976-03-05 1976-03-05 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS5942457B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125542U (en) * 1981-01-30 1982-08-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125542U (en) * 1981-01-30 1982-08-05

Also Published As

Publication number Publication date
JPS5942457B2 (en) 1984-10-15

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