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JPS5441467B2 - - Google Patents

Info

Publication number
JPS5441467B2
JPS5441467B2 JP11314576A JP11314576A JPS5441467B2 JP S5441467 B2 JPS5441467 B2 JP S5441467B2 JP 11314576 A JP11314576 A JP 11314576A JP 11314576 A JP11314576 A JP 11314576A JP S5441467 B2 JPS5441467 B2 JP S5441467B2
Authority
JP
Japan
Prior art keywords
providing
pelets
collet
vibrating
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11314576A
Other languages
Japanese (ja)
Other versions
JPS5339069A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11314576A priority Critical patent/JPS5339069A/en
Publication of JPS5339069A publication Critical patent/JPS5339069A/en
Publication of JPS5441467B2 publication Critical patent/JPS5441467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enhance pellet supply position accuracy and facilitate automatic wire bonding by beforehand providing plural grooves for permitting easy movement of pelets on the surface of a position correcting plate to be placed therein with semiconductor pellets thereby providing a mechanism of vibrating collet.
JP11314576A 1976-09-22 1976-09-22 Pellet supplying mechanism Granted JPS5339069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11314576A JPS5339069A (en) 1976-09-22 1976-09-22 Pellet supplying mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11314576A JPS5339069A (en) 1976-09-22 1976-09-22 Pellet supplying mechanism

Publications (2)

Publication Number Publication Date
JPS5339069A JPS5339069A (en) 1978-04-10
JPS5441467B2 true JPS5441467B2 (en) 1979-12-08

Family

ID=14604701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11314576A Granted JPS5339069A (en) 1976-09-22 1976-09-22 Pellet supplying mechanism

Country Status (1)

Country Link
JP (1) JPS5339069A (en)

Also Published As

Publication number Publication date
JPS5339069A (en) 1978-04-10

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