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JPS558191A - Elastic surface wave device - Google Patents

Elastic surface wave device

Info

Publication number
JPS558191A
JPS558191A JP8240678A JP8240678A JPS558191A JP S558191 A JPS558191 A JP S558191A JP 8240678 A JP8240678 A JP 8240678A JP 8240678 A JP8240678 A JP 8240678A JP S558191 A JPS558191 A JP S558191A
Authority
JP
Japan
Prior art keywords
film
surface wave
wave device
electrode
elastic surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240678A
Other languages
English (en)
Inventor
Katsuaki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8240678A priority Critical patent/JPS558191A/ja
Publication of JPS558191A publication Critical patent/JPS558191A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP8240678A 1978-07-05 1978-07-05 Elastic surface wave device Pending JPS558191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240678A JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240678A JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Publications (1)

Publication Number Publication Date
JPS558191A true JPS558191A (en) 1980-01-21

Family

ID=13773703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240678A Pending JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Country Status (1)

Country Link
JP (1) JPS558191A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002300000A (ja) * 2001-03-30 2002-10-11 Fujitsu Media Device Kk 弾性表面波装置
EP1540736A2 (en) * 2002-08-28 2005-06-15 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
WO2014135379A1 (de) * 2013-03-06 2014-09-12 Epcos Ag Mikroakustisches bauelement und verfahren zur herstellung

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002300000A (ja) * 2001-03-30 2002-10-11 Fujitsu Media Device Kk 弾性表面波装置
US7251873B2 (en) 2001-03-30 2007-08-07 Fujitsu Media Devices Limited Method of manufacturing surface acoustic wave device
EP1540736A2 (en) * 2002-08-28 2005-06-15 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
EP1540736A4 (en) * 2002-08-28 2006-03-08 Silicon Light Machines Corp SEAL AT PLATE LEVEL FOR SILICON-FREE DEVICES
WO2014135379A1 (de) * 2013-03-06 2014-09-12 Epcos Ag Mikroakustisches bauelement und verfahren zur herstellung
US9991873B2 (en) 2013-03-06 2018-06-05 Snaptrack, Inc. Microacoustic component and method for the production thereof

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