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JPS558191A - Elastic surface wave device - Google Patents

Elastic surface wave device

Info

Publication number
JPS558191A
JPS558191A JP8240678A JP8240678A JPS558191A JP S558191 A JPS558191 A JP S558191A JP 8240678 A JP8240678 A JP 8240678A JP 8240678 A JP8240678 A JP 8240678A JP S558191 A JPS558191 A JP S558191A
Authority
JP
Japan
Prior art keywords
film
surface wave
wave device
electrode
elastic surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240678A
Other languages
Japanese (ja)
Inventor
Katsuaki Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8240678A priority Critical patent/JPS558191A/en
Publication of JPS558191A publication Critical patent/JPS558191A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To obtain an elastic surface wave device which features a low cost and good shield state by providing the conductor layers on the input/output electrode and on the surface wave propagation path via the gap layer. CONSTITUTION:Input/output electrode 12 is formed on piezoelectric substrate 11 via the conductive metal such as the Cr-Au layer, and ZnO film 13 of about 2mu is fored over electrode 12. Then conductive film 14 of Al or the like is coated about 2mu thick over film 13. Film 14 is formed large in size to film 13 in the horizontal length direction and small in the vertical direction each. Film 13 is dissolved immediately in the etching solution but other meals are not dissolved virtually, thus forming gap layer 15. After this, each electrode is connected by Al or the like and through the wire bonding method and then sealed up with mold resin 16 to complete the elastic surface wave device. In this case, film 14 is connected to the earth to secure the shielding function, thus enhancing the characteristics at the high frequency. Furthermore, the cost can be reduced owing to the sealing with the mold resin.
JP8240678A 1978-07-05 1978-07-05 Elastic surface wave device Pending JPS558191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240678A JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240678A JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Publications (1)

Publication Number Publication Date
JPS558191A true JPS558191A (en) 1980-01-21

Family

ID=13773703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240678A Pending JPS558191A (en) 1978-07-05 1978-07-05 Elastic surface wave device

Country Status (1)

Country Link
JP (1) JPS558191A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002300000A (en) * 2001-03-30 2002-10-11 Fujitsu Media Device Kk Surface acoustic wave device
EP1540736A2 (en) * 2002-08-28 2005-06-15 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
WO2014135379A1 (en) * 2013-03-06 2014-09-12 Epcos Ag Microacoustic component and method for the production thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002300000A (en) * 2001-03-30 2002-10-11 Fujitsu Media Device Kk Surface acoustic wave device
US7251873B2 (en) 2001-03-30 2007-08-07 Fujitsu Media Devices Limited Method of manufacturing surface acoustic wave device
EP1540736A2 (en) * 2002-08-28 2005-06-15 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
EP1540736A4 (en) * 2002-08-28 2006-03-08 Silicon Light Machines Corp Wafer-level seal for non-silicon-based devices
WO2014135379A1 (en) * 2013-03-06 2014-09-12 Epcos Ag Microacoustic component and method for the production thereof
US9991873B2 (en) 2013-03-06 2018-06-05 Snaptrack, Inc. Microacoustic component and method for the production thereof

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