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JPS5562591A - Memory card - Google Patents

Memory card

Info

Publication number
JPS5562591A
JPS5562591A JP13251978A JP13251978A JPS5562591A JP S5562591 A JPS5562591 A JP S5562591A JP 13251978 A JP13251978 A JP 13251978A JP 13251978 A JP13251978 A JP 13251978A JP S5562591 A JPS5562591 A JP S5562591A
Authority
JP
Japan
Prior art keywords
circuit
cavity
main body
face
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13251978A
Other languages
Japanese (ja)
Inventor
Manabu Nao
Mitsuru Takayasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13251978A priority Critical patent/JPS5562591A/en
Publication of JPS5562591A publication Critical patent/JPS5562591A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To prevent break of a card and break and disconnection of a circuit and a conductor by storing and holding the electronic memory circuit so that most of the outside circumference face of this circuit may keep a gap for the inside face of a cavity where this circuit is stored. CONSTITUTION:Memory card main body 1 has a two-layer lamination structure consisting of upper substrate 2 and lower substrate 3. In this main body 1, cavity 7 is formed between concave 6 formed on substrate 2 and substrate 3, and electronic memory circuit 8 is stored and held in this cavity. Circuit 8 has the bottom face fixed to lower substrate 3 by adhesive, and the upper face and the side face of circuit 8 have a gap for the inside face of cavity 7. Then, main body 1 is provided with connection terminal 9, and one end of this terminal is connected to circuit 8 by conductor 10, and the other end extends to the side of main body 1. If a reinforcement material is provided in this cavity 7 or a protection material for circuit 8 is filled up in this cavity 7, it is advantageous furthermore.
JP13251978A 1978-10-30 1978-10-30 Memory card Pending JPS5562591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13251978A JPS5562591A (en) 1978-10-30 1978-10-30 Memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13251978A JPS5562591A (en) 1978-10-30 1978-10-30 Memory card

Publications (1)

Publication Number Publication Date
JPS5562591A true JPS5562591A (en) 1980-05-12

Family

ID=15083209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13251978A Pending JPS5562591A (en) 1978-10-30 1978-10-30 Memory card

Country Status (1)

Country Link
JP (1) JPS5562591A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752977A (en) * 1980-08-07 1982-03-29 Gao Ges Automation Org Identifying card and method of producing same
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org
JPS57169880A (en) * 1981-03-24 1982-10-19 Gao Ges Automation Org Identification card
JPS57210494A (en) * 1981-06-10 1982-12-24 Gao Ges Automation Org Identification card with ic module and manufacture thereof
JPS58121187A (en) * 1982-01-08 1983-07-19 Akihiro Fujimura Cassette type ic
JPS5983285A (en) * 1982-11-04 1984-05-14 Toppan Printing Co Ltd Production of card
JPS5990184A (en) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Data card and manufacture thereof
JPS5999938U (en) * 1982-12-22 1984-07-06 エス・ア−ル・デ−株式会社 Container for discrimination
JPS6175986A (en) * 1984-09-21 1986-04-18 Tokyo Jiki Insatsu Kk Loading medium for integrated circuit element
US4764803A (en) * 1986-03-17 1988-08-16 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card
JPH039867U (en) * 1990-06-08 1991-01-30
CN105088521A (en) * 2015-08-11 2015-11-25 福建省百凯弹性织造有限公司 Integrally-formed rope containing ribbon

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283132A (en) * 1975-12-31 1977-07-11 Cii Portable card for electric signal processor and method of fabricating same
JPS5446447A (en) * 1977-08-26 1979-04-12 Cii Portable data carrier for storing and processing data

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283132A (en) * 1975-12-31 1977-07-11 Cii Portable card for electric signal processor and method of fabricating same
JPS5446447A (en) * 1977-08-26 1979-04-12 Cii Portable data carrier for storing and processing data

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754356A (en) * 1980-08-05 1982-03-31 Gao Ges Automation Org
JPH0158657B2 (en) * 1980-08-05 1989-12-13 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS6342313B2 (en) * 1980-08-07 1988-08-23 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS5752977A (en) * 1980-08-07 1982-03-29 Gao Ges Automation Org Identifying card and method of producing same
JPS57169880A (en) * 1981-03-24 1982-10-19 Gao Ges Automation Org Identification card
JPH0143355B2 (en) * 1981-03-24 1989-09-20 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS57210494A (en) * 1981-06-10 1982-12-24 Gao Ges Automation Org Identification card with ic module and manufacture thereof
JPS6342314B2 (en) * 1981-06-10 1988-08-23 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS58121187A (en) * 1982-01-08 1983-07-19 Akihiro Fujimura Cassette type ic
JPS5990184A (en) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Data card and manufacture thereof
JPS5983285A (en) * 1982-11-04 1984-05-14 Toppan Printing Co Ltd Production of card
JPS5999938U (en) * 1982-12-22 1984-07-06 エス・ア−ル・デ−株式会社 Container for discrimination
JPS6175986A (en) * 1984-09-21 1986-04-18 Tokyo Jiki Insatsu Kk Loading medium for integrated circuit element
US4764803A (en) * 1986-03-17 1988-08-16 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card
US5031026A (en) * 1986-03-17 1991-07-09 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card
JPH039867U (en) * 1990-06-08 1991-01-30
CN105088521A (en) * 2015-08-11 2015-11-25 福建省百凯弹性织造有限公司 Integrally-formed rope containing ribbon

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