JPS5487474A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5487474A JPS5487474A JP15585677A JP15585677A JPS5487474A JP S5487474 A JPS5487474 A JP S5487474A JP 15585677 A JP15585677 A JP 15585677A JP 15585677 A JP15585677 A JP 15585677A JP S5487474 A JPS5487474 A JP S5487474A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- mount
- sealing
- key
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To enable a device to withstand a gread number of times of attaching into and detaching from a key hole with the deformation of a lead prevented, by providing an eternal lead terminal into a sealing resin body without protruding it out of the sealing resin body and by making one part of the lead surface exposed in contact with the key-hole contact of the electronic key.
CONSTITUTION: At the tip in the center of the frame of element mount lead 3 connected to the frame of the lead frame, mount 6 for mounting a semiconductor element is formed. Leads 1 to 5 connected at respective one-side terminals to the frame in parallel to lead 3 are elongated near mount part 6, with curved parts made partially, and made into contacts 1' to 5' while being protruded to the top surface or reverse surface of the frame. In addition, sealing-resin reinforcing metal part 7 is also formed facing to mount part 6. The frame is constituted in this way, an element is fixed to mount part 6, and electrodes are connected to respective leads; and then, only contacts 1' to 5' are exposed, resin sealing is done, and unneeded parts of the frame is removed by being cut off.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15585677A JPS5487474A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15585677A JPS5487474A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5487474A true JPS5487474A (en) | 1979-07-11 |
Family
ID=15614985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15585677A Pending JPS5487474A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5487474A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS57178352A (en) * | 1981-04-28 | 1982-11-02 | Matsushita Electronics Corp | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
| JPS5853155U (en) * | 1981-06-04 | 1983-04-11 | ティーディーケイ株式会社 | IC package |
| JPS6020152U (en) * | 1983-07-19 | 1985-02-12 | 富士通株式会社 | Connection structure of hybrid integrated circuit |
| US5466857A (en) * | 1994-08-10 | 1995-11-14 | The Standard Oil Company | Process for reduction of waste material during manufacture of acrylonitrile |
| US6323545B1 (en) | 1997-10-07 | 2001-11-27 | Mitsubishi Denkikabushiki Kaisha | Semiconductor device |
-
1977
- 1977-12-23 JP JP15585677A patent/JPS5487474A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS6220705B2 (en) * | 1981-03-05 | 1987-05-08 | Matsushita Electronics Corp | |
| JPS57178352A (en) * | 1981-04-28 | 1982-11-02 | Matsushita Electronics Corp | Manufacture of resin sealing type semiconductor device and lead frame employed thereon |
| JPS6244815B2 (en) * | 1981-04-28 | 1987-09-22 | Matsushita Electronics Corp | |
| JPS5853155U (en) * | 1981-06-04 | 1983-04-11 | ティーディーケイ株式会社 | IC package |
| JPS6020152U (en) * | 1983-07-19 | 1985-02-12 | 富士通株式会社 | Connection structure of hybrid integrated circuit |
| US5466857A (en) * | 1994-08-10 | 1995-11-14 | The Standard Oil Company | Process for reduction of waste material during manufacture of acrylonitrile |
| US6323545B1 (en) | 1997-10-07 | 2001-11-27 | Mitsubishi Denkikabushiki Kaisha | Semiconductor device |
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