JPS6175986A - Loading medium for integrated circuit element - Google Patents

Abstract

PURPOSE:To prevent the mechanical breakdown of the IC (integrated circuit) elements within a card by securing an approximately discontinuous state between the base part including the IC elements and other parts and therefore absorbing the external force by the discontinuous part. CONSTITUTION:The IC elements 7 are arrayed on a substrate 2, and pierced slits 3-5 and 6 are provided around the elements 7. In such a constitution, no external force is applied to the elements 7 even in case of a card and the substrate 2 are bent by the external force. This prevents the mechanical breakdown of the IC7.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a medium in which an integrated circuit element is mounted or embedded in a card-like or sheet-like substrate, and has recording, reading, calculation control, or a combination of these functions. .

A card-like or sheet-like medium equipped with or embedded with conventional technology integrated circuit cables is about to be used as an audio signal or a 1hl ($! double signal turnout) J medium (for example, Utility Model Publication No. 58-138164).

In addition, there are signs that it will be used as a card for administrative labor saving, station ministry, financial administrative labor saving, personal computers, etc. Regarding these, please refer to
491, JP 53-37332, JP 5G-196
65, JP-A-56-26451, JP-A-57-4817
5, Japanese Patent Application Publication No. 57-210494, waiting 11tl 1982-3
8651 and JP-A-57-29498, etc., the basic structure, GI manufacturing method, etc. are described.

Generally, card-like or sheet-like substrates are manually attached to terminal blocks, writing/reading blocks, input/output blocks, etc.; ! There are many opportunities to receive external forces such as surface bending and bending. This is near the intersection O of the center line x-x'i.

In other words, the center area of a card or sheet-like substrate is generally susceptible to bending or bending forces.6 Since integrated circuits are solid-state devices and have almost no flexibility, the outer ribs are particularly susceptible to bending or bending forces. If this becomes large, breakage, wire breakage, poor contact with the lead wire, etc. are likely to occur.

In order to eliminate this drawback, a proposal was made in Japanese Patent Publication No. 53-29260, and cards equipped with integrated circuits currently being prototyped or on the market have integrated circuits located almost in the position proposed by this proposal.

In other words, as explained in Fig. 6, the integrated circuit is installed at a position away from the intersection O of the center lines Y-Y' and xx' in the width direction and longitudinal direction of the card body, that is, at an eccentric position rLr of the card body. This is to avoid the effects of curvature and bending of the base body itself as much as possible.

Problems with the Prior Art α However, there are many cases in which a magnetic recording medium or an optical recording medium is attached to a medium containing an integrated circuit. This is why optical recording systems are being used in some areas. Both optical and magnetic recordings are generally applied in stripes to cards or sheets.

Under these circumstances, integrated circuit records (memory)
, input/output, logic performance, and magnetic or optical media recording and reproducing capabilities are installed on the same medium to create a terminal for integrated circuits, a terminal for magnetic recording and reproducing, or an optical recording and reproducing function. A medium (including card, sheet, or disk) that can be shared by terminals is required.

+ii As in the prior art described in J, in FIG. 6, the integrated circuit cable 7 (input/output terminal 7 for connecting to the input/output terminal of the external terminal component) is placed, for example, at the eccentric position of the card-like base as shown in the figure. Then, depending on its position, it may overlap with the magnetic stripe (or optical recording medium stripe) m shown by the dotted line. When magnetic stripes are installed parallel to the top and bottom edges of the card as indicated by m and m' in FIG.
The integrated circuit element must be attached at or near the middle four lines of y', or at or near the center of the card.

Problems to be Solved by the Invention: Even if the integrated circuit element is located at or near the center of the base body, the integrated circuit element attached to or embedded in the base body is not affected by external forces such as bending or bending the base body. protection that can eliminate or reduce its effects when ! It provides a groove structure.

To summarize the purpose of the present invention in terms of means for solving the problem, even if an integrated circuit cord is mounted or buried in or near the center of a card (or (nine sheets, disk), etc.), This provides a supplement to the medium substrate that prevents the circuit elements from being destroyed, disconnected, poor contact, etc. due to the effects of bending, bending, etc. due to external forces of the card.Of course, by implementing the structure of the present invention, the substrate There is no doubt that the same effect can be obtained at any position other than the center.In other words, the accumulation jt
By making the base part including the J-path element almost discontinuous with the other 66 parts, the force applied to the base body from the outside will be blocked or weakened at the discontinuous part, causing damage or other damage to the integrated circuit element. This will prevent any inconvenience from occurring.

Embodiments and Effects of the Present Invention The embodiments described in this explanation are generally JIS or ISO standard bank cards, Frenot cards, etc.
We will discuss using hard vinyl chloride resin specified in the standard or similar to it as a card base, but it goes without saying that the same effect can be achieved with synthetic FJRJ boards, metal, paper, synthetic paper, etc. as the base. Nor. Further, in the cross-sectional views of the explanatory drawings, the thickness of the base body is shown enlarged compared to the base area for the sake of explanation.

Example 1 @1 In the figure, a is an explanatory view of the card seen from the top, and b is a cross-sectional view of the Y-Y' section. m and m' are stripes to which a magnetic recording/reproducing function is added.

2 is the base, a point, 197 is an integrated circuit element, and its terminal is 8
is shown. Its position is 1 prefecture direction x-x', user direction Y
-Y', ie, the center O of the card base, is located at a position where the center of the integrated circuit element is approximately located, ie, at a location where external forces are most affected. Techniques for mounting or embedding these integrated circuit elements, terminals, etc. in the card base 2 are common techniques known to those skilled in the art, and therefore detailed description thereof will be omitted here. 3. 4. 5 and 6 are #I holes penetrating the base 2, and in the case of punching out the outer circumference of the card, they may be punched out at the same time, or 8! It may be formed by mechanical cutting or laser beam processing. This through hole (slit) depends on the processing method used to create it, but in the case of laser beam processing, for example, if the through hole (slit) is processed at a distance of about 2u or more from the outer edge (dotted line) of the integrated circuit element, it may damage the integrated circuit element. Never. In this embodiment, the through-hole has a long oval shape, but its width is the same as that used for general bank cards and Frenot cards. (thickness 0.7-〇, theoretical layer) If it is a hard vinyl chloride base, tt
Taking as an example the case where it is bent in the longitudinal direction as shown in Fig. S2, it is sufficient to have fr O, 2a+z or more. The same applies to the width direction.

When such a through hole is made, as shown in Figure 2,
To explain it in terms of the cross section of the card in the user's direction, the card has F, F'
, F'' is applied as shown by the arrow, the card bends as shown in the figure, and the bending force applied to the integrated circuit element is blocked or reduced by the through hole 3.4. Therefore, destruction of the element and other inconveniences can be largely avoided.

Cards with magnetic stripes, e.g. JISB9560
According to the provisions of Section 4.2.5, curling (card force warping) is specified as a maximum of 2IIff, and in fact, the card reading fee of a general terminal is curling in the longitudinal H direction of a magnetic card (measuring the warping of a magnetic card is Place the convex part of the embossed character on the card on a flat surface so that it does not touch the small side.)
When the value is 4ug or more, reading I) becomes unstable. However, there are some that can be read even if there is curling of about 7u, so in reality, curling of about 7zz does not pose a problem in practical use as long as it does not destroy the element or cause any inconvenience.

The effect of bending force on an integrated circuit element varies depending on the ratio of the element's size (area, length, and width) to the card's size (area, length, and width), even if the degree of bending is the same. Considering the standard, the area of the circuit element portion (point m at 7 in FIG. 1a) is generally designed to be around 30 x 30 zy, so the present invention can sufficiently prevent most of the damage and inconvenience of the element.

In addition, as shown in PISi figure d, for example, the oval shaped through hole 3
3.4 is formed by a series of approximately circular through holes like 3'.
．． 5 and 6 may be formed instead.

Note that 13 in FIG. 1a is the part that connects the integrated circuit cord part to the substrate, but 12 is a practical part in order to reduce the influence of bending on the element as much as possible. It is preferable that the area be as small as possible within a range that can maintain specific mechanical strength.

Embodiment 2 FIG. 1C shows the through hole 3.
4.5 and 6 are replaced by non-through holes or grooves to prevent or reduce the bending forces of the substrate on the integrated circuit element. In the same figure, grooves 9 and 10 are used instead of through holes 3, grooves 10 and V10' are used instead of 4, grooves 11 and 11' are used instead of 5, and grooves 12 and 12'' are used instead of 6. It is machined on the front and back.Of course, instead of holes, it is a series of blank holes spaced apart (
(Fig. 1 d1: similar) may be used.

For the purpose of the present invention, it is preferable that the gap p (C in the figure) between the upper and lower grooves and the bottom surface is as small as H as long as the structural strength is acceptable.

Even if this groove is on one side, the effect can be increased depending on its depth.

Example 3 In FIG. 3, 2 is a hard vinyl chloride laminate or J'lt layer substrate similar to that described in Examples 1 and 2;
The thickness is generally 1.5-2.
It is used up to the 081st position. Inside the dot 7 is an integrated circuit element located approximately at the center of the card-like base body, and at 8 is an input/output terminal of the integrated circuit element formed on the surface of the base body 7' continuous with 2. 14 is a width 1.0 formed on the base 2 by punching, cutting, laser beam processing, etc.
A circle z of about zy ('ζ, part of which is interrupted at the 13' part, and the base 2 is integrated here. 13
゛The width direction center line Y-Y', the length direction center line ax-x
When viewed from point O of ', it lies on a line that makes an angle of approximately 45 degrees with Y-Y'.

In this embodiment, this position has the least adverse effect on the integrated circuit element with regard to curvature in the width direction or the height direction.

Embodiment 4 FIG. 4 shows a method different from the previous embodiment in which the S effect due to curvature of the substrate applied to the integrated circuit element can be avoided as much as possible. In the same figure, e is the plan view, and f is Y-Y.
'It is a sectional view of the force direction. Reference numeral 16 denotes a base body on which an integrated circuit element is mounted or embedded.

The integrated circuit elements are shown as circles indicated by dotted lines 19.

Reference numeral 17 indicates input/output terminals of the element 19 formed on the surface of the base 16.

18 is an elastic wire such as piano wire or phosphor blue wire, and if the thickness of the base body 15 is in the range of 0.7 to 2.01 mm, and the base body 16 is also approximately the same, the diameter is 0.2 IK ~
A value of 0.61 is preferred. This wire can be made of not only metal or bonded wire, but also polymeric resins such as saran, polyester, nylon, and other compatible materials.

According to this embodiment, the base body 16 is connected to the base body 15 by wires 18 as shown. Reference numeral 20 denotes an open space between the outer edge of the base 16 (circular in this example) and the inner periphery of the base 15 (circular in this example), and can take an arbitrary opening 14 ['' if necessary. In the example, it is straight, but in the same figure
As shown in Fig. 18, it is possible to make the integrated circuit into a coil shape or an S-shape so that the base body 16 can move relative to the base body 15 with some degree of freedom. The adverse effects on the device as described above are further reduced. The method of bonding the substrate 16 to the card-like substrate 15 using a 18" or 18" elastic wire is a technical matter commonly employed by those skilled in the art, and therefore will not be described in detail here.

In general, when creating the base 16 on which the integrated circuit element exists, the wire 18 or 18゛ can be fixed to the base 16 at the same time as forming terminals if a molding method is used. Automatic production in which 16 integral blocks are prefabricated and fitted into circular holes in the base body 15 can be adapted.

Embodiment 5 FIG. 5 is a modification of FIG. 4. The figure is a perspective view for assembly, and 1 is a partial view of the integrated circuit element portion and its surroundings. 21 is a card-like base in which a circular through hole 26 of the shape shown in the figure is formed.
In the figure, four fitting holes such as 2 are formed. Base body 2
Reference numeral 4 denotes a base body to which an integrated circuit element is attached via VC, and is made of substantially the same material as the base body 21, such as a hard vinyl chloride plate. Reference numeral 25 represents input/output terminals of the integrated circuit element.

Reference numeral 23 is a fitting piece processed into a shape that can be fitted into a fitting hole formed in the base body 21, and is formed integrally with the base body 24. The fitting hole 22 and the fitting piece 23 described above are fitted as shown in FIG. A through hole as shown in 26 is formed.With this through hole, the same effect as described in Example 4 can be obtained from the card-like base 2.
] It is possible to reduce the influence of the curve in the width direction or the longitudinal direction on the base body 24 containing the integrated circuit element, thereby eliminating the failure rate such as destruction of the element or disconnection.

Effects of the Invention A+f As described in the explanation of the JET embodiment and elsewhere, when integrated circuit elements are mounted or embedded in a card-shaped, sheet-shaped, or disk-shaped substrate (board), the longitudinal direction of the substrate Alternatively, when the solid-state integrated circuit element is bent or bent in the width direction, it often causes damage to the solid-state integrated circuit element, such as breakage or disconnection. In the present invention, the part where the integrated circuit element is present is cut out from a part of the base (&), and is indirectly integrated with the base as described in the embodiment, so that the influence of the above-mentioned curving and bending does not affect the circuit element. It has the effect of eliminating or reducing the impact, and is extremely effective in practical applications.

In the description of the present invention, all the terminals of the integrated circuit element are placed on the base including the integrated circuit element, but the terminals may also be formed on the end face of the card-like base, the periphery, or any other part by extending with wiring. Of course it's a good thing.

[Brief explanation of the drawing]

FIG. 1 is a plan view, a sectional view taken along the Y-Y' line, and an enlarged view of a through hole portion, showing a first embodiment of the present invention. FIG. 2 is an explanatory view showing the state when the medium of the present invention is bent in the longitudinal direction. FIG. 3 is a plan view showing the third embodiment of the present invention, and FIG. 4 is a front view Y-Y showing the fourth embodiment of the present invention.
FIG. 2 is a cross-sectional view of the ' line and a partial view of the inter-substrate bonding portion. No. 5121 is of the present invention! A perspective view showing an embodiment of JS5 and a partial view of an integrated circuit portion and its surroundings. FIG. JS6 is a schematic diagram illustrating an example of a conventional integrated circuit mounting medium. Patent applicant Tokyo Magnetic Printing Co., Ltd. Representative Hiraga Mouth part O 1 Figure m, m'--1 Magnetic stripe O 2 Figure O 3 Figure X' 14----- F"l-shaped groove O 4 Figure +9.-1 ---Guowei mouth closing code 20, ----One interval o 5 Fig.

Claims (8)

[Claims] (1) An integrated circuit device mounting medium in which an integrated circuit device is mounted or embedded in a card-like or sheet-like substrate, characterized in that one or more integrated circuit device protection structures are provided in the base portion around the integrated circuit device. integrated circuit element mounting medium. (2) The integrated circuit device mounting medium according to claim 1, wherein the protective structure is a through hole extending in the thickness direction of the substrate. (3) The integrated circuit device mounting medium according to claim 1, wherein the protective structure is a hole or groove that does not penetrate the base. (4) The integrated circuit device mounting medium according to claim 3, wherein the groove is a continuous groove that surrounds the integrated circuit device with a portion remaining. (5) In the protective structure, the base body containing the integrated circuit element and the base body not containing the integrated circuit element are separated, and a connecting member is provided between the two base bodies. integrated circuit element mounting medium. (6) The integrated circuit device mounting medium according to claim 5, wherein the coupling member is an elastic body. (7) In the protective structure, a fitting piece is provided on the substrate containing the integrated circuit element, a fitting hole is provided on the substrate not containing the integrated circuit element, and the protective structure is formed by fitting both substrates. An integrated circuit device mounting medium according to claim 1, characterized in that: (8) The integrated circuit element mounting medium according to claim 7, wherein the fitting is performed by adhesive or heat fusion.