JPS5518426A - Heat-resistant flexible electronic parts - Google Patents
Heat-resistant flexible electronic partsInfo
- Publication number
- JPS5518426A JPS5518426A JP9093478A JP9093478A JPS5518426A JP S5518426 A JPS5518426 A JP S5518426A JP 9093478 A JP9093478 A JP 9093478A JP 9093478 A JP9093478 A JP 9093478A JP S5518426 A JPS5518426 A JP S5518426A
- Authority
- JP
- Japan
- Prior art keywords
- formulas
- flexible electronic
- heat
- resistant flexible
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To manufacture a heat-resistant flexible electronic part having excellent heat resistance, electrical insulation and adhesivity, by laminating a polyimide film and a copper foil with a specific adhesive.
CONSTITUTION: A polyimide film is laminated to a copper foil using an adhesive composed of a polyamide-imide of formulas IWIII [Ar is a difunctional residue of formulas IVWVII (R is H, halogen, alkyl; X is O, S, sulfonyl, carbonyl, carboxyl, methylene, dimethylmethylene); Ar' is a difunctional residue of formulas VIIIWX; n is a positive integer], having a reduced viscosity of 0.2W1.5.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093478A JPS5518426A (en) | 1978-07-27 | 1978-07-27 | Heat-resistant flexible electronic parts |
US06/010,290 US4377652A (en) | 1978-02-17 | 1979-02-08 | Polyamide-imide compositions and articles for electrical use prepared therefrom |
GB08210524A GB2103633B (en) | 1978-04-28 | 1979-02-09 | Polyamide-imide compositions for imparting electrical properties and articles produced using the compositions |
GB7904632A GB2016487B (en) | 1978-02-17 | 1979-02-09 | Articles for electrical use and compositions useful therefor |
DE2905857A DE2905857C2 (en) | 1978-02-17 | 1979-02-15 | Polyamide-imide compositions with granular materials and use of such compositions for electrical components, circuit boards and insulating substrates |
NLAANVRAGE7901256,A NL181739C (en) | 1978-02-17 | 1979-02-16 | COMPOSITION BASED ON AN AROMATIC POLYAMIDE IMIDE. |
CA321,623A CA1123981A (en) | 1978-02-17 | 1979-02-16 | Soluble aromatic polyamide-imide compositions for electrical use |
CA000384856A CA1143084A (en) | 1978-02-17 | 1981-08-28 | Soluble aromatic polyamide-imide compositions for electrical use |
GB08210337A GB2104084B (en) | 1978-04-28 | 1982-04-07 | Polyamide-imide compositions for imparting electrical properties and articles produced using the compositions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093478A JPS5518426A (en) | 1978-07-27 | 1978-07-27 | Heat-resistant flexible electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5518426A true JPS5518426A (en) | 1980-02-08 |
JPS6159906B2 JPS6159906B2 (en) | 1986-12-18 |
Family
ID=14012268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9093478A Granted JPS5518426A (en) | 1978-02-17 | 1978-07-27 | Heat-resistant flexible electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5518426A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58157190A (en) * | 1982-03-12 | 1983-09-19 | 日立化成工業株式会社 | Method of producing substrate for flexible printed circuit |
JPS6122937A (en) * | 1984-07-11 | 1986-01-31 | 三井金属鉱業株式会社 | Printed wiring board and manufacture thereof |
JPS61224485A (en) * | 1985-03-29 | 1986-10-06 | パイオニア株式会社 | Printed circuit board and manufacture thereof |
JPH01157846A (en) * | 1987-09-30 | 1989-06-21 | Hitachi Chem Co Ltd | Manufacture of flexible laminated plate lined with metal on both sides |
JPH02147236A (en) * | 1980-09-22 | 1990-06-06 | Usa Nasa | Heat-resistant polyimide film-metallic foil laminate and laminating method thereof |
-
1978
- 1978-07-27 JP JP9093478A patent/JPS5518426A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02147236A (en) * | 1980-09-22 | 1990-06-06 | Usa Nasa | Heat-resistant polyimide film-metallic foil laminate and laminating method thereof |
JPS58157190A (en) * | 1982-03-12 | 1983-09-19 | 日立化成工業株式会社 | Method of producing substrate for flexible printed circuit |
JPH0231516B2 (en) * | 1982-03-12 | 1990-07-13 | Hitachi Chemical Co Ltd | |
JPS6122937A (en) * | 1984-07-11 | 1986-01-31 | 三井金属鉱業株式会社 | Printed wiring board and manufacture thereof |
JPH0471707B2 (en) * | 1984-07-11 | 1992-11-16 | Mitsui Mining & Smelting Co | |
JPS61224485A (en) * | 1985-03-29 | 1986-10-06 | パイオニア株式会社 | Printed circuit board and manufacture thereof |
JPH01157846A (en) * | 1987-09-30 | 1989-06-21 | Hitachi Chem Co Ltd | Manufacture of flexible laminated plate lined with metal on both sides |
Also Published As
Publication number | Publication date |
---|---|
JPS6159906B2 (en) | 1986-12-18 |
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