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JPS55135000A - Method of fabricating printed circuit board - Google Patents

Method of fabricating printed circuit board

Info

Publication number
JPS55135000A
JPS55135000A JP2928280A JP2928280A JPS55135000A JP S55135000 A JPS55135000 A JP S55135000A JP 2928280 A JP2928280 A JP 2928280A JP 2928280 A JP2928280 A JP 2928280A JP S55135000 A JPS55135000 A JP S55135000A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
fabricating printed
fabricating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2928280A
Other languages
English (en)
Inventor
Ra Riyuu Erisu Seron
Chiyonnrin Ro Jiyon
Paashingu Shiyumitsuto Jiyooji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS55135000A publication Critical patent/JPS55135000A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2928280A 1979-04-06 1980-03-10 Method of fabricating printed circuit board Pending JPS55135000A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2762979A 1979-04-06 1979-04-06

Publications (1)

Publication Number Publication Date
JPS55135000A true JPS55135000A (en) 1980-10-21

Family

ID=21838831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2928280A Pending JPS55135000A (en) 1979-04-06 1980-03-10 Method of fabricating printed circuit board

Country Status (3)

Country Link
EP (1) EP0016952B1 (ja)
JP (1) JPS55135000A (ja)
DE (1) DE3061659D1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151497A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 高密度多層配線基板
JPS59151498A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 高密度多層配線基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383003A (en) * 1980-09-22 1983-05-10 General Electric Company Transfer lamination of copper thin sheets and films, method and product
FR2639505A1 (fr) * 1988-11-23 1990-05-25 Commissariat Energie Atomique Circuit imprime perfectionne
ATE140658T1 (de) * 1991-04-10 1996-08-15 Dyconex Ag Metallfolie mit einer strukturierten oberfläche
CN114361314B (zh) * 2022-01-10 2022-08-16 东莞市友辉光电科技有限公司 一种玻璃基mini led背光基板的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1264561B (de) * 1962-11-05 1968-03-28 Sanders Associates Inc Leiterzugplatte aus thermoplastischem Werkstoff
DE1496748C3 (de) * 1964-02-28 1974-03-28 Clevite Corp., Cleveland, Ohio (V.St.A.) Kupferkörper, insbesondere Kupferfolie, mit einer auf elektrolytischem Wege erzeugten, aus zwei Schichten aufgebauten rauhen Oberfläche und Verfahren zu dessen Herstellung
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
IT1112620B (it) * 1977-04-15 1986-01-20 Ibm Connettore elettrico perfezionato

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151497A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 高密度多層配線基板
JPS59151498A (ja) * 1983-02-18 1984-08-29 日本電気株式会社 高密度多層配線基板

Also Published As

Publication number Publication date
EP0016952B1 (de) 1983-01-19
DE3061659D1 (en) 1983-02-24
EP0016952A1 (de) 1980-10-15

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