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JPS5498583A - Coating method of metallic film - Google Patents

Coating method of metallic film

Info

Publication number
JPS5498583A
JPS5498583A JP634778A JP634778A JPS5498583A JP S5498583 A JPS5498583 A JP S5498583A JP 634778 A JP634778 A JP 634778A JP 634778 A JP634778 A JP 634778A JP S5498583 A JPS5498583 A JP S5498583A
Authority
JP
Japan
Prior art keywords
film
wiring layer
substrate
sio2
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP634778A
Other languages
Japanese (ja)
Inventor
Hisashi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP634778A priority Critical patent/JPS5498583A/en
Publication of JPS5498583A publication Critical patent/JPS5498583A/en
Pending legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To increase the bonding force, by providing the high molecule resin insulating film such as polyimide on the semiconductor substrate or insulation substrate and by inserting the inorganic compound such as SiO, SiO2 and Si2O3 between those films in coating metal film on it. CONSTITUTION:The SiO2 film 2 is coated on the Si substrate 1, and the background Al wiring layer 3 is placed on it, and after defatting and cleaning sufficiently the substrate 1, the polyimide film 4 is formed. Next, the transformation layer at the surface of the film 4 is removed with oxygen plasma etching and the SiO2 film 5 is vacuum evaporated with defatting and cleaning with trichlorethylene. After that, etching is made by taking the resist film 6 as a mask, open hole 7 is made on the film 5, it is connected to the backgroung Al wiring layer 3 with vacuum evaporation, forming the upper layer Al wiring layer 8 extended on the film 5. Thus, in comparison with the absence of the film 5, the bonding force between the film 4 and the wiring layer 8 is 4.0 kg/mm<2>, which is four times the conventional force, and it is most suited to multilayer wiring construction.
JP634778A 1978-01-20 1978-01-20 Coating method of metallic film Pending JPS5498583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP634778A JPS5498583A (en) 1978-01-20 1978-01-20 Coating method of metallic film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP634778A JPS5498583A (en) 1978-01-20 1978-01-20 Coating method of metallic film

Publications (1)

Publication Number Publication Date
JPS5498583A true JPS5498583A (en) 1979-08-03

Family

ID=11635831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP634778A Pending JPS5498583A (en) 1978-01-20 1978-01-20 Coating method of metallic film

Country Status (1)

Country Link
JP (1) JPS5498583A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58203069A (en) * 1982-05-24 1983-11-26 Hitachi Ltd Thermal head
JPH0268992A (en) * 1988-09-02 1990-03-08 Nec Corp Multilayered interconnection board
WO2012037234A1 (en) * 2010-09-14 2012-03-22 E. I. Du Pont De Nemours And Company Glass-coated flexible polymeric substrates in photovoltaic cells

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836988A (en) * 1971-09-09 1973-05-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836988A (en) * 1971-09-09 1973-05-31

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58203069A (en) * 1982-05-24 1983-11-26 Hitachi Ltd Thermal head
JPH0268992A (en) * 1988-09-02 1990-03-08 Nec Corp Multilayered interconnection board
WO2012037234A1 (en) * 2010-09-14 2012-03-22 E. I. Du Pont De Nemours And Company Glass-coated flexible polymeric substrates in photovoltaic cells

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