JPS56104450A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56104450A JPS56104450A JP734880A JP734880A JPS56104450A JP S56104450 A JPS56104450 A JP S56104450A JP 734880 A JP734880 A JP 734880A JP 734880 A JP734880 A JP 734880A JP S56104450 A JPS56104450 A JP S56104450A
- Authority
- JP
- Japan
- Prior art keywords
- film
- wire
- layer
- si3n4
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To enable film multilayer wiring of the semiconductor device without stepwise disconnetion of the wire by utilizing a lift-off technique. CONSTITUTION:An Si3N4 film 22 having generally the same thickness as a multilayer wire metal is formed on the substrate 21 before wired with a wire of SiO2 film, and a resist film 23 is formed thereon. After the film 22 is etched with the film 23 as a mask, an aluminum layer 24 is evaporated on the entire surface. Thereafter, the film 23 and the layer 24 formed thereon are exfoliated therefrom. When another layer is formed in wiring thereon, an insulating Si3N4 film 25 is formed thereon, a contact hole is formed thereat, the same step as the first layer is thereafter conducted, and aluminum layer 27 and Si3N4 film 28 are formed thereon. Thus, the stepwise disconnection of the wire can be eliminated, and the formation of the contact hole is facilitated to conduct film multilayer wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP734880A JPS56104450A (en) | 1980-01-24 | 1980-01-24 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP734880A JPS56104450A (en) | 1980-01-24 | 1980-01-24 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56104450A true JPS56104450A (en) | 1981-08-20 |
Family
ID=11663440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP734880A Pending JPS56104450A (en) | 1980-01-24 | 1980-01-24 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56104450A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156892A (en) * | 1984-08-28 | 1986-03-22 | 村田機械株式会社 | Cutter |
| US4709480A (en) * | 1985-04-02 | 1987-12-01 | Ars Edge Co. Ltd. | Scissors |
-
1980
- 1980-01-24 JP JP734880A patent/JPS56104450A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156892A (en) * | 1984-08-28 | 1986-03-22 | 村田機械株式会社 | Cutter |
| JPS6339503B2 (en) * | 1984-08-28 | 1988-08-05 | Murata Machinery Ltd | |
| US4709480A (en) * | 1985-04-02 | 1987-12-01 | Ars Edge Co. Ltd. | Scissors |
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