JPS5466343A - Forming method for noble metal pattern - Google Patents
Forming method for noble metal patternInfo
- Publication number
- JPS5466343A JPS5466343A JP13252477A JP13252477A JPS5466343A JP S5466343 A JPS5466343 A JP S5466343A JP 13252477 A JP13252477 A JP 13252477A JP 13252477 A JP13252477 A JP 13252477A JP S5466343 A JPS5466343 A JP S5466343A
- Authority
- JP
- Japan
- Prior art keywords
- film
- noble metal
- dispersible
- pattern
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13252477A JPS5466343A (en) | 1977-11-07 | 1977-11-07 | Forming method for noble metal pattern |
GB7840961A GB2006538B (en) | 1977-10-24 | 1978-10-18 | Thin-film microcircuit board and method for making the same |
AU40916/78A AU512418B2 (en) | 1977-10-24 | 1978-10-20 | Thin film microcircuit board |
DE2845891A DE2845891C2 (de) | 1977-10-24 | 1978-10-21 | Verfahren zur Herstellung einer Dünnfilmmikroschaltung |
FR7830090A FR2406897A1 (fr) | 1977-10-24 | 1978-10-23 | Plaquette de microcircuit en couche mince et methode de fabrication |
US05/953,497 US4227039A (en) | 1977-10-24 | 1978-10-23 | Thin-film microcircuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13252477A JPS5466343A (en) | 1977-11-07 | 1977-11-07 | Forming method for noble metal pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5466343A true JPS5466343A (en) | 1979-05-28 |
JPS6145550B2 JPS6145550B2 (ja) | 1986-10-08 |
Family
ID=15083310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13252477A Granted JPS5466343A (en) | 1977-10-24 | 1977-11-07 | Forming method for noble metal pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5466343A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086265A (ja) * | 1983-09-09 | 1985-05-15 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレ−テツド | カソ−ドスパツタリング法による製品の製造法およびその製品 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360638A (en) * | 1976-11-12 | 1978-05-31 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive material for pattern formation for accelerated particle beamexposure and pattern formation |
-
1977
- 1977-11-07 JP JP13252477A patent/JPS5466343A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360638A (en) * | 1976-11-12 | 1978-05-31 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive material for pattern formation for accelerated particle beamexposure and pattern formation |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086265A (ja) * | 1983-09-09 | 1985-05-15 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレ−テツド | カソ−ドスパツタリング法による製品の製造法およびその製品 |
Also Published As
Publication number | Publication date |
---|---|
JPS6145550B2 (ja) | 1986-10-08 |
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