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JPS5466343A - Forming method for noble metal pattern - Google Patents

Forming method for noble metal pattern

Info

Publication number
JPS5466343A
JPS5466343A JP13252477A JP13252477A JPS5466343A JP S5466343 A JPS5466343 A JP S5466343A JP 13252477 A JP13252477 A JP 13252477A JP 13252477 A JP13252477 A JP 13252477A JP S5466343 A JPS5466343 A JP S5466343A
Authority
JP
Japan
Prior art keywords
film
noble metal
dispersible
pattern
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13252477A
Other languages
Japanese (ja)
Other versions
JPS6145550B2 (en
Inventor
Kaoru Omura
Ichiro Shibazaki
Takeo Kimura
Hidehiko Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP13252477A priority Critical patent/JPS5466343A/en
Priority to GB7840961A priority patent/GB2006538B/en
Priority to AU40916/78A priority patent/AU512418B2/en
Priority to DE2845891A priority patent/DE2845891C2/en
Priority to FR7830090A priority patent/FR2406897A1/en
Priority to US05/953,497 priority patent/US4227039A/en
Publication of JPS5466343A publication Critical patent/JPS5466343A/en
Publication of JPS6145550B2 publication Critical patent/JPS6145550B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form a noble metal pattern of high density in simple operation by covering a substrate with a noble metal thin film with an easily dispersible metal thin film in-between and applying energy. CONSTITUTION:For example, a 100-5000Angstrom thick dispersible metal thin film is formed on a substrate such as ceramics. The film is made of Bi, Te, Ni, Cu, Sn, etc. or their alloy which can be dispersed and removed easily when applied with energy above the threshold value. The film is then covered with a 50-5000Angstrom thick noble metal thin film of Ag, Au, Pt, Ru, Rh, etc. By applying the resulting laminate with enough energy to pattern it, the dispersible film and the noble metal film can be pattern it, the dispersible film and the nobel metal film can be patterned simultaneously and esily. Thus, a stable noble metal pattern of high dependability and high density can be formed simply.
JP13252477A 1977-10-24 1977-11-07 Forming method for noble metal pattern Granted JPS5466343A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP13252477A JPS5466343A (en) 1977-11-07 1977-11-07 Forming method for noble metal pattern
GB7840961A GB2006538B (en) 1977-10-24 1978-10-18 Thin-film microcircuit board and method for making the same
AU40916/78A AU512418B2 (en) 1977-10-24 1978-10-20 Thin film microcircuit board
DE2845891A DE2845891C2 (en) 1977-10-24 1978-10-21 Method of manufacturing a thin film microcircuit
FR7830090A FR2406897A1 (en) 1977-10-24 1978-10-23 THIN LAYER MICROCIRCUIT BOARD AND MANUFACTURING METHOD
US05/953,497 US4227039A (en) 1977-10-24 1978-10-23 Thin-film microcircuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13252477A JPS5466343A (en) 1977-11-07 1977-11-07 Forming method for noble metal pattern

Publications (2)

Publication Number Publication Date
JPS5466343A true JPS5466343A (en) 1979-05-28
JPS6145550B2 JPS6145550B2 (en) 1986-10-08

Family

ID=15083310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13252477A Granted JPS5466343A (en) 1977-10-24 1977-11-07 Forming method for noble metal pattern

Country Status (1)

Country Link
JP (1) JPS5466343A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086265A (en) * 1983-09-09 1985-05-15 ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレ−テツド Manufacture of products made by cathode sputtering process and products thereby

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360638A (en) * 1976-11-12 1978-05-31 Nippon Telegr & Teleph Corp <Ntt> Photosensitive material for pattern formation for accelerated particle beamexposure and pattern formation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360638A (en) * 1976-11-12 1978-05-31 Nippon Telegr & Teleph Corp <Ntt> Photosensitive material for pattern formation for accelerated particle beamexposure and pattern formation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086265A (en) * 1983-09-09 1985-05-15 ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレ−テツド Manufacture of products made by cathode sputtering process and products thereby

Also Published As

Publication number Publication date
JPS6145550B2 (en) 1986-10-08

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