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JPS5460963A - Measuring method of wafer warpage - Google Patents

Measuring method of wafer warpage

Info

Publication number
JPS5460963A
JPS5460963A JP12681877A JP12681877A JPS5460963A JP S5460963 A JPS5460963 A JP S5460963A JP 12681877 A JP12681877 A JP 12681877A JP 12681877 A JP12681877 A JP 12681877A JP S5460963 A JPS5460963 A JP S5460963A
Authority
JP
Japan
Prior art keywords
sample
ultrasonic
reference plane
plane
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12681877A
Other languages
Japanese (ja)
Inventor
Koichiro Ootori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI, Agency of Industrial Science and Technology filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP12681877A priority Critical patent/JPS5460963A/en
Publication of JPS5460963A publication Critical patent/JPS5460963A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)

Abstract

PURPOSE: To facilitate measurement of large area samples and prevent giving damages to sample surfaces by detecting the deformation quantity the sample from the change in the phase of the reflection wave by ultrasonic waves.
CONSTITUTION: Ultrasonic pulses are projected from the ultrasonic converter 4 placed on the scanning plane 3 parallel with a reference plane 2 along the axis perpendicualr to the reference plane 2 to the surface of the sample 1 placed on the reference plane 2 and the ultrasonic pulses reflected from the surface of the sample 1 are detected with an ultrasonic converter 4. With the ultrasonic converter 4 being subsequently moved over the scanning plane 3, the ultrasonic pulses are received over the entire surface of the sample 1 with one end or center of the sample 1 as a reference and from the changes in their phase the deformation quantity at various places of the sample 1 are obtained and are then displayed in a display device 13, whereby the warpage distribution of the sample 1 may be known
COPYRIGHT: (C)1979,JPO&Japio
JP12681877A 1977-10-24 1977-10-24 Measuring method of wafer warpage Pending JPS5460963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12681877A JPS5460963A (en) 1977-10-24 1977-10-24 Measuring method of wafer warpage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12681877A JPS5460963A (en) 1977-10-24 1977-10-24 Measuring method of wafer warpage

Publications (1)

Publication Number Publication Date
JPS5460963A true JPS5460963A (en) 1979-05-16

Family

ID=14944701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12681877A Pending JPS5460963A (en) 1977-10-24 1977-10-24 Measuring method of wafer warpage

Country Status (1)

Country Link
JP (1) JPS5460963A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023842A (en) * 1973-07-02 1975-03-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023842A (en) * 1973-07-02 1975-03-14

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