JPS53148988A - Manufacture of semiconductor substrate - Google Patents
Manufacture of semiconductor substrateInfo
- Publication number
- JPS53148988A JPS53148988A JP6440877A JP6440877A JPS53148988A JP S53148988 A JPS53148988 A JP S53148988A JP 6440877 A JP6440877 A JP 6440877A JP 6440877 A JP6440877 A JP 6440877A JP S53148988 A JPS53148988 A JP S53148988A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate
- manufacture
- layer
- concave part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 210000003323 beak Anatomy 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Landscapes
- Element Separation (AREA)
Abstract
PURPOSE: To reduce the bird beak occurring at the insulating isolation region which separates the substrate into island regions and thus to secure a flat surfacr for the substrate, by forming the concave part via a mask on the semiconductor substrate after an epitaxial layer is grown and then filling the concave part with the SiO2 layer obtained by oxidizing the poly-crystal Si layer.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6440877A JPS53148988A (en) | 1977-05-31 | 1977-05-31 | Manufacture of semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6440877A JPS53148988A (en) | 1977-05-31 | 1977-05-31 | Manufacture of semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53148988A true JPS53148988A (en) | 1978-12-26 |
JPS571138B2 JPS571138B2 (en) | 1982-01-09 |
Family
ID=13257440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6440877A Granted JPS53148988A (en) | 1977-05-31 | 1977-05-31 | Manufacture of semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53148988A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57204150A (en) * | 1981-06-10 | 1982-12-14 | Fujitsu Ltd | Manufacture of semiconductor device |
US4916086A (en) * | 1987-06-18 | 1990-04-10 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device having rounded trench corners |
US4954459A (en) * | 1988-05-12 | 1990-09-04 | Advanced Micro Devices, Inc. | Method of planarization of topologies in integrated circuit structures |
US4962064A (en) * | 1988-05-12 | 1990-10-09 | Advanced Micro Devices, Inc. | Method of planarization of topologies in integrated circuit structures |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107877A (en) * | 1974-01-30 | 1975-08-25 | ||
JPS5226182A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Manufacturing method of semi-conductor unit |
-
1977
- 1977-05-31 JP JP6440877A patent/JPS53148988A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107877A (en) * | 1974-01-30 | 1975-08-25 | ||
JPS5226182A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Manufacturing method of semi-conductor unit |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57204150A (en) * | 1981-06-10 | 1982-12-14 | Fujitsu Ltd | Manufacture of semiconductor device |
US4916086A (en) * | 1987-06-18 | 1990-04-10 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device having rounded trench corners |
US4954459A (en) * | 1988-05-12 | 1990-09-04 | Advanced Micro Devices, Inc. | Method of planarization of topologies in integrated circuit structures |
US4962064A (en) * | 1988-05-12 | 1990-10-09 | Advanced Micro Devices, Inc. | Method of planarization of topologies in integrated circuit structures |
Also Published As
Publication number | Publication date |
---|---|
JPS571138B2 (en) | 1982-01-09 |
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