JPH11329743A - Electroluminescent device and method of manufacturing the same - Google Patents

Abstract

[Problem] Dot matrix E by conventional mask evaporation
In the manufacturing method of the L element, it is basically difficult to miniaturize and a fine display cannot be obtained. There are problems such as complicated processes. SOLUTION: A substrate in which a stripe-shaped first insulating layer and an electrode are formed on a substrate and a second insulating material layer is formed in a region other than a display pixel on the electrode, or a stripe-shaped first electrode is formed on the substrate. A substrate in which an insulating material layer and a second electrode layer are sequentially formed in a display pixel region on the electrode layer, and the first electrode layer and the second electrode layer are electrically connected to each other. A light emitting layer and a cathode electrode are sequentially formed. At this time, since an insulating material layer is formed on the substrate, a step is formed, and the step forms an organic EL element formed by separating each display pixel dot. In addition, a dot matrix EL element can be obtained by connecting a stripe-shaped electrode formed on another substrate and the display pixel so as to face each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent device having a light emitting layer, and more particularly to an organic EL device using an organic light emitting layer and a method for producing the organic EL device.

[0002]

2. Description of the Related Art Conventionally, an electroluminescent element (hereinafter, referred to as an EL element) has been used as an electroluminescent element implemented as a light emitting display section of a display device or the like.
In recent years, as such an EL element, an element using an organic material has been particularly studied, and a dot matrix type display device using an EL element using an organic material (hereinafter referred to as an organic EL element) is also known. . For example, one having a display pixel having a sectional structure as shown in FIG. 15 is known. A transparent electrode made of ITO or the like is formed on a glass substrate 1, and a striped anode 2 extending in the horizontal direction of the drawing is formed. An organic light emitting layer 3 having a light emitting function is formed thereon. A dot matrix structure is provided in which a metal electrode 4 serving as a cathode is provided in a stripe shape orthogonal to the anode 2.

In order to display a desired pattern using an electroluminescent device having such a structure, it is necessary to pattern a light emitting portion. However, since the organic light emitting layer 3 is easily dissolved in an organic solvent, a photoresist is used. Etching is difficult. Therefore, in order to perform dot matrix display,
A transparent electrode 2 on a transparent substrate 1 is formed in a stripe pattern, and an organic light emitting layer 3 is formed thereon by an evaporation method using an evaporation mask having a rectangular display section opening. A patterning method using at least two kinds of vapor deposition masks, in which a striped metal electrode 4 is formed so as to be orthogonal to the transparent electrode 2 by a vapor deposition method through a vapor deposition mask having an opening and a cathode is provided. It has been implemented as.

[0004]

However, in such a method, at least two deposition mask alignments are required when the organic light emitting layer 3 and the metal electrode 4 are formed. The display could not be obtained, and the manufacturing process was complicated, resulting in many defects such as scratching the display portion. Further, it is assumed that the organic light emitting layer is formed over the entire surface of the transparent substrate without using the vapor deposition mask for forming the organic light emitting layer, and only the formation of the cathode layer is performed using the vapor deposition mask. In such a case, an organic light emitting layer is formed also on a part that is not originally required, for example, on a display pixel other than a display pixel where a transparent electrode is not formed when the transparent electrode film is patterned. However, there is a problem that reliability is impaired, for example, crosstalk may occur when dot matrix display is performed due to the influence of leakage current generated by flowing through the organic light emitting layer.

An object of the present invention is to solve the above-mentioned problems and to provide a highly reliable electroluminescent device capable of forming a fine display pattern.

[0006]

According to the present invention, there is provided an electroluminescent device having an organic light emitting layer sandwiched between a pair of electrodes having different work functions on a substrate. A first insulating material layer having a thickness equal to or greater than the total thickness of the first and second layers; and a first electrode layer formed on the insulating material layer. A second portion having a thickness equal to or more than the total thickness of the organic light emitting layer and the second electrode layer is provided on a portion of the electrode layer other than the region serving as a display pixel.
An electroluminescent device in which an insulating material layer is formed, and an organic light emitting layer and a second electrode layer having a different work function from the first electrode layer are sequentially stacked in a region to be a display pixel on the first electrode layer.

Alternatively, a first electrode layer having a predetermined pattern is formed on the substrate of the electroluminescent device having an organic light emitting layer sandwiched between a pair of electrodes having different work functions on the substrate. An insulating material layer having a thickness equal to or greater than the total thickness of the organic light emitting layer and the third electrode layer is formed in a region serving as a display pixel above the electrode layer. A second electrode layer is formed on the side surface of the insulating material layer or on the inner surface of the through-hole provided as necessary in the insulating material layer, and the first electrode layer and the second electrode layer are electrically connected to each other so as to sandwich the insulating material layer. And an electroluminescent element in which an organic light emitting layer and a third electrode layer having a different work function from the second electrode layer are sequentially stacked on the second electrode layer formed on the insulating material layer. Provided.

Further, the substrate on which the electroluminescent element is formed and an external connection substrate having an electrode layer of a predetermined pattern are disposed so as to face each other, and the electrode layer on the surface of the substrate on which the electroluminescent element is to be formed as a display pixel is provided. A dot matrix type electroluminescent device is provided by bonding the electroluminescent device substrate and the external electrode substrate so that the electrodes of the external electrode substrate face each other so as to be electrically connected to each other.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. First, an EL device using a dot matrix type organic substance light emitting layer as an electroluminescent device of the present invention will be described along a manufacturing method thereof. FIG. 1A is a perspective view schematically showing an example in which an organic EL element 20 having an organic light emitting layer sandwiched between a pair of electrodes having different work functions is formed on a light transmitting substrate. A light-transmitting first insulating material layer 22 formed in a predetermined stripe pattern and a transparent electrode layer serving as a first electrode layer formed on the first insulating material layer 22 are formed on the EL element substrate 21. 23, a second insulating material layer 24 is formed on a part of the surface of the transparent electrode layer 23, and an organic light emitting layer 25 and a cathode layer 26 serving as the second electrode layer are formed on the surface of the substrate. It is formed on almost the entire surface of the substrate so as not to become a continuous layer in the direction. Thus, each display pixel region 27 is formed in an island shape on the substrate, and the light emitting layer 25 and the cathode layer 26 are independent for each display pixel region.

FIGS. 2 to 4 are cross-sectional views for explaining a manufacturing process of the EL element shown in FIG. 1A. FIGS. 2A, 3A and 4A are sectional views of FIG. 1A. FIG. 2 shows a cross section taken along the line AA.
(B), FIG. 3 (b), and FIG. 4 (b) are BB of FIG. 1 (a).
The cross section of each part is shown. A light-transmitting first insulating material layer 22 and an IT
A transparent electrode layer 23 of O or the like is formed in a stripe shape as shown in FIG. Further, a second insulating material layer 24 is formed on the transparent electrode layer 23 formed in a stripe shape in a portion other than a region to become a display pixel 27 later as shown in FIG. 3B. Since the organic light emitting layer is not formed in the steps up to here, a fine pattern can be formed relatively easily by performing a fine etching process using a known photolithography technique or the like.

Subsequently, E having a pattern as shown in FIG.
An organic light emitting layer 25 and a cathode layer 26 are formed on the L element substrate 1 (see FIGS. 4A and 4B). For these layers, a vapor deposition film can be continuously formed over the entire display region on the EL element substrate 21 by a method such as a vapor deposition method or a sputtering method. As shown in FIG. 3, since the striped transparent electrode 23 is formed on the striped first insulating material layer 22, the organic light emitting layer 25a and the cathode layer 26a deposited between the stripes are It is sandwiched between one insulating material layers 22. Therefore, in the direction orthogonal to the stripe-shaped electrode 23 of the display pixel 27, the pixel is cut at the step. In particular, the first insulating material layer 22 and the second insulating material layer 24 include the organic light emitting layer 25 and the cathode layer 2.
6, the thickness of each of the organic light emitting layer 25 and the cathode layer 26 becomes a discontinuous film in the plane direction, and the organic light emitting layer formed on the stripe-shaped electrode 23 is formed. Each of the layers 25 and the cathode layer 26 can be reliably separated from the respective layers of the organic light emitting layer 25 and the cathode layer 26 on the adjacent stripe electrode 23.

Thus, as shown in FIG. 1A, each display pixel 27 is scattered in an island shape. A second insulating material layer 24 is formed next to each display pixel 27 on the striped electrode 23. Therefore, even in the direction parallel to the stripe, the respective layers of the organic light emitting layer 25 and the cathode layer 26 on the stripe electrode 23 are cut by the step of the second insulating material layer 24, and the direction orthogonal to the stripe electrode 23. It will be scattered like an island. Therefore, each display pixel 27 is adjacent to the display pixel 27.
And can be independently emitted.

Next, as shown in FIG. 1B, the external substrate 30 having the stripe-shaped cathode connection electrodes 33 is formed such that the stripe-shaped cathode connection electrodes 33 are orthogonal to the stripe-shaped electrode layers 23 of the EL element 20. And a striped electrode layer 2
3 where the second insulating material layer 24 does not exist, that is,
It is disposed so as to be connected to the cathode layer 26 of the display pixel 27. The external substrate 30 is formed by patterning the insulating material layer 32 on the external electrode substrate 31 and the cathode connection electrode 33 thereon in a stripe shape by a known photolithography method or the like. Note that the stripe-shaped insulating material layer 32 and the cathode connection electrode 33 are
It has a thickness equal to or greater than that of the insulating material layer 24. This is because the EL element 20
When the EL element 20 and the external electrode substrate 30 are overlapped with each other so that the portion where the second insulating material layer 24 is formed and has a convex shape is located, the cathode connection electrodes 33 and E
This facilitates electrical connection with the cathode layer 26 in the display pixel 27 of the L element 20.

The cathode layer 26 of the display pixel 27 portion of the EL element 20 and the cathode connection electrode 33 of the external substrate 30 are made of the same material, an alloy containing the same material, or a different metal material. The EL element substrate 21 and the substrate 30 are adhered so as to maintain the state in which they are in close contact with each other, or the cathode layer 26 and the cathode connection electrode 32
Is connected by conductive paste etc.
A dot matrix EL light emitting element 71 that supplies a signal from an external power supply to each display pixel 27 can be provided.

FIG. 5 shows a dot matrix type EL in which the EL element substrate 21 and the external substrate 30 are sealed with an epoxy adhesive 80 around display pixels of the substrate so that the two electrode substrates are kept in close contact with each other. FIG. 2 shows a schematic sectional view of a light emitting element 71. A thickness control member 81 having a predetermined thickness is mixed in the epoxy adhesive 80 so that the distance between the two substrates is such that the cathode layer 26 and the cathode connection electrode 33 are brought into close contact with each other. The thickness control member 81 has a diameter equal to or slightly larger than the distance between the substrates when the two substrates are disposed opposite to each other with a predetermined load, and is formed of a ceramic ball such as a plastic ball, a glass ball, or the like. It is formed of members and the like. Thus, the entire surface of the dot matrix type EL light emitting element 71 is sealed with a substantially uniform thickness and load. Note that the sealing is preferably performed in an atmosphere of an inert gas such as nitrogen or argon.

Transparent electrode layer 23 and cathode connection electrode 33
The light from the organic light emitting layer 25 is transmitted by transmitting a predetermined signal to the transparent electrode layer 23, the first insulating material 22,
The light is radiated outside through the L element substrate 21. A transparent material such as ITO is used for the transparent electrode layer 23 serving as an anode, and a single metal such as indium, silver, tin, aluminum, magnesium, calcium, or an alloy thereof, or an intermetallic compound is used for the cathode layer 26. An electron injecting electrode having a work function lower than that of the transparent electrode layer 23, an n-type Si surface covered with SiO2, or a tunnel injection electrode having an Al surface covered with Al2O3 is used. Since the cathode layer of the pair of electrodes sandwiching the light emitting layer is formed by the electron injecting electrode as described above, the injection efficiency of electrons injected from the cathode to the organic light emitting layer can be increased,
Thereby, the electrons injected from the cathode into the organic light emitting layer and the holes injected from the anode into the organic light emitting layer are recombined in the light emitting layer to improve light emission efficiency.

In the conventional matrix type light-emitting device, as shown in FIG. 15, both a striped anode and a striped cathode orthogonal to this are formed on one substrate. In the above, only the electrode layer 23 on the substrate side is made into a stripe shape, and the cathode layer 26 on the substrate surface side is an electrode which exists independently and independently on the display pixel 27 without being patterned by using an evaporation mask,
A dot matrix type EL element is obtained by connecting to a stripe electrode 33 formed on another substrate. Therefore, both the pair of electrodes for injecting electrons or holes into the light emitting layer are made of a material having excellent electron or hole injectability, and the external substrate electrode 3 connected to the electrode 26 on the light emitting layer surface side is used.
By using 3 as a low-resistance electrode material, it is possible to achieve both excellent luminous efficiency and reduced resistance of the entire EL light-emitting element.

In the method of manufacturing an EL device according to the present invention,
When forming the organic light emitting layer 25 and the cathode layer 26, no vapor deposition mask corresponding to each display pixel is used,
The organic light emitting layer 25 and the cathode layer 26 are not etched using a photoresist or the like. Therefore, in a process before forming these layers, the transparent electrode layer 23 and the like are finely processed by a known photolithography method and the like, and similarly, the cathode connection electrode 33 and the like of the external electrode substrate 30 are also finely processed by a photolithography method and the like. , A fine pattern can be easily formed. Further, the organic light emitting layer 25 and the cathode layer 26 are merely subjected to vapor deposition or the like on the surface of the EL element substrate formed so as to have a step in a step before forming these layers, and are subjected to etching or the like. Since it does not occur, the organic light emitting layer 25 is not damaged at all, and a fine pattern can be easily and surely formed.

In the EL device of the present invention, each display pixel 27 is formed on the transparent electrode 22 in the stripe direction of the transparent electrode 22 of the EL device, and the organic light emitting layer 25 and the cathode layer of each display pixel 27 are formed. 26 is a film that is not continuous with the other adjacent display pixels 27 in the in-plane direction. Therefore, by providing an external stripe electrode in a direction orthogonal to the stripe direction of the transparent electrode 22 in each display pixel 27, A dot matrix type EL display element can be obtained.

Next, another embodiment of a dot matrix type EL device will be described along a method of manufacturing the same. FIG. 6 is a perspective view of the EL element 40. In the present embodiment, the electrode layer below the light emitting layer of the display pixel 49 has a two-layer structure with an insulating layer interposed therebetween. 7 to 9 are cross-sectional views illustrating the steps of manufacturing the EL element of FIG. 6 in the order of manufacture.
(A), FIG. 8 (a), and FIG. 9 (a) are cross-sectional views taken along the line AA of FIG. 6, and FIG. 7 (b), FIG. 8 (b), and FIG.
Each of the B cross sections is shown.

On an EL element substrate 41 such as glass, an IT
A first transparent electrode layer 42 of O or the like is formed in a stripe shape by a known photolithography method or the like, and a photoresist 48a is applied to the entire surface by a spinner or the like. Thereafter, exposure and development are performed using a photomask provided with a predetermined opening so that the photoresist 48a remains in a region other than the display pixels 49. At this time, the photoresist in the vicinity of the display pixel 49 is not left in the gap 42a between the stripe-shaped first transparent electrode layers 42. Subsequently, the insulating material layer 43 is formed on the entire display portion of the EL element substrate 41 from above.
Is provided by a method such as vapor deposition or coating, so that the side and top surfaces of the stripe-shaped ITO first electrode layer 42 and the photoresist 48 a
Is covered with the insulating material layer 43.

Subsequently, a photoresist is applied to the entire surface, and is exposed and developed so that the photoresist 48b remains on the portion to be each display pixel 49. At this time, each display pixel 49 is provided with a hole for forming the contact hole 44 at the same time as shown in FIG. Thereafter, the insulating material layer 43 (indicated by a dotted line in FIG. 7) formed in a portion other than the region to become the display pixel 49, that is, in the upper surface of the photoresist 48a and the contact hole 44 is removed. The photoresist 48a is preferably formed by adjusting the exposure conditions and the heat treatment conditions so that the EL element substrate 41 has a wide inclined side and the substrate surface side has a narrow inclined side surface. In addition, it is assumed that at least one contact hole 44 is provided in each display pixel 49. If the diameter of the contact hole 44 is about 50 μm or less, it becomes difficult for human eyes to observe, and the display quality is not impaired. .

Next, after removing the photoresists 48a and 48b, a second transparent electrode layer 45 made of ITO or the like is formed on the insulating material layer 43 as shown in FIG. In a known manner. At this time, the second transparent electrode layer 45 is also formed on the inner side surface of the contact hole 44, with the inner surface of the contact hole 44 being an inclined surface as shown in FIGS. 7A and 7B.
Thereby, in the portion corresponding to each display pixel 49,
The insulating material layer 43 is formed of a stripe-shaped first transparent electrode layer 42.
And a second transparent electrode layer 45 to form an electrode having a two-layer structure sandwiched therebetween. On the inner side surface of the contact hole 44, a contact hole 44 having a taper so that the upper side of the substrate is wider in a cross section of the contact hole 44 so that the second transparent electrode layer 45 is easily formed. Specifically, the etching of the insulating material layer 43 is performed under the condition that the etching rate is low, so that the contact hole having a wide upper side of the substrate and a narrower side of the first transparent electrode layer and having an inclined surface is formed.

In the direction orthogonal to the stripe direction of the first transparent electrode layer 42 in the display pixel region 49, the first
The side surface of the stripe of the transparent electrode layer is covered with the insulating material layer 43. As shown in FIG. 7A, a photoresist 48a is formed in the gap 42a between the stripes, and then the insulating material layer 43 is formed. Therefore, the second transparent electrode layer 45 is not formed around the side surface of the insulating material layer 43. Therefore, each display pixel region 49 adjacent to the direction perpendicular to the stripe is disconnected due to a step on the side surface of the insulating material layer 43. In the direction parallel to the stripes of the first transparent electrode layer in the display pixel region 49, the side surface portions of the insulating material layer 43 other than the contact holes on the first transparent electrode layer are provided before forming the insulating material layer 43. The second transparent electrode 45 is not connected to the first transparent electrode 42 because the side surface is the boundary portion with the photoresist 48a. In addition, the method of providing a taper does not have any problem even if it is formed by means other than the above,
In short, the second transparent electrode 45 may be connected to the first transparent electrode 42 in the contact hole 44 and be disconnected at the side surface of the insulating material layer 43 on the first transparent electrode 42. Also,
The step of forming an electrode having a two-layer structure connected by the contact hole 44 may be a method using a known photolithography method other than the above embodiment.

The organic light emitting layer 46 and the cathode serving as the third electrode layer are formed on almost the entire surface of the EL element substrate 41 on which the electrodes of the two-layer structure prepared as described above are formed so as to cover the display pixel area. The layer 47 is laminated by a known method such as a vapor deposition method. Thereby, the organic EL element 4 as shown in FIG.
0 is obtained. The EL element 40 has a cross section as shown in FIG. 9, and a first transparent electrode layer 42, an insulating material layer 43, a second transparent electrode layer 45, a light emitting layer 46, and a cathode layer 47 are laminated on an EL element substrate 41. Display pixels 49 are scattered like islands. Since the insulating material layer 43 is formed to have a thickness equal to or greater than the total thickness of the light emitting layer 46 and the cathode layer 47, each layer of the light emitting layer 46 and the cathode layer 47 has an in-plane direction.
It is supposed to be surely cut by the step of the insulating material layer.

On the organic EL element 40, the external electrode substrate 30 having the stripe-shaped cathode connection electrode 33 as described in the previous embodiment is attached to the stripe-shaped first transparent electrode layer 42 of the EL element 40. A dot matrix type EL light emitting element is obtained by arranging the cathode connection electrodes 33 of the external electrode substrate 30 so as to be orthogonal to each other and electrically connecting the cathode layer 47 and the cathode connection electrode 33. be able to. Note that the connection between them can be made by closely contacting them or by using a conductive paste as in the embodiment described above. However, in the present embodiment, since the projection of the EL element 40 becomes the display pixel 49,
It is not necessary to overlap the projections so that the projections are located in the gaps 34 between the stripes of the cathode connection electrode 33 as in the previous embodiment. Therefore, the cathode connection electrode 33 of the external electrode substrate 30 may be provided directly on the substrate without interposing the insulating material layer 32.

In the EL element 40 of this embodiment, similarly to the EL element 20 described in the previous embodiment, the cathode layer 47 is made of an electron injecting electrode material and the external substrate electrode 33 is made of a low resistance electrode material. Thus, an electrode structure having excellent luminous efficiency and capable of reducing the resistance of the entire dot matrix EL light emitting element can be obtained. Also, in the manufacturing method of the present embodiment, the organic light emitting layer 46 and the cathode layer 47 can be finely patterned without directly performing an etching process, and a fine display can be obtained without damaging the light emitting layer. Can be. The EL element 40
It is not necessary to use a light-transmitting substrate such as glass for the substrate 31 used for the external electrode substrate 30 connected to the substrate. A light-emitting substrate is used to emit light from each display pixel 49 of the EL element to the glass substrate 41 using a substrate having a high reflectance. The contrast of the EL light-emitting element can be improved by reflecting the light or by absorbing light such as black.

Still another embodiment will be described with reference to FIGS. 10 to 14 along a manufacturing method thereof. FIG.
FIG. 3 is a schematic perspective view showing a state in which an electroluminescent element 50 and an external electrode substrate 60 are overlaid to form a dot matrix type EL light emitting element. The EL device of the present embodiment also has a two-layered I
Although it has a TO transparent electrode, the first electrode layer and the second electrode layer are connected by a portion other than the contact hole.

An auxiliary electrode 52 as shown in FIG. 11 is formed on a glass substrate 51 using a metal material. Auxiliary electrode 52
14 has an electrode line 52a and a protruding electrode portion 52b.
It has a cross section as shown in FIG. FIG. 14 illustrates a manufacturing process of the EL element 50 with reference to a cross-sectional view taken along a line AB of the electrode line 52a and the protruding electrode portion 52b in FIG. Next, as shown in FIG. 12, a first electrode layer 53 made of a transparent electrode such as ITO having a width covering all of the electrode lines 52a and the protruding electrode portions 52b is formed in a stripe shape so as to cover the auxiliary electrode layer 52.

The protruding electrode portion 52b is formed so as to be located at a portion between the display pixel regions 59 adjacent in the direction parallel to the stripe of the first electrode 53. Electrode line 5
2a may be such that only the protruding electrode portion 52b and the striped first electrode layer 53 are formed without forming this.
However, when an EL element is used to perform a fine display with a large area, each stripe-shaped electrode is thin and long. Therefore, even if a low-resistance material such as Al is used with only the stripe-shaped electrode, the line resistance is low. May be increased. Therefore, in this embodiment, the auxiliary electrode 52 having the stripe-shaped electrode line 52a and the protruding electrode portion 52b located on the side surface of the second electrode is provided to further reduce the line resistance.

Subsequently, as shown in FIGS. 13 and 14C, a photoresist 54 is formed in a portion between adjacent display pixel regions. A photoresist 54a is formed on the first electrode layer 53 at a position between the display pixel regions 59 on the first electrode layer 53 so as to straddle one side surface of the protruding electrode portion 52b. A stripe-shaped photoresist 54b is formed substantially in parallel with the stripe except for the vicinity of the electrode. When the photoresists 54a and 54b are formed, the exposure time, the exposure direction, the development conditions, the heat treatment conditions, and the like are appropriately adjusted so that the EL element substrate 51 is wider and the EL element substrate 51 is narrower. It is preferable to form them so that

Next, as shown in FIG. 14D, a translucent insulating material layer 55 is formed on the entire display region of the EL element substrate 51. The insulating material layer 55 has photosensitivity,
A photocurable resin or the like that is cured by irradiation with ultraviolet light or the like is preferable. Subsequently, light such as ultraviolet rays is irradiated onto the entire surface of the substrate from the back side of the translucent EL element substrate 51 and developed. When this light irradiation is performed, the region other than the region where the light-shielding auxiliary electrode layer 52 is formed, that is, the portion where the photocurable resin is directly formed on the EL device substrate 51 made of glass or the like, and the EL device substrate 5
A first electrode layer 53 made of ITO or the like is stacked on the first substrate 1, and the photocurable resin in a portion where the photocurable resin is directly formed is cured thereon to form an insulating material layer 55. In the region where the auxiliary electrode layer 52 is formed, the auxiliary electrode layer 52
Is made of a metal layer that does not transmit light, the light does not reach the photocurable resin, and the insulating material layer 55 is not formed.

When irradiating light from the EL element substrate 51 side, as shown in FIG.
Irradiation is performed from an oblique direction on the back surface of the EL element substrate 51 such that light travels from the side of the protruding electrode portion 52a formed so as to straddle the 4a toward the opposite side of the protruding electrode portion 52a. Thereby, the protruding electrode portion 52 of the insulating material layer 55 is formed.
The side surface on which the photoresist 54a is not formed can be formed as the inclined side surface 55b. It should be noted that light does not reach the photocurable resin provided so as to cover the electrode lines 52a in the same manner as above the protruding electrode portions 52a. As shown in FIG. 14E, the insulating material layer 55 is cured in a state having a certain thickness due to wraparound, reflection, and the like, and an insulating material layer 55 is formed in an island shape on each stripe-shaped first electrode layer 53.

After a second electrode layer 56 made of a transparent electrode such as ITO is formed on the substrate by a known method such as an evaporation method, a sputtering method, or a coating method, the photoresist 54 is removed. At this time, in the direction parallel to the stripe direction of the first electrode layer 53 in the display pixel region 59, the photoresist 5
The second electrode layer 56 is broken at the portion of the insulating cut material layer surface 55a where 4a was formed. In addition, on the side surface of the protruding electrode portion 52a opposite to the side surface on which the photoresist 54a is formed, the side surface of the insulating material layer 55 is an inclined side surface 55b.
The second electrode layer 56 formed on the surface of the insulating material layer 55
Is formed also on the inclined side surface 55b of the first electrode layer 53, thereby forming the first electrode layer 53 and the second electrode layer 56 covering the insulating material layer 55 on the protruding electrode portion 52a.

In the direction orthogonal to the stripes, the photoresist 54b is formed except for the vicinity of the stripe-shaped first electrode layer 53, so that the end surface of the first electrode layer 53 is covered with the insulating material layer 55. The first electrode layer 53 and the second electrode layer 56 having a stripe shape are formed by the end faces.
Are surely insulated from the adjacent first electrode layer 53 and second electrode layer 56. Through this series of steps, the EL element substrate 51 having the island-shaped display pixel region 59 is completed. The order in which this series of steps is performed is not limited to this example. For example, the step of removing the photoresist 54 may be performed before the step of forming the second electrode layer 56, or the step of forming the second electrode layer 56 may be performed. After that, patterning may be performed again by photolithography.

Next, an organic light emitting layer 57 and a cathode layer 58 are successively formed on substantially the entire surface of the EL element substrate 51 by the same steps as in the previous embodiment such as a vapor deposition method to form an organic EL element 5.
0 is produced. The cathode layer 58 serving as the third electrode layer is formed of a material having an excellent electron injecting property, as described in the above embodiment.

As shown in FIGS. 10 and 14 (g), an organic light emitting layer 57 and a cathode layer 58 are formed on the surface of the second electrode layer 56 and the surface of the portion other than the display pixel region 59. . At this time, the organic light emitting layer 57 and the cathode layer 58 of each display pixel 59 are formed on the side surface 55a of the insulating material layer 55 of each display pixel region 59 where the photoresist 54a is formed and the side surface where the photoresist 54b is formed. And the inclined side surface 55 of the insulating material layer 55
The second electrode layer 56 is formed so as to cover the surface of the second electrode layer 56 so as to be substantially connected at b. Since the thickness of the insulating material layer 55 is equal to or greater than the total thickness of the organic light emitting layer 57 and the cathode layer 58, each display pixel area 59 is adjacent to another display pixel 59.
The light emission can be controlled separately and independently.

The organic light emitting layer 57 and the cathode layer 58 are also formed in the gap between the adjacent display pixel regions 59.
The striped first electrode layer 53 is formed of an insulating material layer 55.
, And the side surface thereof also forms the photoresist 54b, so that it is not a layer that covers between adjacent stripes. In particular, when the side surface of the photoresist 54 is wide on the substrate side and narrow on the substrate surface side, the side surface of the insulating material layer that has been in contact with the photoresist 54 becomes a side surface having a slope as shown in FIG. ,
Patterning is surely performed by this step. Further, the thickness of the insulating material layer 55 is set to be equal to or larger than the total thickness of the organic light emitting layer 57 and the cathode layer 58. Therefore,
Even if the organic light emitting layer 57 and the cathode layer 58 are formed in the gap, the adjacent display pixels 59 are not electrically connected through these layers stacked in the gap.

The organic EL device 50 manufactured as described above
Then, the external electrode substrate 60 is overlapped at a predetermined position so that the stripe-shaped electrode layer 62 is orthogonal to the stripe of the first electrode layer 53, thereby completing the dot matrix type EL light-emitting element 70. The electrode layer 62 is formed of a low-resistance metal material layer, and the stripe of the electrode layer 62 is a first stripe.
It is arranged so as to be orthogonal to the stripe of the electrode layer 53 and to be connected to the cathode layer 58 on the surface of the display pixel region 59. A signal from an external power supply is applied to a striped electrode layer 53.
And to the electrode layer 62, the dot matrix type organic EL element 70 becomes a light emitting layer 58 of each display pixel region 59.
Is emitted, and the light is emitted from the translucent EL element substrate 51 side to the outside and is viewed.

The external electrode substrate 60 is preferably formed of a black insulating substrate 61 such as a metal substrate or a glass substrate, the surface of which is coated with a black insulating film or the like, and more preferably has a matte surface. Then, it is preferable to perform an anti-reflection treatment. When viewed from the substrate 51 side, the space between the respective display pixel regions 59 is viewed in black, so that E
The display contrast can be increased by setting the display when the L light emitting element 70 is not lit to be as black as possible.
The auxiliary electrode layer 52 formed on the surface of the substrate 51 on the viewing side is a laminated electrode layer in which a layer for reducing metal reflection is laminated as a black light absorbing layer such as chromium oxide and a low resistance material layer such as Cr and Al. You may make it. In this case, it is as if a so-called black mask is formed between the respective display pixel areas, and it is possible to improve the contrast and to reduce the deterioration of the display quality due to the electrode reflection during non-display, which is more preferable. .

In the above embodiment, a light-transmitting anode such as ITO is formed on a light-transmitting substrate, and an organic light-emitting layer and a cathode layer are stacked thereon. An anode may be formed on the substrate, and the organic light emitting layer and the anode may be laminated on the anode.The direction of light extraction may not be on the substrate side on which the organic light emitting layer is laminated, but on the surface of the substrate on which the organic light emitting layer and the like are laminated. Light may be extracted from the external electrode substrate side on which the electrode layer for connecting to the electrode layer is formed, or light may be extracted from both substrates.

Incidentally, the cathode / light-emitting layer /
Hole injection layer / anode, cathode / electron injection layer / emission layer / anode,
Cathode / electron injection layer / emission layer / hole injection layer / cathode, anode /
The structure of the light emitting layer / electron injection layer / cathode has been developed.
As an organic light emitting layer sandwiched between the pair of electrodes,
Various structures such as a single layer or a multilayer structure such as an electron injection layer / a light emitting layer / a hole injection layer can be used. In the present specification, the organic light emitting layer is a generic term for various structures described above sandwiched between a cathode and an anode.

As materials for the organic light emitting layer, benzothiazole-based, benzoxazal-based fluorescent whitening agents, styrylbenzene-based compounds, aromatic dimethylylin compounds, naphthalene derivatives, anthracene derivatives, 8
A metal complex of hydroxyethoxyquinoline or a derivative thereof,
Polyarylene vinylene and derivatives thereof can be used, and as a hole transporting material, a triazole derivative, an imidazole derivative, a pyrazoline derivative, a phenylenediamine derivative, an oxazar derivative, a hydrazone derivative, a stilbene derivative, a polysilane-based compound, or the like can be used as an electron injection material. For example, an electron transfer compound material such as a nitro-substituted fluorenone derivative and an anthraquinodimethane derivative can be used.

Further, in this description, a simple dot matrix display device having orthogonal stripe-shaped electrode layers has been described as an example of a dot matrix type organic EL light emitting device. By using an active substrate provided with an active element such as a TFT or MIM as an external electrode substrate to be superposed, various changes and improvements such as an active matrix EL element can be made. Further, by injecting an inert gas or an inert liquid between the EL element substrate and the external electrode substrate, the EL element can be structured not to be directly exposed to the external atmosphere. Can be performed at the same time as the step of connecting to the electrode layer of the external electrode substrate without providing. In particular, it is preferable to stack both substrates under an activated gas atmosphere such as a nitrogen gas or an argon gas in which the water content and the oxygen content are reduced.

[0045]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to specific examples. (Embodiment 1) A description will be given with reference to FIGS. A washed glass substrate 21 was prepared, and a light-transmitting resin was applied on the substrate by a spinner to form a first insulating material layer 22 having a thickness of 0.4 μm. A sheet resistance of about 60
An ITO transparent electrode film of Ω / cm 2 was formed on the entire surface by a sputtering method. Next, a photoresist is coated thereon, exposed through a photomask having a stripe-shaped opening, and a 0.2-micron ITO layer and a transparent resin are formed by a reactive ion etching method using a gas such as CCl 4. The layer was etched to form a striped transparent electrode layer 23 and a first insulating material layer 22, and the remaining resist was removed.

Subsequently, a UV curable resin is applied to the entire surface of the substrate, exposed and developed to form a second insulating material layer 24 having a thickness of 0.3 μm at a predetermined position on the transparent electrode layer 23. 3
A first step of obtaining a substrate as shown in FIG. After washing the substrate, 0.05 micron of TPD (triphenylamine derivative) as a hole transport layer and 0.05 micron of AlQ3 (aluminum complex of oxine) as a light emitting layer are continuously deposited to form an organic light emitting layer 25. It was formed on the entire surface of the substrate. Subsequently, a second step of providing a cathode layer 26 of 0.1 μm by co-evaporating magnesium and silver at a volume ratio of 20: 1 to perform an EL element as shown in FIGS. 1 and 4 20 was obtained.

Also, a 0.4 μm insulating material layer 32 and a 0.2 μm Mg—Ag cathode connection electrode 33 are formed on the glass substrate 31 in a stripe shape by a known photolithography method. The external electrode substrate 30 as shown in FIG. 5 was formed. The first insulating material layer 22 and the second insulating material layer 24 are 0.4 μm and 0.3 μm, respectively, and the total thickness of the organic light emitting layer 25 and the cathode layer 26 = 0.05 + 0.05 + 0.1 = 0.
It is formed thicker than 2 microns.

Thereafter, in a nitrogen atmosphere, the stripe-shaped cathode connection electrode 33 of the external electrode substrate 30 and the display pixel 2
The two substrates were overlapped so that the cathode layer 26 of No. 7 was in pressure contact, and the periphery of the substrate where the display pixels 27 were not formed was sealed with an epoxy adhesive 80. At that time, epoxy adhesive 8
In FIG. 0, a ball or rod-shaped thickness control member 81 made of plastic, glass, or the like having a diameter of about 0.7 micron is used. The two substrates are bonded and fixed while maintaining a state in which a force greater than the load is not applied to the EL element.

(Embodiment 2) A description will be given with reference to FIGS. A glass substrate 41 provided with a transparent electrode film made of ITO having a thickness of 0.2 μm is prepared, and stripes are formed by photolithography so that the width of each stripe is 0.3 mm and the interval between stripes is 0.03 mm. The first transparent electrode layer 42 of the first layer was formed by patterning. A photoresist was applied on this substrate, and a photoresist 48a was formed in a region not to become a display pixel 49 later by a photolithography method. The entire surface of this substrate is SiO
The second film 43 was formed to a thickness of 0.5 μm by a sputtering method.

Next, a photoresist is applied, and a photoresist film 48b having a circular opening having a diameter of 20 μm is formed in the display pixel 49 by a photolithography method, and the exposed SiO 2 film is hydrofluoric acid. And removed by etching. As a result, the contact hole 44 was formed in the display pixel 49. Further, the SiO2 film 43 formed in the region other than the display pixel 49 was also removed at the same time, and a substrate having a cross section as shown in FIG. 7 was formed. After removing the photoresists 48a and 48b, a second ITO second electrode layer 45 is formed to a thickness of 0.15 μm by vapor deposition, and a series of first steps are performed. An EL element substrate 41 having the electrode layer thus obtained was obtained.

Subsequently, the substrate was washed and subjected to a heat treatment to reduce the resistance of the ITO layer 45. Thereafter, TPD 0.05 μm was used as a hole transport layer and AlQ 3 was used as a light emitting layer.
The organic light emitting layer 46 is formed by continuously depositing 0.05 μm.
Was formed on the entire surface of the substrate. Subsequently, magnesium and silver were co-deposited at a volume ratio of 20: 1 to form a cathode layer 47.
Is formed with a thickness of 0.1 micron as a monitor value.
By performing the steps, the EL element 40 was manufactured. The SiO2 film as the insulating material layer has a thickness of 0.5 micron, and is formed to be thicker than the total thickness of the organic light emitting layer 46 and the cathode layer 47 of 0.2 micron.

A substrate 31 in which the surface of a metal plate is coated with a black insulating paint is prepared, a striped Mg-Ag metal layer having the same pitch as the display pixels 49 is formed on the substrate, and a silver paste is applied thereon. Apply the metal layer stripe and 1
The silver paste on the Mg-Ag metal layer and the cathode layer 47 of the display pixel 49 were connected so that the stripe direction of the ITO electrode 42 of the layer was orthogonal to the stripe direction. An epoxy adhesive for sealing having a thickness control member of a predetermined diameter is applied to a region other than the display portion around the substrate by a dispenser so that the EL element seals the substrate 31 and the substrate 21 in a nitrogen atmosphere. To obtain a sealed dot matrix type EL light emitting device.

Example 3 A dot matrix type EL device 70 shown in FIG. 10 was manufactured by the steps shown in FIG. Chromium oxide, chromium, and Al were sequentially laminated on a glass substrate by a sputtering method, and were patterned by a photolithography method to form an auxiliary electrode layer 52 having a thickness of 0.08 μm. On top of that, the IT
A first electrode layer 53 composed of an O transparent electrode was formed in a thickness of 0.2 μm, and was patterned into a stripe shape by a photolithography method so that each stripe width was 0.3 mm and a stripe interval was 0.03 mm. Next, a photoresist is applied, and the pre-baking temperature of the resist to be applied after the application is increased to improve the adhesiveness to the substrate. Then, as shown in FIG. And the stripe-shaped first electrode layer 53
A photoresist 54 was formed at a position between them.

Next, an ultraviolet curable resin is applied to the surface of the substrate on which the photoresist 54 is formed by a spinner, and ultraviolet light is applied to the entire surface of the glass substrate from the side opposite to the surface on which the ultraviolet curable resin is formed without using a photomask. Irradiated. When irradiating the ultraviolet light, the ultraviolet light transmitted through the glass substrate 51 is directed from the side of the auxiliary electrode 52 where the photoresist 54a is formed on the protruding electrode portion 52b to the side of the side where the photoresist 54a is not formed. Irradiation was performed from an oblique direction so as to proceed. Thereby, the ultraviolet curable resin layer 5 having the inclined surface 55b having a widened foot on the substrate surface side
5 could be formed to a thickness of 0.8 microns. Subsequently, a second-layer ITO film is formed to a thickness of 0.3 μm on the entire display region without using a mask or the like by a sputtering method.
The photoresist 54 was removed, a second electrode layer 56 was formed, and an EL element substrate 51 patterned in a stripe shape was obtained.

Next, the EL element substrate was washed and heat-treated. On this substrate, TPD 0.05 micron as a hole transport layer and AlQ 3
The organic light emitting layer 57 is formed by continuously depositing 0.05 μm.
Was formed on the entire surface of the substrate. Subsequently, magnesium and silver were co-deposited at a volume ratio of 20: 1 to form a cathode layer 58.
Is formed with a thickness of 0.1 micron as a monitor value.
By performing the steps, the EL element 50 was manufactured. The ultraviolet curable resin layer 55, which is an insulating material layer, has a thickness of 0.8 μm, and the total thickness of the organic light emitting layer 46 and the cathode layer 47 is 0.1 μm.
It is formed thicker than 2 microns. Thus organic EL
Element 50 was obtained.

A substrate 61 in which the surface of a metal plate is covered with a black insulating paint is prepared, a stripe-shaped Al metal layer having the same pitch as the display pixels 59 is formed on the substrate, and a silver paste is applied thereon. The stripe of the metal layer and the stripe direction of the first ITO electrode layer 53 of the first layer are arranged so as to be orthogonal to each other.
Nine cathode layers 58 were connected. In a region other than the display portion around the substrate, a sealing epoxy adhesive having a thickness control member having a predetermined diameter is applied by screen printing to form an external electrode substrate 60 in the same manner as in the above-described embodiment. And a substrate 51 of the EL element 50 were adhered and fixed in a sealed manner to obtain a dot matrix type EL light emitting element 70 in which the distance between both substrates was sealed to a predetermined uniform thickness.

The stripe-shaped ITO electrode layer 22 of each of the EL elements 20, 40 and 50 produced in Examples 1, 2, and 3
When the probe needle is brought into contact with the cathode layers 26, 48, and 58 of the plurality of display pixels 27, 49, and 59 of each EL element using the anodes 42 and 53 as anodes, and a DC current is applied at 6 V, light is emitted for each display pixel. Was observed. At this time, the adjacent display pixels did not emit light. In addition, each EL element 20, 40, 5
0 display pixels 27, 49, 59 cathode layers 26, 48, 5
A matrix-type EL light-emitting element formed by connecting the stripe-shaped cathode connection electrodes 33, 33, and 62 of the external electrode substrate 30, and the external electrode substrates 30, 30, 60, respectively, to the cathode of the external electrode substrate with an ITO electrode as an anode. Using the connection electrode as the cathode,
When a direct current of 6 V was applied to each stripe, light emission was observed for each of the display pixels 27, 49, and 59 corresponding to the selected stripe, and non-selected display pixels did not emit light. Also,
The light emitting surface was uniform, and uniform light emission with good pattern accuracy was obtained in each of the examples.

[0058]

As described above, the EL device of the present invention utilizes the side surface step of the insulating material layer of the EL device substrate formed in the first step before the formation of the organic light emitting layer. Can be patterned. This eliminates the need to use a step of inhibiting the miniaturization, such as performing an etching process or forming a pattern on a display pixel via an evaporation mask after forming the organic light emitting layer and the organic light emitting layer. In addition, since the organic light emitting layer and the electrode layer formed thereon can be formed by a process such as simple continuous vapor deposition, the process is very simple, and the interface between the two is not contaminated, and there is no adhesion of dust or the like. Can be reduced. In particular, since the organic light emitting layer and the like are not formed on the EL element substrate formed in the first step, the substrate can be carefully washed, and the organic light emitting layer and the electrode layer are continuously formed on the substrate immediately after the cleaning. Due to the formation, defects due to dust are significantly reduced. As a result, the occurrence of dark spots, which was a problem in the organic EL device, was also reduced.

Further, since the EL element of the present invention has an independent electrode layer on the surface for each display pixel, dot matrix display can be easily performed by connecting this electrode layer to other prepared electrodes. Obtainable. According to the method for manufacturing an EL device of the present invention, since patterning is performed in a step of a substrate stage before forming an organic light emitting layer, a fine pattern is formed by using a known photolithography method or the like. Can be created with high accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an electroluminescent device and an external electrode substrate of the present invention.

FIG. 2 is a cross-sectional view illustrating a manufacturing process of the electroluminescent device of FIG.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of the electroluminescent device of FIG.

FIG. 4 is a cross-sectional view illustrating a process of manufacturing the electroluminescent device of FIG.

FIG. 5 is a schematic sectional view illustrating the dot matrix type electroluminescent device of FIG.

FIG. 6 is a schematic perspective view illustrating another electroluminescent device of the present invention.

FIG. 7 is a cross-sectional view illustrating a process of manufacturing the electroluminescent device of FIG.

FIG. 8 is a cross-sectional view illustrating a step of manufacturing the electroluminescent device of FIG.

FIG. 9 is a cross-sectional view illustrating a step of manufacturing the electroluminescent device of FIG.

FIG. 10 is a schematic perspective view illustrating still another electroluminescent device of the present invention.

11 is a plan view of a main part for describing a manufacturing process of the electroluminescent device of FIG.

FIG. 12 is a plan view of a main part for explaining a manufacturing process of the electroluminescent device of FIG. 10;

FIG. 13 is an enlarged plan view showing a main part for explaining a manufacturing process of the electroluminescent device of FIG. 10;

FIG. 14 is a schematic sectional view illustrating a manufacturing process of the electroluminescent device of FIG. 10;

FIG. 15 is a schematic sectional view of a conventional organic EL light emitting device.

[Explanation of symbols]

 Reference Signs List 1 substrate 2 transparent electrode 3 organic light emitting layer 4 metal electrode 20, 40, 50 EL light emitting element 21, 31, 51 EL element substrate 22 first insulating material layer 23, 42, 53 first electrode layer 24 second insulating material Layers 25, 46, 57 Organic light emitting layers 26, 47, 58 Cathode layer 27, 49, 59 Display pixel 30 External substrate 33 Cathode connection electrode 43, 55 Insulating material layer 70, 71 Dot matrix EL element 80 Epoxy adhesive 81 Thickness control member

Claims (10)

[Claims] 1. An electroluminescent device having an organic light emitting layer sandwiched between a pair of electrodes having different work functions on a substrate, wherein the substrate has a total thickness of not less than the total thickness of the organic light emitting layer and the second electrode layer. A first insulating material layer having a thickness, and a first electrode layer formed on the insulating material layer, both layers being formed in a predetermined pattern, and a display pixel on the first electrode layer; A second insulating material layer having a thickness equal to or greater than the total thickness of the organic light emitting layer and the second electrode layer is formed in a region other than the region to be formed. And an organic light emitting layer and a second electrode layer having a different work function from the first electrode layer are sequentially stacked. 2. An electroluminescent device having an organic light emitting layer sandwiched between a pair of electrodes having different work functions on a substrate, wherein a first electrode layer having a predetermined pattern is formed on the substrate. An insulating material layer having a thickness equal to or greater than the total thickness of the organic light emitting layer and the third electrode layer is formed in a region to be a display pixel on the one electrode layer. A second electrode layer is formed on the side surface of the insulating material layer or on the inner surface of the through-hole provided as necessary in the insulating material layer, and the first electrode layer and the second electrode layer are electrically connected to each other so as to sandwich the insulating material layer. And an organic light emitting layer and a third electrode layer having a work function different from that of the second electrode layer are sequentially stacked on the second electrode layer formed on the insulating material layer. Electroluminescent element. 3. The electroluminescent device according to claim 1 or 2, wherein a substrate on which the electroluminescent device is formed and an external electrode substrate having electrodes formed in a predetermined pattern are disposed to face each other, thereby forming the electroluminescent device. An electroluminescent element substrate and an external electrode substrate are bonded to each other so that an electrode layer on a surface of a region to be a display pixel of the substrate and an electrode of the external electrode substrate are electrically connected to each other and bonded to each other. Light emitting element. 4. The electroluminescent device according to claim 1, wherein the electrode layer formed on the surface of the region serving as the display pixel is a cathode. 5. The electroluminescent device according to claim 3, wherein the electroluminescent device substrate and the external electrode substrate are bonded with an adhesive mixed with a thickness control member having a predetermined diameter.
An electroluminescent device characterized by the above-mentioned. 6. The electroluminescent device according to claim 3, wherein an electrode layer formed on the electroluminescent device substrate and an electrode layer formed on an external electrode substrate are formed in a stripe pattern. And a stripe-shaped electrode layer pattern formed on both substrates is disposed to face each other so as to be orthogonal to each other. 7. The method according to claim 3, 5 or 6.
The electrode layer formed on an external electrode substrate is formed of a low-resistance metal material, and the electrode layer on the surface of the substrate on which the electroluminescent element is formed as a display pixel has an electron injecting property. An electroluminescent device, comprising an electrode. 8. A step of preparing an insulative substrate, and forming a first insulative material layer and a first electrode layer having a thickness equal to or greater than the total thickness of the organic light emitting layer and the second electrode layer on the substrate. And a step other than a region to be a display pixel on the first electrode layer,
Forming a second insulating material layer having a thickness equal to or greater than the total thickness of the organic light emitting layer and the second electrode layer; and forming the first insulating material layer, the first electrode layer, and the second insulating material layer. A first step having a step of forming a predetermined pattern, and a second step of sequentially laminating an organic light emitting layer and a second electrode layer over substantially the entire surface of the substrate on which the predetermined pattern has been formed in the first step; A method for manufacturing an electroluminescent device, comprising: 9. A step of preparing an insulating substrate; a step of forming a first electrode layer on the substrate; and an organic light emitting layer and a third electrode in a region on the first electrode layer which is to be a display pixel. Forming an insulating material layer having a thickness equal to or greater than the total thickness of the first electrode layer and the insulating material layer in a predetermined pattern; The second electrode layer is formed on the side surface of the insulating material layer or on the inner surface of the through hole provided as necessary in the insulating material layer, and the first electrode layer and the second electrode layer are electrically connected so that the insulating material layer is interposed therebetween. And a second step of sequentially laminating an organic light emitting layer and a second electrode layer over substantially the entire surface of the substrate on which the predetermined pattern has been formed in the first step. A method for manufacturing a light-emitting element. 10. A step of preparing a substrate on which the electroluminescent device according to claim 1 or 2 is formed; a step of preparing an external electrode substrate having electrodes formed in a predetermined pattern; Forming an electrode layer on the surface of a region serving as a display pixel of the substrate on which the electrodes are formed and electrodes of the external electrode substrate so as to be electrically connected to each other, and bonding the two substrates. A method for manufacturing an electroluminescent device.