JPH10134329A - Method for working solder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the roughening of a working surface by suppressing the temp. rise of the working surface in the case the ABS surfaces of solder is worked by dry etching. SOLUTION: Liquid polyimide 34 is applied in the form of a thin film on a work substrate 32 and solder 26 are lined up thereon and are press bonded thereto. The work substrate 32 is baked to cure the polyimide 34 and to fix the solder 26. The ABS surfaces of the solder 26 are dry etched in this state to form rails. The work substrate 32 is immersed into the solvent of the polyimide 34 after the end of the dry etching to peel the solder 26 from the work substrate 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a low ABS in which a plurality of magnetic heads are arranged in a horizontal direction in a process of manufacturing a magnetic head used for a hard disk device or the like.
(Air Bearing Sueface) A method of groove-grooving a rail by dry etching on a surface, which prevents roughness of the processed surface due to temperature rise.

[0002]

2. Description of the Related Art A manufacturing process of a conventional magnetic head for a hard disk drive will be described with reference to FIG. A number of thin-film magnetic head elements 22 are formed on a wafer 21 by photolithography. In order to prevent chipping (chipping) at the time of cutting on the surface of the wafer 21, cut in the vertical and horizontal directions with the slider 12 unit
Process 4,25. The wafer 21 is cut along the horizontal cuts 25. Each of the cut pieces is referred to as a row 26. Grind the ABS surface 28 for the cut row 26,
Grind. Then, a groove 30 is formed in the ABS 28 by forming a groove.
Are formed, thereby forming the rails 14 and 16. The individual magnetic heads 10 are cut by the vertical cuts 24.
To complete.

The grooving process in the above process can be performed by using, for example, dry etching. When the groove is formed by dry etching, as shown in FIG. 5, a double-sided adhesive tape 42 is attached to one surface of a work substrate 32 made of glass or the like, and a plurality of rows 26 are placed thereon with the ABS 28 facing upward. Arrange and fix at predetermined intervals. In this state, a resist frame having a rail pattern is formed on the ABS surface 28 with a mask film or the like, the work substrate 32 is housed in a vacuum chamber, and ion gas is irradiated onto the ABS surface 28, and portions other than the rails are cut and dug ( A rail is formed by ion milling. When dry etching is completed, the work substrate 3
2 is taken out of the vacuum chamber, and the row 26 is peeled off from the work substrate 32.

[0004]

As shown in FIG. 5, the method of attaching the row 26 to the work substrate 32 with the double-sided adhesive tape 42 and performing groove forming by dry etching has the following problems. (A) Since the double-sided pressure-sensitive adhesive tape has low heat resistance, the adhesive property is changed by heating by dry etching, and the tape may peel off during the etching. In particular, it is easy to peel off when etching for a long time to make deep digging.

(B) The pressure-sensitive adhesive layer has a thickness of about 250 μm (even 50 μm even if it is thin) and has poor heat conduction.
2, the temperature of the processed surface of the row 26 rises.
Due to this temperature rise, the processing surface becomes rough, and the flying characteristics of the slider 12 after the magnetic head is completed vary. In particular, when etching is performed for a long time to perform deep digging, roughness of a processed surface is likely to occur.

(C) Burn-in of the mask film occurs due to an increase in the temperature of the processing surface of the row 26, and a residual film occurs when the mask film is peeled off after dry etching, resulting in a defective product.

(D) After dry etching, row 2
When peeling 6 from the work substrate 32, the row 26 may be broken due to excessive force.

It is also conceivable to bond the row 26 to the work substrate 32 by using a normal novolak-based positive resist or a synthetic rubber-based resist as an adhesive instead of the double-sided adhesive tape. The heating (close to 200 ° C.) or ion implantation during dry etching alters (carbonizes), resulting in a problem that the row 26 cannot be peeled off from the work substrate 32 after the dry etching is completed, or cannot be removed while being attached to the row 26.

The present invention solves the above-mentioned problems in the prior art and aims to provide a row processing method which prevents roughening of the processed surface and peeling of the row when the ABS surface is processed by dry etching. Is what you do.

[0010]

According to the present invention, a liquid polyimide is applied on a work substrate in a thin film form, and a plurality of rows before being divided into sliders are formed on the liquid polyimide film by an ABS surface. , The liquid polyimide is cured, the row is bonded and fixed on the work board, and in this state, the ABS surface of the row is dry-etched and processed into a predetermined rail pattern. It is. According to this, the polyimide has a heat resistance of 350 to 40.
Since the temperature is as high as 0 ° C and it does not deteriorate due to heat generated by dry etching (near 200 ° C) or ion implantation, it is necessary to stably fix the row to the work substrate even when dry etching is performed for a long time in order to make deep digging. it can.

Further, since the liquid polyimide can be applied in a thin film form and has good adhesiveness with a row, good thermal conductivity can be obtained. Therefore, the heat of the row can be efficiently released to the work board during dry etching, and the temperature rise of the processed surface of the row can be suppressed even when dry etching is performed for a long time, and the roughened surface can be prevented. Slider can be obtained.
In addition, when the row is attached to the work substrate on which the liquid polyimide thin film is applied, if the liquid polyimide sufficiently penetrates into the gap between the rows, the end surface around the row is protected, and the row is removed during dry etching. Can be prevented from adhering to the peripheral end surface and etching of the protective film such as alumina on the surface on which the magnetic head element is formed. In addition, since polyimide is hardly deteriorated by milling ions during dry etching, if it is immersed in a polyimide solvent for each work substrate after dry etching, the polyimide dissolves and the row is easily and cleanly peeled from the work substrate can do.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is shown in the process diagrams of FIGS. Each step will be described. A work substrate 32 such as glass is prepared. A liquid polyimide 34 is dropped on the work substrate 32. The work substrate 32 is set on a spin coater and rotated, and a polyimide 34 is uniformly applied on the surface of the work substrate 32 to a thickness of, for example, about 1 μm. In this case, the thickness of the coating film can be adjusted by adjusting the number of rotations of the spin coater to 4500.
A 1 μm polyimide film 34 is formed at rpm.

A plurality of rows 26 are placed on a work board 32.
Are arranged at appropriate gaps and crimped. At this time, the liquid polyimide 34 extruded by crimping is combined with the row 26 and the row 2.
6 to cover and protect the end face of the row 26.

The height at which the polyimide 34 enters the gap is
If the gap 38 is the same, the gap varies depending on the thickness of the polyimide film 34 in the process. FIG. 3 shows this state, and each of the gaps 38 is 15 μm.
(A) is a case where the thickness of the polyimide film 34 is 3 μm. The polyimide 34 rises to the ABS 28 on the surface of the row 26, which hinders the digging of the ABS 28. (B) is a case where the coating thickness is 0.5 μm, and the polyimide 34 cannot sufficiently fill the gap 38,
The end face 26a of the row 26 cannot be sufficiently protected. (C) shows the case where the thickness of the coating film is 1 μm, and the polyimide 34 almost completely fills the gap 38 and the end face 26 of the row 26.
a can be protected and the ABS surface 28 cannot be reached. Therefore, when the gap 38 between the rows 26 is set to about 15 μm, the polyimide 3
It is desirable that the coating thickness of No. 4 be about 1 μm.

The work board 32 to which the row 26 is crimped
Is placed in a baking oven and baked at about 130 ° C. to cure the polyimide 34, and the row 26 is bonded and fixed to the work substrate 32. One resist film (dry film) 48 is attached to the entire ABS surface 28 so as to cover all the rows 26. Then, a mask 5 on which a predetermined rail pattern is drawn
Exposure is performed with 0 positioned above. After exposure, development is performed to cut the resist film 48 into a rail pattern (removing portions other than portions left as rails).

The work board 32 to which the row 26 is attached
Is housed in a vacuum chamber 52 and is placed and held on a cooling device 54 that has been forcibly cooled. At this time, the work board 3
The lower surface of 2 is in close contact with cooling surface 56 of cooling device 54. Then, an ion gas (milling ion) 60 such as argon is irradiated from an ion gun 58 disposed above to expose the ABS surface exposed from between the resist frames 48 ′ (resist portions left by the rail pattern cut). 28 is cut and dug by ion milling to process the rail. After ion milling, the work substrate 32 is taken out of the vacuum chamber 52, and the resist frame 48 'is removed with a solvent.

The work substrate 32 is immersed in a solvent for dissolving the polyimide to dissolve the polyimide 34. As the solvent, for example, NMP (N-methyl-2-pyrrolidone) can be used. Since the polyimide 34 has not undergone deterioration such as carbonization, the row 26 can be separated from the work substrate 32 by immersing the work substrate 32 in NMP for 2 to 3 minutes. After the peeling of the row 26 is completed, the row 26 is washed and then cut into individual slides. If a film that can be dissolved by NMP is used as the dry film 48, the removal of the resist frame 48 'and
6 can be simultaneously performed.

Table 1 shows a comparison of various bonding methods for the row 26.

[0019]

[Table 1] According to Table 1, it is understood that the method of bonding the row using polyimide is the most excellent.

[Brief description of the drawings]

FIG. 1 is a process chart showing an embodiment of the present invention.

FIG. 2 is a process drawing showing a continuation of FIG. 1;

FIG. 3 is a diagram showing how the amount of polyimide entering between rows changes according to the thickness of the polyimide film in the process of FIG. 1;

FIG. 4 is a diagram showing a manufacturing process of the magnetic head.

FIG. 5 is a perspective view showing a conventional method in which a row is attached to a work substrate with a double-sided adhesive tape.

[Explanation of symbols]

 12 slider 26 low 28 ABS 32 work substrate 34 polyimide

Claims (2)

[Claims] 1. A liquid polyimide is applied on a work substrate in a thin film form, and a plurality of rows in a state before being divided into sliders are arranged on the liquid polyimide film with the ABS side facing up. The liquid polyimide is cured and the row is bonded and fixed on the work substrate.
A row processing method in which the S surface is dry-etched into a predetermined rail pattern. 2. The method of processing a row according to claim 1, wherein after the dry etching of the ABS is completed, the work substrate is immersed in a solvent of polyimide to peel the row from the work substrate.