JPH1013010A - Method for fixing electronic component and electronic component used for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for fixing electronic components that can reinforce the fixing strength of such electronic components as a connector easily and inexpensively and electronic components used for the method. SOLUTION: A sheet-shaped thermoplastic adhesive 8 is adhered to the bottom surface of a connector outer enclosure 2, and at the same time a double- sided tape 7 is adhered so that it is positioned between a connector pin 3 that is an electrical connection part being soldered to a substrate 4 and the sheet- shaped thermoplastic adhesive 8. After that, connectors 1 are installed on the substrate 4 and are carried to a solder dip bath 66 for soldering the connector pin 3. In this case, the sheet-shaped thermoplastic adhesive 8 is simultaneously heated and melted owing to the heat of a flow solder 65, is cooled, and then is hardened, thus causing the connectors 1 to be adhered and fixed to the substrate 4 strongly owing to the sheet-shaped thermoplastic adhesive 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing an electronic component and an electronic component used in the method, and is particularly useful for fixing a connector to a substrate.

[0002]

2. Description of the Related Art In order to reduce the size of various electronic devices,
High-density mounting of electronic components has been attempted. With such high-density mounting, connectors are required to have particularly high mounting strength (fixing strength to a substrate). This is because the pitch of the connector pins becomes smaller with higher density mounting, but if the pitch is smaller than a certain level, the strength of the soldered portion becomes weaker.

On the other hand, conventionally, the fixing strength of the connector is enhanced by bonding the outer housing of the connector with a bond or enlarging a pattern land for soldering the connector pin.

FIG. 4A is a perspective view showing an example of fixing a connector, and FIG. 4B is an enlarged cross-sectional view taken along line HH of FIG. 4A. As shown in these figures, the connector 1
The connector pins 3 are inserted into holes 4a formed in the board 4 and the ends of the connector pins 3 are soldered to pattern lands 5 formed on the back side of the board 4 (solder 6). 4 is implemented. Then, in order to enhance the fixing strength of the connector 1, as described above, measures such as providing the bond lock 61 on both sides of the connector outer casing 2 and enlarging the pattern land 5 are taken. The bond lock 61 is obtained by applying a UV adhesive on both sides of the connector outer housing 2 and irradiating the adhesive with UV (ultraviolet light) to solidify the adhesive.

[0005]

However, fixing the bond lock 61 or enlarging the pattern land 5 as described above is not sufficient in fixing strength. Therefore, when attaching or detaching another connector to or from the connector 1, FIG. As shown by the dashed line in (b), when the connector pin 3 is deflected by the force F applied to the connector 1, several times the force F is applied to the solder 6 by leverage, and the solder 6 is cracked. I will. For this reason, conventionally, the fixing strength of the connector 1 has been enhanced by taking complicated steps and costs.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component fixing method capable of enhancing the fixing strength of an electronic component such as a connector easily and at low cost, and an electronic component used in this method. And

[0007]

Means for Solving the Problems A first method for solving the above problems is described below.
The method for fixing an electronic component according to the invention includes, after adhering a sheet-like thermoplastic adhesive to a fixing surface of the electronic component or the substrate, mounting the electronic component on the substrate, and flow soldering the electronic component to the substrate. The electronic component is attached and fixed to the substrate by the sheet-like thermoplastic adhesive at the same time.

According to a second aspect of the present invention, there is provided the electronic component fixing method according to the first aspect, wherein at least the electronic component is attached to the substrate before the electronic component is placed on the substrate. An electrical connection to be soldered;
As located between the sheet-like thermoplastic adhesive,
A double-sided tape is attached to a fixing surface of the electronic component or the substrate.

The electronic component according to a third aspect of the present invention is characterized in that a sheet-like thermoplastic adhesive is adhered to the fixed surface.

The electronic component according to a fourth aspect of the present invention is the electronic component according to the third aspect.
In the electronic component according to the present invention, a double-sided tape is attached to the fixing surface so as to be located at least between the electrical connection portion to be soldered to the substrate and the sheet-like thermoplastic adhesive.

According to the method for fixing an electronic component of the first invention, the electronic component is subjected to flow soldering or reflow soldering, and at the same time, the sheet-like thermoplastic adhesive is heated and melted, and then cooled and solidified. The electronic component is firmly adhered and fixed to the substrate by the sheet-like thermoplastic adhesive. That is, for example, in the case of a conventional bond lock, UV
Is applied to solidify the UV-based adhesive. According to this method, the electronic component can be easily and firmly adhered and fixed to the substrate without such a special step.

Further, according to the electronic component fixing method of the second invention, the double-sided tape is used so that the electronic component does not move until the electronic component is fixed to the substrate by the sheet-like thermoplastic adhesive. The electronic component can be securely and easily fixed to the substrate, and the double-sided tape allows the molten sheet-like thermoplastic adhesive to flow out and solder the electrical connection portions (such as connector pins) of the electronic component. It can be prevented from seeping into the part. Furthermore,
When the double-sided tape surrounds the sheet-like thermoplastic adhesive, the molten sheet-like thermoplastic adhesive flows out around the electronic component, impairing the appearance, or causing other electronic components to be in close proximity. In such a case, it is possible to prevent the infiltration into the soldered portion of the other electronic component.

According to the electronic component of the third or fourth aspect of the present invention, since the sheet-like thermoplastic adhesive or the sheet-like thermoplastic adhesive and the double-sided tape are previously attached to the electronic component, In the mounting step, the electronic component mounting operation can be performed more efficiently without the need for the operation of attaching a sheet-like thermoplastic adhesive or a double-sided tape.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an explanatory view of a method for fixing an electronic component according to an embodiment of the present invention. FIG. 1 (a) shows a fixing surface of a connector ((c) in the direction of arrow A), and FIG. () Shows a state at the time of flow soldering, (c) shows a fixed state of the connector, and (d) shows an enlarged cross section taken along line BB of (c). A method for fixing an electronic component according to the present embodiment will be described with reference to these drawings. Here, a case of a connector is shown as an example of an electronic component.

(1) As shown in FIG. 1 (a), first, on a bottom surface of a connector outer casing 2 which is a fixing surface of the connector 1,
The sheet-like thermoplastic adhesive 8 is adhered. Specifically, the heated and melted thermoplastic adhesive is applied to the bottom surface of the connector housing 2 so as to be spread in a sheet shape, or a thermoplastic adhesive formed in a sheet shape in advance is used as another adhesive. Affix to the bottom of the connector housing 2 with a tape or tape. As the thermoplastic adhesive, for example, a commercially available dofix hot melt (having ethylene-vinyl acetate copolymer resin as a main component) can be used. This hot melt conforms to the UL standard for insulation properties and is easy to manage in terms of safety standards.

(2) Further, on the bottom of the connector housing 2,
Attach double-sided tape 7. The double-sided tape 7 is attached so as to be located between the sheet-like thermoplastic adhesive 8 and the connector pin 3 which is an electrical connection part to be soldered to the substrate. As the double-sided tape 7, a commercially available tape can be used. This double-sided tape is a fibrous material such as paper that can be bonded to both sides, and has an adhesive force even at room temperature.

The subsequent steps are the same as the conventional flow soldering.

(3) That is, as shown in FIG. 1B, the connector pins 3 are inserted into the holes 9 of the substrate 4 so that
The connector 1 is set on the board 4.

(4) Subsequently, as shown in FIG.
The board 4 on which the connector 1 is installed is placed in the solder dipping bath 66.
The substrate 4 is conveyed toward the flow solder 65 ejected from the substrate 4, and the lower surface of the substrate 4 is immersed (dipped) in the flow solder 65.
Then, the dipped solder cools and solidifies, so that the lower end of the connector pin 3 is soldered.

At the same time, the sheet-like thermoplastic adhesive 8 is also heated and melted by the heat of the flow solder 65 and then cooled and solidified. As a result, the connector 1 is firmly adhered and fixed to the substrate 4 by the sheet-like thermoplastic adhesive 8.

As described above, according to the method of fixing an electronic component according to the present embodiment, for example, in the case of a conventional bond lock, UV is irradiated to solidify the UV-based adhesive. The connector 1 can be firmly adhered and fixed to the substrate 4 by the sheet-like thermoplastic adhesive 8 at the same time as performing the flow soldering without requiring any special process. As shown in FIG. 1 (d), even when a force F is applied to the connector 1 when another connector is attached to or detached from the connector 1, the connector pins 3 are firmly adhered and fixed by the sheet-like thermoplastic adhesive 8. It is possible to prevent the solder 6 from cracking by suppressing the swing. Further, since there is no need to apply a bond lock or enlarge the pattern land as in the related art, and since no complicated man-hours or the like are required, the mounting operation is easy and the cost is low.

Further, the connector 1 is securely and easily fixed to the substrate 4 by the double-sided tape 7 so that the connector 1 does not move until the connector 1 is bonded and fixed to the substrate 4 by the sheet-like thermoplastic adhesive 8. In addition, the double-sided tape 7 can prevent the melted sheet-like thermoplastic adhesive 8 from flowing out and seeping into the soldered portion of the connector pin 3.

Furthermore, if the double-sided tape 7 is applied not only between the sheet-like thermoplastic adhesive 8 and the connector pins 3 but also around the sheet-like thermoplastic adhesive 8, the molten sheet-like thermoplastic adhesive It is also possible to prevent the agent 8 from leaking out to the surroundings, impairing the appearance, and infiltrating the soldered portion of the other electronic component when the other electronic component is in close proximity.

In the above, the sheet-like thermoplastic adhesive 8 and the double-sided tape 7 are attached to the connector 1 in the mounting process of the electronic component. 1 may be attached. By doing so, in the mounting process of the electronic component, it is not necessary to attach the sheet-like thermoplastic adhesive 8 or the double-sided tape 7, and the mounting operation of the electronic component can be performed more efficiently. For example, if the electronic component maker (or the electronic component manufacturing department) provides the connector 1 to which the sheet-like thermoplastic adhesive 8 and the double-sided tape 7 are attached, the electronic device maker (or the electronic device manufacturing department) will have more Electronic components can be efficiently mounted.

Although the present invention is useful when applied to a connector that requires a relatively large force each time it is attached and detached, the present invention is not limited to the connector but can be applied to various electronic components. In particular, in the case where earthquake resistance is required such as electronic equipment mounted on an automobile, it is effective to apply the present invention to electronic components other than the connector to increase the fixing strength.

Some examples of electronic components other than the connector 1 are shown in FIGS. FIGS. 2A and 2C are perspective views showing examples of connectors having other shapes to be flow-soldered.
2 (b) and 2 (d) are views in the direction of arrows C and D in FIGS. 2 (a) and 2 (c), and FIG. 2 (e) is a perspective view showing an example of electronic components other than the connector to be flow soldered. FIG. 2F shows FIG.
FIG. 5E is a view in the direction of arrow E in FIG. 3A is a perspective view showing an example of a connector to be reflow-soldered, FIG. 3B is a view in the direction of arrow F in FIG. 3A, and FIG. Perspective view showing an electronic component example,
FIG. 3D is a view in the direction of arrow G in FIG. 3C.

Connector 1 shown in FIGS. 2 (a) to 2 (d)
In 1 and 21, similarly to the connector 1, the sheet-like thermoplastic adhesive 8 is attached to the bottom surfaces of the connector outer casings 12 and 22, and the connector pins 13 and 23 and the sheet-like thermoplastic adhesive 8 are bonded. The double-sided tape 7 is attached so as to be located between them. In the electronic components (capacitors and the like) 31 shown in FIGS. 2E and 2F, the sheet-like thermoplastic adhesive 8 is adhered to the bottom surface of the main body 32, and both sides as the electrical connection portions to be soldered. The two double-sided tapes 7 are attached so as to be located between the lead 33 and the sheet-like thermoplastic adhesive 8.

The connector 41 shown in FIGS. 3 (a) and 3 (b)
Then, the sheet-like thermoplastic adhesive 8 is adhered to the bottom surface of the connector outer housing 42, and the position between the lead 43 on both sides, which is an electrical connection portion to be soldered, and the sheet-like thermoplastic adhesive 8. Two double-sided tapes 7 are adhered. 2C and 2D, the sheet-like thermoplastic adhesive 8 is attached to the bottom surface of the main body 52, and the electrical connection portions 53 on both sides to be soldered. Two double-sided tapes 7 are attached so as to be located between the sheet-like thermoplastic adhesive 8 and the sheet-like thermoplastic adhesive 8. However, it is considered that there are cases where it is difficult to attach the double-sided tape 7 because the electronic components 51 are generally very small in many cases. In this case, however, the molten sheet-like thermoplastic adhesive 8 is soldered. The adhering area may be adjusted appropriately so that only the sheet-like thermoplastic adhesive 8 is adhered so as not to penetrate into the attaching portion.

Note that these surface-mounting connectors 41
In the case of an electronic component (such as a resistor) 51, it is placed on a substrate and then placed in a reflow oven, where soldering is performed by heating to melt the cream solder. 8 is also heated and melted in the reflow furnace.

In the above description, the sheet-like thermoplastic adhesive or the double-sided tape is attached to the electronic component side such as the connector. However, the sheet-like thermoplastic adhesive or the double-sided tape may be attached to the substrate side. Good.

[0032]

As described above in detail with the embodiments of the present invention, according to the method for fixing an electronic component of the present invention,
The electronic component can be firmly bonded and fixed to the substrate by the sheet-like thermoplastic adhesive at the same time as the flow soldering or the reflow soldering without requiring a special step such as UV irradiation. Further, since there is no need to apply a bond lock or enlarge the pattern land as in the related art, and since no complicated man-hours or the like are required, the mounting operation is easy and the cost is low.

Further, by applying a double-sided tape between the electrical connection portion of the electronic component and the sheet-like thermoplastic adhesive, the molten sheet-like thermoplastic adhesive flows out and the soldering portion of the electrical connection portion is formed. It is possible to prevent seepage. Furthermore, when the double-sided tape surrounds the sheet-like thermoplastic adhesive, the melted sheet-like thermoplastic adhesive flows out around the electronic components, impairing the appearance, or causing other electronic components to be damaged. In the case where the electronic components are close to each other, it is possible to prevent the other electronic components from penetrating into the soldered portion.

If a sheet-like thermoplastic adhesive or an electronic component to which the sheet-like thermoplastic adhesive and the double-sided tape are adhered is provided, the sheet-like thermoplastic adhesive and the double-sided double-sided tape are used in the mounting process of the electronic component. No need to attach tape
Electronic components can be mounted more efficiently.

[Brief description of the drawings]

FIGS. 1A and 1B are explanatory diagrams of a method for fixing an electronic component according to an embodiment of the present invention, wherein FIG. 1A shows a fixing surface of a connector (a direction A in FIG. 1C), and FIG. Shows a state at the time of flow soldering, (c) shows a fixed state of the connector, and (d) shows an enlarged cross section taken along line AA of (c). .

FIGS. 2 (a) and 2 (c) are perspective views showing examples of a connector having another shape to be flow-soldered, and FIGS. 2 (b) and 2 (d) are views in arrows C and D of FIGS. FIG. 3E is a perspective view showing an example of an electronic component other than the connector to be flow-soldered, and FIG. 4F is a view in the direction of arrow E in FIG.

3A is a perspective view showing an example of a connector to be reflow-soldered, FIG. 3B is a view in the direction of arrow F in FIG. 3A, and FIG.
FIG. 3 is a perspective view showing an example of an electronic component other than the connector to be reflow-soldered, and FIG. 4D is a view in the direction of arrow G in FIG. .

FIG. 4A is a perspective view showing an example of fixing a connector.
(B) is an enlarged cross-sectional view taken along line HH of (a).

[Explanation of symbols]

 1, 11, 21, 41 Connector 2, 12, 22, 42 Connector outer housing 3, 13, 23, 43 Connector pin 4 Board 7 Double-sided tape 8 Sheet-shaped thermoplastic adhesive 31, 51 Electronic components other than connectors

Claims (4)

[Claims] 1. After attaching a sheet-like thermoplastic adhesive to a fixed surface of an electronic component or a substrate, the electronic component is placed on the substrate, and the electronic component is flow-soldered or reflow-soldered to the substrate. And fixing the electronic component to the substrate simultaneously with the sheet-like thermoplastic adhesive. 2. The method of fixing an electronic component according to claim 1, wherein before the electronic component is mounted on the substrate, at least an electrical connection portion soldered to the substrate of the electronic component, and the sheet. A method of fixing an electronic component, comprising: attaching a double-sided tape to a fixing surface of the electronic component or the substrate so as to be located between the electronic component and the thermoplastic adhesive. 3. An electronic component wherein a sheet-like thermoplastic adhesive is adhered to a fixed surface. 4. The electronic component according to claim 3, wherein a double-sided tape is attached to a fixing surface so as to be located at least between an electrical connection portion to be soldered to a substrate and the sheet-like thermoplastic adhesive. An electronic component characterized by being attached.