JP2006120940A - Electronic component mounting board, heating device, and shield case mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting board on which a shield case can be mounted without any mounting failure of an electronic component with increased working and heating efficiencies, an electronic component mounting board having the shield case mounted thereon, a heating device, and also a shield case mounting method. <P>SOLUTION: Electronic components 2, 3, 4 are mounted on the front surface of an electronic component mounting board 1, and electronic components 5, 6 are mounted on the rear surface of the board. A case joining pattern 7 for joining a shield case 12 onto the surface of the board 1 is formed on the front surface of the board 1 at a suitable position, and a heat adjusting pattern 8 is formed on the rear surface of the board 1 opposed to its front surface so as to correspond to the case joining pattern 7. The case joining pattern 7 and the heat adjusting pattern 8 are connected to each other by through-hole conductors 10 formed on the wall surfaces of through holes 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting board for mounting a shield case, a heating apparatus for mounting a shield case on an electronic component mounting board, and a shield case mounting method for mounting a shield case on an electronic component mounting board.

  2. Description of the Related Art Conventionally, a technique for mounting a shield case on an electronic component mounting board in order to shield the electronic component mounted on the electronic component mounting board from electromagnetic waves is known.

  FIG. 10 is a schematic side view showing a state in which a shield case is mounted on a conventional electronic component mounting board.

  Electronic components 102, 103, and 104 are mounted (connected) on the front surface of the electronic component mounting substrate 101 via appropriately formed wiring patterns, and electronic components 105 and 106 are mounted (connected) on the back surface. is there. For example, the electronic component 102 is a microwave integrated circuit, the electronic components 103 and 105 are chip resistors, and the electronic components 104 and 106 are chip capacitors.

  On the surface of the electronic component mounting substrate 101, a case bonding pattern 107 for bonding a metal shield case 112 is formed at an appropriate position (for example, the outer peripheral position of the area where the shield case 112 is required). A solder paste 111 is attached to the surface of the case bonding pattern 107 in order to bond the shield case 112.

  After checking the mounting state of the electronic components 102, 103, 104, 105, 106, the shield case 112 is placed on the solder paste 111 of the electronic component mounting substrate 101 (case bonding pattern 107). Thereafter, the case bonding pattern 107 is heated by the soldering iron 130, whereby the solder paste 111 is heated and melted, and the bonding pattern 107 and the shield case 112 are bonded.

As other conventional techniques, soldering by reflow, soldering for locally heating a case bonding pattern with a heater, soldering for heating from the back side of an electronic component mounting board, and the like are known. Further, for example, Patent Document 1 is a prior document relating to the connection between an electronic component mounting board (printed wiring board) and an electronic component.
JP-A-8-23160

  However, manual soldering using a soldering iron or the like has a problem that work efficiency is poor. Also, soldering by reflow may remelt the solder of electronic components that have been mounted in advance, and there may be mounting defects such as misalignment of small electronic components and shorting or opening of solder bumps of high-definition pitch components such as CSP. There is a problem that it may occur.

  Soldering that heats the case bonding pattern locally with a heater cannot increase the case bonding pattern in order to increase the component mounting density, and the pattern area for contacting the heater with the case bonding pattern cannot be secured. There is. In addition, the shield case may be heated directly as a countermeasure. However, heat is taken by the shield case and heating to the case bonding pattern becomes insufficient, and it takes time to solder the case bonding pattern and the shield case. There is a problem of becoming insufficient.

  In addition, when heating from the back side of the electronic component mounting board, the electronic component mounting board is made of a resin material, and since it has a certain thickness to maintain strength, a sufficient amount of heat cannot be supplied (time Or overheating causes damage to the electronic component mounting board, or re-melting of the solder of the electronic component mounted around the heated or soldered location, resulting in mounting defects such as soldering short or open. There arises a problem in that it causes a decrease in reliability.

  The present invention has been made in view of such a situation, and has a through-hole conductive structure in which a heat matching pattern formed on the back surface of the electronic component mounting substrate and a case bonding pattern formed on the surface are provided in the through hole. It is an object of the present invention to provide an electronic component mounting board that can be attached by a body to improve work efficiency and heating efficiency so that a shield case can be mounted without causing defective mounting of the electronic component.

  Another object of the present invention is to provide an electronic component mounting board with improved reliability when a shield case is attached.

  In addition, the present invention includes a heating base that comes into contact with the heating alignment pattern formed on the back surface of the electronic component mounting board, so that the bonding between the shield case and the electronic component mounting board can be performed efficiently and quickly. It is another object to provide a heating device that can be used.

  In addition, the heating matching pattern of the electronic component mounting board in which the heating matching pattern formed on the back surface and the case bonding pattern formed on the front surface are connected by the through-hole conductor provided in the through hole is aligned with the heating table. It is another object of the present invention to provide a shield case mounting method capable of accurately and quickly joining the shield case and the electronic component mounting substrate with heating efficiency by heating.

  An electronic component mounting board according to the present invention is a case formed on a surface on which an electronic component is mounted and the electronic component is mounted to join the shield case in the electronic component mounting board on which the shield case is to be mounted. A bonding pattern; a heat matching pattern formed on the back surface corresponding to the front surface corresponding to the case bonding pattern; and a through-hole conductor connecting the case bonding pattern and the heat matching pattern. And a through hole.

  With this configuration, heat can be effectively conducted from the heat matching pattern to the case bonding pattern via the through-hole conductor having good thermal conductivity, so that the bonding between the case bonding pattern and the shield case can be accurately performed. Can be done quickly. That is, by heating from the back surface of the electronic component mounting substrate, the area of the case bonding pattern can be reduced, and the shield case can be accurately and quickly mounted on the electronic component mounting substrate with high heating efficiency. Further, since the heating efficiency is improved, mounting defects of the mounted electronic component can be prevented, and a highly reliable electronic component mounting board can be obtained.

  The electronic component mounting board according to the present invention is characterized in that a resist film is formed on an outer periphery of the case bonding pattern.

  With this configuration, since the bonding material (for example, solder paste) melted when the shield case is attached does not easily flow out of the case bonding pattern, it is possible to prevent the amount of the bonding material for bonding the shield case from being insufficient. The pattern for use and the shield case can be reliably joined.

  In the electronic component mounting board according to the present invention, the through hole is blocked by a region corresponding to the case bonding pattern.

  With this configuration, the through hole is closed, so that it is possible to prevent the molten solder from flowing out to the through hole when the shield case is mounted, and it is possible to prevent the amount of solder for joining the shield case from being insufficient.

  In the electronic component mounting board according to the present invention, the case bonding pattern or the heating matching pattern is separated from a wiring pattern formed on the front surface or the back surface.

  With this configuration, it is possible to prevent a decrease in heating efficiency by preventing heat dissipation from the surrounding wiring pattern formed on the front surface or the back surface.

  In the electronic component mounting board according to the present invention, an inner layer wiring pattern is provided between the front surface and the back surface.

  With this configuration, it is possible to apply to an electronic component mounting board subjected to multilayer wiring having an inner layer wiring pattern.

  In the electronic component mounting board according to the present invention, the through-hole conductor is separated from the wiring pattern of the inner layer.

  With this configuration, it is possible to prevent heat dissipation to the inner layer wiring pattern and to prevent a reduction in heating efficiency.

  In the electronic component mounting board according to the present invention, the through-hole conductor is a metal film provided on a wall surface of the through hole.

  With this configuration, heat conduction from the heating matching pattern to the case bonding pattern can be improved, so that heating efficiency can be improved.

  In the electronic component mounting board according to the present invention, the through-hole conductor is a conductive resin filled in the through hole.

  With this configuration, the through-hole conductor can be easily formed.

  In the electronic component mounting board according to the present invention, the electronic component is mounted, and the shield case is mounted.

  With this configuration, the shield case is mounted on the electronic component mounting board accurately and quickly with high heating efficiency, so that the mounting failure of the mounted electronic component does not occur and the electronic component mounting board has high reliability and shielding effect. Can do.

  The heating apparatus according to the present invention includes a heating table that contacts the heating alignment pattern of the electronic component mounting board according to the present invention.

  With this configuration, the shield case and the electronic component mounting substrate can be joined accurately, quickly, and with high heating efficiency.

  In the heating apparatus according to the present invention, the heating table includes a heating pin fitted into the through hole.

  With this configuration, the heating efficiency can be further improved.

  The shield case mounting method according to the present invention includes a step of attaching a bonding material to the case bonding pattern in the shield case mounting method of mounting the shield case on the electronic component mounting board according to the present invention; and A step of aligning and placing the bonding material on the bonding material, a step of aligning and placing the heating alignment pattern on the heating table, and heating the bonding material to form the shield case and the electronic component mounting substrate. And a step of bonding.

  With this configuration, the shield case and the case joining pattern can be reliably and quickly joined, and the shield case can be attached with high work efficiency and heating efficiency.

  In the shield case mounting method according to the present invention, the bonding material is a solder paste.

  With this configuration, the shield case and the case joining pattern can be reliably and quickly joined.

  The shield case mounting method according to the present invention is characterized in that a heating pin provided on the heating table is fitted into the through hole.

  With this configuration, heating in a region closer to the case bonding pattern is possible, and heating efficiency can be improved.

  According to the electronic component mounting board of the present invention, the heating matching pattern formed on the back surface of the electronic component mounting board and the case bonding pattern formed on the front surface are connected by the through-hole conductor provided in the through hole. Thus, the working efficiency and the heating efficiency are improved, and the shield case can be mounted without causing the mounting failure of the electronic component.

  According to the electronic component mounting substrate of the present invention, since mounting failure of the electronic component does not occur even when the shield case is mounted, there is an effect that an electronic component mounting substrate with a shield case with improved reliability can be obtained.

  According to the heating device of the present invention, there is an effect that the shield case and the electronic component mounting substrate can be joined with high heating efficiency and accurately and quickly.

  According to the shield case mounting method of the present invention, the shield case and the case bonding pattern can be reliably bonded, and the shield case can be mounted with good working efficiency and heating efficiency.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
1 to 4 are schematic side views showing an electronic component mounting board, a heating device, and a shield case mounting method according to Embodiment 1 of the present invention.

  FIG. 1 shows an electronic component mounting substrate on which electronic components are mounted. (A) shows the electronic component mounting board immediately after mounting the electronic component, and (B) shows the state where the bonding material for bonding the shield case is attached to the electronic component mounting board on which the electronic component is mounted. Show.

  Electronic components 2, 3, 4 are mounted (connected) on the front surface of the electronic component mounting substrate 1 shown in FIG. 1A via appropriately formed wiring patterns, and the electronic components 5, 6 are mounted on the back surface. Is implemented (connected). For example, the electronic component 2 is a microwave integrated circuit, the electronic components 3 and 5 are chip resistors, and the electronic components 4 and 6 are chip capacitors.

  A case joining pattern 7 for joining the shield case 12 (see FIG. 2) is formed on the surface of the electronic component mounting substrate 1 at an appropriate position (for example, an outer peripheral position of a region requiring the shield case 12). is there. A heating matching pattern 8 is formed on the back surface opposite to the front surface of the electronic component mounting substrate 1 so as to correspond to the case bonding pattern 7. A through hole 9 is formed between the case bonding pattern 7 and the heating matching pattern 8, and a through hole conductor 10 is formed on the wall surface of the through hole 9. Since the through-hole conductor 10 is configured to connect the case bonding pattern 7 and the heating matching pattern 8, heat conduction from the heating matching pattern 8 to the case bonding pattern 7 can be easily generated.

  The case bonding pattern 7 and the heating matching pattern 8 can be formed simultaneously with the wiring pattern. Further, the through-hole conductor 10 can be simultaneously formed in the through-hole 9 as a plating layer (metal film) when the wiring pattern is plated. The through-hole conductor 10 is preferably formed by a plating layer (metal film), particularly copper plating, from the viewpoints of excellent thermal conductivity and ease of manufacturing process.

  The through-hole conductor 10 can be formed of a conductive resin in addition to the plating layer. According to the conductive resin, a plating apparatus or the like is unnecessary, and the process can be simplified. Further, according to the conductive resin, the through-hole 9 can be completely filled, or if the coating method is devised, it can be formed only on the wall surface of the through-hole 9 like the plated layer.

  An appropriate bonding material 11 for bonding the shield case 12 is attached to the surface of the case bonding pattern 7 of the electronic component mounting substrate 1 shown in FIG. When the shield case 12 is made of metal, a solder paste is preferable as the bonding material 11 from the viewpoint of adhesive strength, bonding temperature, shielding characteristics, workability, and the like. However, it is also possible to use a conductive resin other than the solder paste as in the case of the through-hole conductor 10. Moreover, various supply forms, such as a paste form and a sheet form, are possible.

  FIG. 2 shows a state in which a shield case is placed on the bonding material after the bonding material is attached to the case bonding pattern. That is, the shield case 12 is placed on the bonding material 11. In this state, the electronic component mounting substrate 1 is transferred to the heating device 13 (see FIG. 3). As the shield case 12, a metal case can be generally used, but is not limited thereto. For example, it is also possible to use a case made of synthetic resin having excellent conductivity (shielding property).

  FIG. 3 shows a state in which the heating alignment pattern of the electronic component mounting substrate is aligned with the heating device (heating table).

  The heating device 13 includes a heating table 14 having a shape corresponding to the shape of the electronic component mounting substrate 1 to be heated. The electronic component mounting substrate 1 with the shield case 12 placed on the bonding material 11 is moved to the heating device 13, and the heating alignment pattern 8 of the electronic component mounting substrate 1 is positioned and placed on the heating table 14. The heating table 14 has an appropriate shape so as to contact the heating matching pattern 8 of the electronic component mounting substrate 1.

  FIG. 4 shows a state where the bonding material is heated to bond the shield case and the electronic component mounting substrate.

  Since the heating table 14 can directly supply heat from a heater (not shown) to the heating alignment pattern 8, the heat supplied to the heating alignment pattern 8 is case-bonded through the through-hole conductor 10 in the through hole 9. Since it is supplied to the pattern 7 for bonding, the bonding material 11 is heated at an appropriate temperature, and the case bonding pattern 7 and the shield case 12 are bonded. Since the through-hole conductor 10 has excellent thermal conductivity as compared with the electronic component mounting substrate 1 having insulation properties, heat from the heating table 14 can be efficiently conducted to the case bonding pattern 7. The case joining pattern 7 and the shield case 12 can be joined accurately and quickly by heating from the back surface of the electronic component mounting substrate 1.

  When a solder paste is used as the bonding material 11, the solder paste is melted and the case bonding pattern 7 and the shield case 12 can be reliably bonded. Further, when a conductive resin or the like is used as the bonding material 11, the conductive resin is cured by thermosetting, so that the case bonding pattern 7 and the shield case 12 can be reliably bonded. It is also possible to use heating from the surface side (the edge of the shield case 12 placed on the bonding material 11).

<Embodiment 2>
5 and 6 are schematic side views illustrating the heating device according to Embodiment 2 of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  FIG. 5 shows a state in which the electronic component mounting board on which the shield case is placed on the bonding material is aligned with the heating table of the heating device. That is, after the bonding material 11 is attached to the case bonding pattern 7, the electronic component mounting substrate 1 on which the shield case 12 is placed on the bonding material 11 is aligned with the heating table 14 (heating pin 14 p) of the heating device 13. Indicates.

  In the present embodiment, the heating table 14 of the heating device 13 includes heating pins 14p. The heating pin 14p is configured to fit into the through hole 9. That is, it has a shape and arrangement that fits into the through hole 9.

  FIG. 6 shows a state where the heating pin is fitted into the through hole to heat the bonding material, and the shield case and the electronic component mounting board are bonded.

  Since the heating pin 14p extends to the middle part of the through hole 9, the amount of heat supplied from the heating table 14 can be increased, and heat conduction to the case bonding pattern 7 is performed more efficiently. Heating efficiency can be improved. Moreover, it becomes possible to reduce the heating temperature in the heating stand 14, and the reliability of mounting of the electronic components 2, 3, 4, 5, 6 mounted on the electronic component mounting substrate 1 can be improved.

  In addition, when the length of the heating pin 14p is matched with the thickness of the electronic component mounting substrate 1, heat from the heating table 14 can be directly conducted to the case bonding pattern 7, and in this case, through It is also possible to omit the hole conductor 10. In this case, the tip of the heating pin 14p can have appropriate elasticity.

<Embodiment 3>
FIG. 7 is an explanatory view schematically showing an enlarged part of the electronic component mounting board according to Embodiment 3 of the present invention. The same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  In FIG. 7, the partial schematic side view of the electronic component mounting board | substrate which formed the resist film in the outer peripheral part of the pattern for case joining is shown. The resist film 20 is shown in cross section.

  The electronic component mounting substrate 1 shown in FIG. 1A is formed by separating the resist film 20 from the case bonding pattern 7. The electronic component mounting substrate 1 shown in FIG. 1B is formed by overlapping a resist film 20 on the case bonding pattern 7. In any case, due to the resist film 20, the bonding material 11 (not shown here) flows out around the case bonding pattern 7 and the bonding material 11 necessary for bonding the case bonding pattern 7 and the shield case 12 is formed. It is possible to prevent shortage. In particular, when a material having high fluidity such as a solder paste is used as the bonding material 11, if a solder resist is used as the resist film 20, a great effect is achieved.

<Embodiment 4>
FIG. 8 is an explanatory diagram schematically showing an enlarged part of the electronic component mounting board according to Embodiment 4 of the present invention. The same components as those in the first to third embodiments are denoted by the same reference numerals and description thereof will be omitted as appropriate.

  In FIG. 8, the partial schematic sectional drawing of the electronic component mounting board | substrate which plugged up the through hole in the area | region corresponding to the pattern for case joining is shown.

  The electronic component mounting substrate 1 shown in FIG. 1A is formed without providing the through hole 9 in the case bonding pattern 7. This can be formed by forming the case bonding pattern 7 after providing the through hole 9 in the electronic component mounting substrate 1. In the electronic component mounting substrate 1 shown in FIG. 2B, a sealing material 7a is formed in a plug shape in a region near the case bonding pattern 7 of the through hole 9. Filling and sealing can be performed using an appropriate conductive resin or the like. The sealing material 7a can be filled in the entire through hole 9.

  Although not shown, when the through-hole conductor 10 is formed of a plating layer, it is also possible to increase the thickness of the plating layer to close the entire through hole 9.

  By closing the region of the through hole 9 corresponding to the case bonding pattern 7, the bonding material 11 can be prevented from flowing into the through hole 9, and the bonding material necessary for bonding the case bonding pattern 7 and the shield case 12. 11 can be prevented from being insufficient.

<Embodiment 5>
FIG. 9 is an explanatory view schematically showing an enlarged part of the electronic component mounting board according to Embodiment 5 of the present invention. The same components as those in the first to fourth embodiments are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  FIG. 9 shows a partial schematic side view of an electronic component mounting board in which a case bonding pattern or a heating matching pattern is formed separately from other wiring patterns.

  The electronic component mounting substrate 1 shown in FIG. 2A is obtained by separating the case bonding pattern 7 from another wiring pattern (ground potential pattern 7g) formed on the front surface (or back surface). Generally, the case bonding pattern 7 is often connected to a ground potential pattern 7g as a wiring pattern. However, the ground potential pattern 7g is often a solid pattern (wide area filling pattern: indicated by a two-dot chain line in the figure), and the heat supplied from the heating table 14 is taken away by the solid pattern, and the bonding by the bonding material 11 is performed. May not be enough. In particular, when the bonding material 11 is composed of a solder paste, solder melting may be incomplete and solder connection may not be possible. By forming the case bonding pattern 7 separately from the other wiring patterns (ground potential pattern 7g), heat diffusion (heat dissipation loss) can be prevented, so that the bonding of the case bonding pattern 7 and the shield case 12 is incomplete. Can be prevented.

  The electronic component mounting substrate 1 shown in FIG. 1B is formed in multiple layers, and includes an upper layer electronic component mounting substrate 1a and a lower layer electronic component mounting substrate 1b. The number of layers is not limited to two. The case bonding pattern 7 is separated from other wiring patterns (ground potential pattern 7g) as in FIG. Further, the through-hole conductor 10 is separated from the ground potential pattern 21g as a wiring pattern formed in the inner layer. Even in the inner layer, the ground potential pattern 21g is often a solid pattern (wide area filling pattern: indicated by a two-dot chain line in the figure), and the heat supplied from the heating table 14 is taken away by the solid pattern, and the bonding material 11 Bonding may not be sufficient. By forming the through-hole conductor 10 separately from the wiring pattern (ground potential pattern 21g) formed in the inner layer, heat diffusion can be prevented, so that incomplete bonding between the case bonding pattern 7 and the shield case 12 is prevented. It becomes possible to prevent.

It is a schematic side view which shows the electronic component mounting board | substrate and shield case mounting method which concern on Embodiment 1 of this invention. It is a schematic side view which shows the electronic component mounting board | substrate and shield case mounting method which concern on Embodiment 1 of this invention. It is a schematic side view which shows the electronic component mounting board | substrate, heating apparatus, and shield case mounting method which concern on Embodiment 1 of this invention. It is a schematic side view which shows the electronic component mounting board | substrate, heating apparatus, and shield case mounting method which concern on Embodiment 1 of this invention. It is a schematic side view explaining the heating apparatus which concerns on Embodiment 2 of this invention. It is a schematic side view explaining the heating apparatus which concerns on Embodiment 2 of this invention. It is explanatory drawing which expands and schematically shows a part of electronic component mounting board | substrate which concerns on Embodiment 3 of this invention. It is explanatory drawing which expands and schematically shows a part of electronic component mounting board | substrate which concerns on Embodiment 4 of this invention. It is explanatory drawing which expands and schematically shows a part of electronic component mounting board | substrate which concerns on Embodiment 5 of this invention. It is a schematic side view which shows the state which attaches a shield case to the conventional electronic component mounting board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting board 1a Upper layer electronic component mounting board 1b Lower layer electronic component mounting board 2, 3, 4, 5, 6 Electronic component 7 Case joining pattern 7g Wiring pattern (ground potential pattern)
8 Heat matching pattern 9 Through hole 10 Through hole conductor 11 Bonding material 12 Shield case 13 Heating device 14 Heating table 14p Heating pin 20 Resist film 21g Wiring pattern (ground potential pattern)

Claims (14)

In the electronic component mounting board on which the electronic component is mounted and the shield case should be mounted,
A case joining pattern formed on a surface on which the electronic component is mounted to join the shield case;
A heating matching pattern formed on the back surface corresponding to the front surface corresponding to the case bonding pattern;
An electronic component mounting board comprising: a through hole having a through hole conductor connecting the case bonding pattern and the heating matching pattern.   The electronic component mounting board according to claim 1, wherein a resist film is formed on an outer peripheral portion of the case bonding pattern.   The electronic component mounting board according to claim 1, wherein the through hole is closed by a region corresponding to the case bonding pattern.   The electron according to any one of claims 1 to 3, wherein the case bonding pattern or the heating matching pattern is separated from a wiring pattern formed on the front surface or the back surface. Component mounting board.   5. The electronic component mounting board according to claim 1, further comprising an inner layer wiring pattern between the front surface and the back surface.   The electronic component mounting board according to claim 5, wherein the through-hole conductor is separated from the wiring pattern of the inner layer.   The electronic component mounting substrate according to claim 1, wherein the through-hole conductor is a metal film provided on a wall surface of the through-hole.   The electronic component mounting board according to claim 1, wherein the through-hole conductor is a conductive resin filled in the through-hole.   9. The electronic component mounting substrate according to claim 1, wherein the electronic component is mounted and the shield case is mounted.   A heating apparatus comprising: a heating table that contacts the heating alignment pattern of the electronic component mounting board according to claim 1.   The heating apparatus according to claim 10, wherein the heating table includes a heating pin fitted into the through hole. In the shield case mounting method of mounting the shield case on the electronic component mounting board according to any one of claims 1 to 8,
Attaching a bonding material to the case bonding pattern;
A step of aligning and placing the shield case on the bonding material;
A step of aligning and placing the heating alignment pattern on a heating table;
A step of heating the bonding material to bond the shield case and the electronic component mounting substrate.   The shield case mounting method according to claim 12, wherein the bonding material is a solder paste. The shield case mounting method according to claim 12 or 13, wherein a heating pin provided on the heating table is fitted into the through hole.

Images