JPH0922960A - Multichip module device and manufacturing method thereof - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To easily form a package, to obtain an external terminal from this package accurately and with high reliability, to reduce the cost, and to reduce the initial investment amount associated with the manufacturing thereof. To be able to. A plurality of terminal elements each having a conductive layer
Constitute a laminated terminal portion 3 which is laminated and integrated with each other via the insulating layer 2. The laminated terminal portion 3 is arranged on the substrate 4, and the component chip 7 is arranged on the substrate having the laminated terminal portion or on another substrate arranged on the substrate.
To mount. A sealing resin mold body 9 is applied to a substrate 4 having the laminated terminal portion 3 to cover a component chip to form a package by the substrate 4 having the laminated terminal portion 3 and the sealing resin molded body 9. At least one end of the terminal element 1 of No. 3 is led out from the package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multichip module device and a manufacturing method thereof.

[0002]

2. Description of the Related Art In a multi-chip module device in which a plurality of semiconductor chips, for example, component chips such as IC (integrated circuit) chips are mounted to construct a required electronic circuit portion, the package and external terminals from the package are connected. Derivation is a problem in terms of device reliability and productivity.

That is, in this type of multi-chip module device, terminals are led to the outside for electrically connecting to other external wiring parts such as a printed circuit board, and these terminals are connected to corresponding predetermined external wiring parts, for example. It is electrically connected to the printed wiring, for example, by soldering or the like, and for example, the multichip module device is mounted on the printed circuit board or the external terminal lead is led out.

By the way, in this case, in order to enable stable electrical and mechanical connection of the external wiring portion to the printed circuit board or the like, and thus with high reliability and efficiency, a multi-chip module device is required. In manufacturing, it is desired that the plurality of external terminals be formed at predetermined positions so as to protrude by a predetermined amount.

Conventionally, various methods have been proposed as modes of deriving a package and external terminals in a multi-chip module device, but as a general method, there are a transfer mold configuration, a ceramic package, and the like. In this case, there is a problem in accurately setting the lead-out positions of a large number of external terminal pins.Because the initial investment amount of the manufacturing equipment, for example, the molding die and the equipment accompanying it, is large, it is necessary to use a particularly small amount. There is a problem that the cost is increased in manufacturing various kinds of multi-chip module devices. Further, the ceramic package has a problem that it is expensive in itself.

[0006]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, that is, facilitates the formation of a package in a multi-chip module device, and leads external terminals from this package accurately and with high reliability at a low cost. In addition, the present invention provides a multi-chip module device suitable for use in a small-quantity multi-kind multi-chip module device and a manufacturing method thereof so that the initial investment amount associated with the manufacture thereof can be reduced. Is.

[0007]

In the multichip module device according to the present invention, a plurality of terminal elements each made of a conductive layer are laminated on each other via an insulating layer to form a laminated terminal portion. Then, this laminated terminal portion is arranged on the substrate, and the component chip is mounted on the substrate having this laminated terminal portion or on another substrate arranged on this substrate. At least one end of the terminal element of the laminated terminal portion is formed by covering the component chip on the substrate having the laminated terminal portion and applying the sealing resin molded body to form a package by the substrate having the laminated terminal portion and the sealing resin molded body. Is derived from the package to the outside.

Further, in the method of manufacturing a multi-chip module device according to the present invention, a step of producing a laminated block in which conductive layers are laminated with an insulating layer interposed between the conductive layer and the insulating layer is performed. And a step of cutting to a required thickness in a direction crossing, and at least one surface of the cut body facing the conductive layers and the insulating layers alternately arranged to a required depth from this surface. A laminated terminal portion in which a plurality of terminal elements are laminated with an insulating layer between them by removing the insulating layer between the conductive layers and adopting a protrusion treatment step of protruding at least one end of the terminal element made of each conductive layer on this surface. And placing the laminated terminal portion on a substrate, mounting a component chip on a substrate having the laminated terminal portion, or on another substrate arranged on this substrate, and the laminated terminal portion. To Covering the component chips on a substrate to,
In addition, at least one end of the terminal layer of the laminated terminal portion is led to the outside and a molding process of the encapsulating resin molded body is adopted to form a package with the substrate having the laminated terminal and the encapsulating resin molded body. A multi-chip module device having a structure in which at least one end of a terminal element is led out of a package is manufactured.

According to the device and the method of the present invention, the laminated terminal portion is used as the external lead-out terminal. In this laminated terminal portion, a plurality of terminal elements each made of a conductive layer are laminated with an insulating layer interposed therebetween. Since it has a different configuration,
The mutual positional relationship can be set accurately. Since the plurality of terminals are stacked and integrated on the substrate in this manner, the arrangement of the plurality of terminal elements with respect to the substrate and the amount of protrusion from the package can be set accurately. .

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the device of the present invention and the manufacturing method thereof will be described with reference to the drawings. FIG. 1 shows a schematic perspective view of an example of a multi-chip module device according to the present invention, and FIG. 2 shows a schematic sectional view thereof. In this example, the rectangular substrate 4 is formed by resin molding, and the plurality of terminal elements 1 are respectively provided with the insulating layer 2 along each side surface of the substrate 4.
Laminated terminal portion 3 which is laminated and integrated with each other via
In this case, the terminal board 5 is embedded and integrated when the board 4 is molded.

On the terminal substrate 5, that is, the substrate 4, another substrate, for example, an IC substrate 6 on which a semiconductor integrated circuit IC such as a semiconductor circuit element is formed is bonded. And this IC
On a predetermined circuit portion on the substrate 6, a component chip 7 such as an IC
The chip is mounted. The mount of this tip 7 is
For example, a metal bump, for example, is arranged on an electrode or a wiring portion of the chip 7 to be connected to the circuit of the IC substrate 6, and the metal bump is directly placed on the wiring layer of a predetermined circuit portion of the IC substrate 6 by direct contact. It is performed by so-called face-down bonding, which performs electrical and mechanical joining.

In the illustrated example, a predetermined wire or terminal of the IC substrate 6 and the corresponding terminal element 1 of the laminated terminal portion 3 are electrically connected by a lead wire 8.

In this state, the terminal board 5 is covered, that is, in this example, the IC board 6 and the component chip 7 on the IC board 6 are wrapped and covered with the sealing resin. In this way, a package is formed by the substrate, in this example, the terminal substrate 5 and the sealing resin mold body 9.

At this time, one end of the terminal layer 4 of the laminated terminal portion 5 is led out from the package.

A method of manufacturing the laminated terminal portion 3 of the multichip module device having this structure will be described with reference to FIGS. In this case, as shown in the perspective view of FIG. 3, a plurality of conductive layers, for example, a conductive layer 31 made of a thin plate of copper Cu having a thickness of 0.3 mm is used, for example, so-called glass epoxy obtained by impregnating glass fiber with epoxy resin. Thickness of 0.
The laminated blocks 21 are laminated with the insulating layer 2 having a thickness of 35 mm interposed therebetween to form an integrated laminated block 21 as a whole. The terminal layer 1 made of a conductive layer may be formed of a thin metal plate such as Cu as described above, or may be formed by sputtering or vapor depositing a metal on the insulating layer 2.

As shown by chain lines a ₁ , a ₂ , a ₃ ... In FIG. 3, the laminated block 21 is arranged along the laminating direction of each conductive layer 31 and the insulating layer 2, that is, orthogonal to each layer. As shown in Figure 4,
A cut body 22 having a required thickness t is formed.

Selectively with respect to the insulating layer 2 facing one side surface of the cut body 22, for example, by so-called liquid honing in which water is mixed with an abrasive, or by sandblasting, or the insulating layer 2 is compared with the conductive layer 31. By an exclusion method showing a large amount of erosion, the conductive layer 31 has one edge, that is, as shown in FIG.
A projecting process is carried out to project at least one end edge of the terminal element finally obtained from the insulating layer 2. In this case, the protrusion amount of the conductive layer 31 can be uniformly set to a predetermined amount.

In this manner, the conductive layer 31 having one end edge protruding is used as each terminal element 1 to form the laminated terminal portion 3 in which one end edge of each terminal element 1 is arranged so as to protrude from the insulating layer 2 by a predetermined amount. Alternatively, if necessary, as shown in FIG. 6, the cut body 22 of FIG. 5 is required in a direction orthogonal to the conductive layers 31 and the insulating layers 2 along the laminating direction of the conductive layers 31 and the insulating layers 2. The terminal elements 1 each made of the conductive layer 1 are arranged so as to be electrically insulated through the insulating layer 2 after being cut into the width W, and one end edge of each terminal element 1 is arranged so as to protrude from the insulating layer 2 by a predetermined amount. The laminated terminal portion 3 is formed.

An Au plating layer (not shown) is applied to the exposed surface of the terminal element 1 by, for example, electroplating the thus obtained laminated terminal portion 3 to improve the corrosion resistance of the terminal element 1 and To be able to favorably perform soldering to other parts, bonding of lead wires, and the like.

The laminated terminal portion 3 thus formed is
For example, the concave portion 4 on each side surface of the substrate 4 shown in FIGS.
In G, for example, the plate surface of the terminal element 1 is arranged in the thickness direction of the substrate 4 so as to be orthogonal to each side surface of the substrate 4 and along the thickness direction of the substrate 4. That is, the axial direction of the terminal element 1 is arranged along the thickness direction of the substrate 4. In the illustrated example, the edge portion of each terminal element 1 that is projected from the insulating layer 2 is I of the substrate 4.
This is a case where the C substrate 6 and the like are projected from the side opposite to the side on which the C substrate 6 is placed.

Thereafter, as described above, for example, the IC substrate 6 is mounted, the lead wires 8 are bonded, the component chips 7 are mounted, the sealing resin mold body 9 is covered, and the like. Is configured.

The multi-chip module device 10 thus formed has external wiring, for example, a terminal element 1 on a rigid or flexible printed circuit board 23 having a wiring layer 24, as shown in FIGS. Are electrically contacted electrically and mechanically by abutting the protruding ends of the corresponding wiring layers on the corresponding wiring layers 24 and soldering.

In the example shown in FIGS. 1 and 2, the other substrate, for example, the IC substrate 6 is mounted on the terminal substrate 4, but as shown in the schematic sectional view of FIG. It is also possible to form the concave portion 4H in the mounting portion of the substrate 6 and to fit the substrate 6 in the concave portion 4H. In FIG. 7, parts corresponding to those in FIGS. 1 and 2 are designated by the same reference numerals, and duplicate description will be omitted.

Further, in the above-mentioned example, the substrate 4 constituting the terminal substrate 5 is made of a resin molded body, but the substrate 4 is made of an insulating substrate such as a glass epoxy substrate and its side surface, for example, four side surfaces. A groove can be formed along the groove, the above-mentioned laminated terminal portion 3 can be fitted into the groove, and this can be adhered into the groove if necessary.

Further, the substrate 4 on which the laminated terminal portion 3 is arranged is not limited to the above-mentioned structure made of resin or the like, and the entire substrate 4 or the substrate 4, for example, the IC substrate 6 is used.
4 has excellent thermal conductivity and has a coefficient of thermal expansion similar to that of the IC substrate 6 made of, for example, Si placed on the mounting portion 4.
It is also possible to use a two-alloy substrate. FIG.
Shows a schematic sectional view of an example in this case, and FIG. 9 shows a plan view of the substrate 4. In this example, the laminated terminal portions 3 are arranged along the respective side surfaces of the 42-alloy substrate 4 by the same method and configuration as described above, and the laminated terminal portions 3 are arranged on the four side surfaces of the substrate 4 by the resin mold 11. And mechanically integrate the whole. In this case, a recess 12 or the like may be provided on the upper surface of the substrate 4 as needed to serve as a reference mark for resin molding.

A substrate 6, for example, an IC, on which a component chip 7 such as an IC semiconductor chip is mounted, is mounted on the substrate 4.
A substrate, for example, a silicon substrate is placed, electrical connection with the terminal element 1 by the lead wire 8, and a sealing resin mold 9
Mold. In this way, the multichip module device 10 packaged by the sealing resin mold body 9 and the substrate 4 is configured.

Even in the case of this structure, one end of each terminal element 1 of the laminated terminal portion 3 is led out from the package. That is, in this example, one end of each terminal element 1 of each laminated terminal portion 3 is projected from the back surface of the substrate 4 to the outside with a certain amount.

In FIG. 8, parts corresponding to those in FIG. 2 are designated by the same reference numerals, and duplicated description will be omitted.

In this example, the substrate 4 made of 42 alloy, for example
In the case where the laminated terminal portion 3 is arranged outside the substrate and the whole is mechanically integrated by the resin mold 11, in some cases, the laminated terminal portion 3 is housed on each side edge of the substrate 4. The concave portions to be arranged are provided, and the laminated terminal portions 3 are formed in the concave portions.
Then, temporary fitting is performed by using, for example, an ultraviolet curable resin, and similarly to the above, another substrate, such as IC chip, on which a component chip such as an IC chip is mounted is mounted on the substrate 4.
The C substrate 6 is placed, and the lead wire 8 connects the terminal element 1
And the sealing resin mold 9 is molded. As described above, by using the metal substrate such as 42 alloy as the substrate 4, it is possible to effectively improve the heat radiation effect and effectively avoid the occurrence of thermal strain.

In the above-described example, when manufacturing the laminated terminal portion 3, as shown in FIGS. 5 and 6, the insulating layer 2 is removed to a partial depth only on one surface of the cut body 22, This is a case where only one end edge of the terminal element 1 is made to project, but a projecting process step of projecting both end edges of the terminal element 1 from the insulating layer 2 is performed on both surfaces of the cut body 22 to obtain the structure shown in FIG. As shown, the laminated terminal portion 3 in which both ends of the terminal element 1 project may be configured.

FIG. 11 is a sectional view showing an example of a case where the multi-chip module device 10 is constructed by using the laminated terminal portion 3 in which both end edges of the terminal element 1 are led out from the insulating layer 2 as described above. In this example, the board 4 is formed of a wiring board such as a printed board having a single-layer or multi-layer wiring layer 41, and the both end edges of the terminal element 1 described with reference to FIG. The laminated terminal portion 3 protruding from the insulating layer 2 is placed on the corresponding predetermined wiring layer 41 of the substrate 4 at one end edge of the terminal element 1 and electrically connected by soldering or the like. On the other hand, a component chip 7 such as a semiconductor chip is mounted on the substrate 4 by, for example, face down bonding, or although not shown, the component chip 7 such as a semiconductor chip is mounted by, for example, face down bonding. An IC substrate is placed, and a sealing resin mold body 9 is provided so as to cover them, for example, the whole is integrated, and a package is formed by the cooperation of the sealing resin mold body 9 and the substrate 4.
In this case, the protruding portion of the other end of each terminal element 1 of each laminated terminal portion 3 is projected from the sealing resin molded body 9 to the outside, and the external connection is made at this protruding end. To be done.

Further, in this case, since the connection with the outside is made from the side of the sealing resin mold body 9, the multi-chip module device 10 with this configuration has, for example, a plurality of heat radiation fins 51 for improving the heat radiation effect. It is also possible to adopt a configuration in which the radiator 52 made of a metal or the like having good heat conductivity in which the above is formed is thermally coupled to the back surface of the substrate 4.

As another example of the present invention, FIG. 12 is a perspective view thereof, and FIG. 13 is a cross-sectional view of a main portion thereof, where the terminal element 1 is projected from the insulating layer 2 at both ends. It is also possible to arrange one of the protruding ends along the plate surface of the substrate 4. In the examples shown in FIGS. 12 and 13, for example, a plurality of wiring layers 61 are laminated on the substrate 4 via an interlayer insulating layer 62, and each wiring layer 61 is provided at a predetermined portion through a contact hole formed in the interlayer insulating layer 62. The multilayer wiring boards are connected to each other, and the laminated terminal portions 3 are arranged along the respective side edges of the board 4. In this case, one terminal end of each terminal element 1 of each laminated terminal portion 3 is arranged so as to contact a predetermined portion of the upper wiring layer of the substrate 4. Further, a component chip such as a semiconductor chip is connected and mounted by, for example, face-down bonding on the substrate 4 or another substrate (not shown) arranged on the substrate 4, and the mounting is covered with the sealing resin mold body 9 Is formed. In the illustrated example, a frame body 71 that regulates the outer peripheral edge position of the sealing resin mold 9 is provided on the substrate 4 so as to project on the substrate 4, and the sealing resin mold body 9 is molded in the frame body 71. Can also be

According to the above-described configuration of the present invention, although a plurality of terminals are led out, these terminals have the laminated terminal portion 3 in which the terminal elements 1 to be terminals are laminated and arranged through the insulating layer 2. Since it is configured by, the positional relationship between terminals can be set accurately. Since the plurality of terminals are stacked and integrated on the substrate in this manner, the arrangement of the plurality of terminal elements with respect to the substrate and the amount of protrusion from the package can be set accurately. .

The terminal element 1 of the laminated terminal portion 3 is not limited to the columnar structure, and has an L-shaped cross section as shown in FIG. 14 or FIG. The terminal element 1 can be formed in various ways, and various modifications and changes can be made to the shape and derivation mode of the terminal element 1.

13 to 15, parts corresponding to those in FIG. 2 are designated by the same reference numerals, and duplicate description will be omitted.

Further, in the above-mentioned example, the laminated terminal portion 3 is arranged along each side surface of the substrate 4, but the invention is not limited to the case where the laminated terminal portion 3 is formed along a part of the side surface, or the like. Various configurations can be adopted.

[0038]

As described above, according to the device of the present invention and the method of the present invention, the laminated terminal portion is used as the external lead-out terminal. In the laminated terminal portion, that is, the external lead-out terminal, a plurality of terminal layers are insulated. Since the layers are laminated through the layers, the mutual positional relationship can be set accurately. Since the plurality of terminals are stacked and integrated on the substrate as described above, the plurality of terminals can be easily and accurately arranged on the substrate. In addition, since the resin molding can be performed in the state where the terminals are arranged at the predetermined positions on the substrate as described above, the mold has a simple structure and the handling at the time of molding becomes easy. Therefore,
It is possible to improve mass productivity.

Further, according to the method of the present invention, since the formation of the terminal portion is obtained by laminating a plurality of terminal layers with the insulating layer interposed therebetween and cutting the laminated layers, each of the terminal layers serving as external terminals is formed. Mutual position setting and length setting of each terminal layer are accurate, and setting of the protrusion amount of the end of the terminal layer from the resin mold is done by selectively removing the insulating layer between the terminal layers. Since it is possible to form the projecting edge at a uniform height, in other words, on the position plane, by setting it by the setting of each terminal layer to the external wiring, for example, the corresponding printed wiring layer for the printed circuit board. Connection, without causing some floating
A so-called coplanarity does not vary, and therefore a highly reliable connection can be performed.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of an example of a multi-chip module device according to the present invention.

FIG. 2 is a schematic sectional view of an example of a multi-chip module device according to the present invention.

FIG. 3 is a perspective view in one manufacturing process of the laminated terminal portion of the example of the manufacturing method of the present invention.

FIG. 4 is a perspective view in one manufacturing process of the laminated terminal portion of the example of the manufacturing method of the present invention.

FIG. 5 is a perspective view in one manufacturing process of the laminated terminal portion in the example of the manufacturing method of the present invention.

FIG. 6 is a perspective view in one manufacturing process of the laminated terminal portion of the example of the manufacturing method of the present invention.

FIG. 7 is a schematic cross-sectional view of another example of the multi-chip module device according to the present invention.

FIG. 8 is a schematic cross-sectional view of still another example of the multi-chip module device according to the present invention.

9 is a schematic plan view of a substrate on which a laminated terminal portion of the multi-chip module device according to the present invention shown in FIG. 8 is arranged.

FIG. 10 is a perspective view of another example of the laminated terminal portion of the device of the present invention.

FIG. 11 is a schematic cross-sectional view of another example of the multi-chip module device according to the present invention.

FIG. 12 is a schematic perspective view of another example of the multi-chip module device according to the present invention.

13 is a cross-sectional view of an essential part of the multi-chip module device according to the present invention shown in FIG.

FIG. 14 is a schematic cross-sectional view of a multi-chip module device according to the present invention.

FIG. 15 is a schematic sectional view of a multi-chip module device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Terminal element 2 Insulating layer 3 Laminated terminal part 4 Substrate 7 Component chip 8 Lead wire 9 Sealing resin mold body 10 Multi-chip module device

Claims (2)

[Claims] 1. A laminated terminal portion, in which a plurality of terminal elements made of a conductive layer are laminated and integrated with each other via an insulating layer, is arranged on a substrate, and the laminated terminal portion is provided on the substrate having the laminated terminal portion, or A component chip is mounted on another substrate arranged on the substrate, and a sealing resin mold body is applied on the substrate having the laminated terminal portion to cover the component chip, and the substrate having the laminated terminal and A multi-chip module device, wherein a package is constituted by a sealing resin mold body, and at least one end of the terminal element of the laminated terminal portion is led out from the package. 2. A step of producing a laminated block in which conductive layers are laminated via an insulating layer, and a step of cutting the laminated block to a required thickness in a direction crossing the conductive layer and the insulating layer. The conductive layer and the insulating layer of the cut body are alternately arranged to face at least one surface of the cut body, and the insulating layer is removed to a required depth from the surface, and the conductive layer is formed on the surface. A step of projecting at least one end of a terminal element composed of layers to form a laminated terminal section in which a plurality of terminal elements are laminated via an insulating layer, and the step of disposing the laminated terminal section on a substrate A step of mounting a component chip on the substrate having the laminated terminal portion, or on another substrate arranged on the substrate, and covering the component chip on the substrate having the laminated terminal portion, And the terminal layer of the laminated terminal section Method of manufacturing a multi-chip module device characterized by taking the molding step of the sealing resin molded body by deriving at least one end to the outside.