JPH09148417A - Heat-treating device for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately prevent the sideslip of a substrate when the lower surface of the substrate approaches a hot plate in the case where a heat-treating device for substrate carries in the substrate. SOLUTION: A heat-treating device for substrate is provided with a heating means or cooling means, a hot plate 15 which heats or cools a substrate while the plate 15 supports the substrate put on the plate 15, substrate supporting pins 8 which supports the substrate placed on the pins 8, and an air cylinder 10 which elevates/lowers the hot plate 15 and pins 8 relatively to each other. In this heat-treating device, a groove 20 which leads the air between the lower surface of the substrate and the hot plate 15 to the outside of the plate 5 when the cylinder 10 moves the plate 15 and pins 8 relatively to each other and the lower surface of the substrate approaches the plate 15 is formed on the upper surface of the plate 15.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a heating means or a cooling means for heating or cooling a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, or a substrate for an optical disk. A hot plate that includes at least one of the above, and that heats or cools the substrate by supporting it on the upper surface; a substrate support member that mounts and supports the substrate; and a relative elevating means that relatively elevates the heat plate and the substrate support member. The present invention relates to a substrate heat treatment apparatus.

[0002]

2. Description of the Related Art This type of substrate heat treatment apparatus is equipped with a hot plate having a heating means such as a heater or a cooling means such as a Peltier element, and the substrate is contacted and supported (placed) on the upper surface of the hot plate. In this state, the substrate is heated or cooled, or, as in the apparatus disclosed in Japanese Utility Model Laid-Open No. 63-193833, a ceramic spherical body (ball) is provided so as to project a minute height above the upper surface of the hot plate. It is configured to heat or cool the substrate while closely supporting the substrate on a heating plate with a minute gap called a so-called proximity gap being maintained.

Further, the substrate heat treatment apparatus, for example, includes a plurality of substrate support pins that can be raised and lowered through a plurality of through holes formed in a heating plate, and the substrate support pins are integrally raised and lowered. It also has an elevating mechanism that allows it. Then, the substrate is moved in and out of the hot plate by the cooperation of the ascending / descending operation of the substrate support pin by the elevating mechanism and the substrate transfer operation by the substrate transfer robot provided outside the substrate heat treatment apparatus as follows. Be seen.

When carrying the substrate onto the hot plate, first,
Raise the substrate support pin to the upper position. Then, the substrate transfer robot inserts the substrate into the substrate heat treatment apparatus together with the arm while mounting and supporting the outer peripheral edge of the substrate on the arm, and positions the substrate above the substrate support pins. From that state, lower the substrate transfer robot to lower the arm, place and support the substrate on the substrate support pins, move the substrate transfer robot to another location, and then lower the substrate support pins to heat the substrate. It is contact-supported (placed) on the upper surface, or the substrate is placed on a sphere to be closely supported on the upper surface of the hot plate.

Further, the unloading of the substrate from the hot plate is performed in the reverse operation of the above-mentioned loading of the substrate. That is, the substrate support pins are raised to lift the substrate that is contact-supported or closely supported on the upper surface of the hot plate above the hot plate, and the substrate transfer robot receives the substrate from the substrate support pin at the transfer position above the hot plate and heat-processes the substrate. Transported outside the equipment.

[0006]

However, the following problems have been encountered in the substrate heat treatment apparatus having the above-mentioned structure and carrying in / out the substrate from / to the hot plate.

That is, in order to support the substrate received from the substrate transfer robot on the hot plate, when the substrate support pins are lowered, the substrate is immediately contacted with the upper surface of the hot plate or the sphere and supported. There was a situation in which the substrate was not properly supported at a predetermined position on the upper surface of the hot plate due to lateral sliding.

In this type of substrate heat treatment apparatus, the upper surface of the hot plate is temperature-controlled with high precision so that the substrate is uniformly heated or cooled to a desired temperature, and the desired uniformity can be obtained at the desired temperature. In order to obtain the processing result, it is necessary to accurately support the substrate at a predetermined position on the upper surface of the hot plate. Therefore, as described above, when the substrate is not properly supported at the predetermined position on the upper surface of the hot plate, the substrate is not uniformly heated or cooled to a desired temperature.

Further, as described above, when the substrate is carried out from the hot plate in a state where the substrate is not properly supported at the predetermined position on the upper surface of the hot plate, the substrate lifted by the substrate support pins is located above the hot plate. Since it is located at a position horizontally displaced from the delivery position of the substrate, the substrate transfer robot cannot receive the substrate or damages the substrate when delivering the substrate.

In order to eliminate the above inconvenience,
Conventionally, there is also an apparatus in which a guide member is attached to the upper surface of the heating plate and the outer peripheral edge of the substrate to be lowered is brought into contact with the guide member to prevent the above-mentioned side slip of the substrate.
However, in the case of such a configuration, the mounting position of the guide member has to be changed every time the size of the substrate changes, and the guide member may hinder the transfer of the substrate by the substrate transfer robot. There is a problem that it is not appropriate.

As a result of investigating the cause of the sideslip of the substrate during the descent described above, the present applicant found that the substrate was lowered and immediately before being placed on the upper surface of the hot plate or on the sphere, between the lower surface of the substrate and the hot plate. The air is narrowly sandwiched between the top and bottom, making it difficult to escape and supporting the board.The board cannot temporarily descend in synchronization with the board support pins and temporarily floats in the air, and the board support pins and heat plate etc. are assembled and adjusted. It was discovered that the board was slipping laterally due to a trivial effect due to the slightest flaw in the board.

From the results of the above analysis, the assembling of the substrate support pins and the heat plate is adjusted with high accuracy so that the posture of the substrate and the upper surface of the heat plate are kept as horizontal as possible, and the substrate support pins are lowered at a low speed. It is considered that the slippage of the substrate during the descent can be prevented by making it easier for the air between the lower surface of the substrate and the hot plate to escape during the descent. However, it takes time and effort to adjust the assembly of the board support pins and the heat plate with high accuracy, and also the board support pins and the heat plate to keep the posture of the board and the top surface of the heat plate completely horizontal. It is difficult to adjust the assembling of the substrate, and if the substrate support pins are lowered at a low speed, it takes time to carry in the substrate to the hot plate, so that the processing efficiency of the substrate heat treatment apparatus decreases. There are drawbacks.

Further, in an apparatus in which the above-mentioned sphere is provided and the substrate is supported in close proximity to the heating plate, for example, if the proximity gap is increased, the air between the lower surface of the substrate and the heating plate at the time of descending will heat the substrate. The floating in the air can be eliminated, and the substrate can be prevented from sliding sideways when descending. However, if the proximity gap is large, the following inconvenience occurs. That is, in the hot plate for cooling the substrate, the smaller the distance between the substrate and the hot plate, the shorter the cooling time of the substrate and the shorter the processing time. Means that the treatment time is shortened and the treatment efficiency is reduced. Further, in the hot plate for heating the substrate, if the proximity gap is large, the temperature control accuracy is deteriorated and the substrate cannot be heated to the target temperature.

Further, the applicant of the present invention has previously proposed and proposed a device capable of suitably preventing the side slippage of the substrate during the descent (actually, the flat plate 6-
77231 and Japanese Utility Model Laid-Open No. 6-79140). These ideas were based on the idea of forcibly eliminating the air between the bottom surface of the substrate and the heating plate when it descends (so-called air bleeding). In the device proposed in Japanese Utility Model Publication No. 6-77231, a vacuum pump is used. A suction port connected in communication is provided on the upper surface of the hot plate so that the air between the lower surface of the substrate and the hot plate is sucked from the suction port when the substrate descends. On the other hand, it is proposed in Japanese Utility Model Publication No. 6-79140. The device is provided with an elastic member (bellows pump) that expands and contracts in conjunction with the elevation of the substrate support pin on the lower surface of the heating plate, and expands the contracted expanding and contracting member as the substrate descends to penetrate the thermal plate. It is configured to suck air between the lower surface of the substrate and the heating plate through the holes.

However, in the case of the device proposed in Japanese Utility Model Laid-Open No. 6-77231, a vacuum pump, an electromagnetic on-off valve, and piping for connecting the vacuum pump and the suction hole in communication (reference numerals 19, 20, and 21 are attached in the drawings of this application). However, there is a problem in that the structure is complicated and the structure becomes complicated, and dust is not collected between the bottom surface of the substrate and the heat plate when air is sucked from the suction port. As a result, there is also a problem that the substrate is contaminated. On the other hand, in the case of the device proposed in Japanese Utility Model Laid-Open No. 6-79140, the same as the device proposed in Japanese Utility Model Laid-Open No. 6-77231, the expansion member (reference numeral 17 is attached in the drawing of this application), etc. There is a problem that a new component is required and the structure becomes complicated, and when sucking air from the through-hole, the surrounding dust is collected between the lower surface of the substrate and the heating plate, and the substrate is contaminated. In addition, in this device, the check valve (18) is provided in order to remove the air in the stretched stretchable member. However, even if the check valve does not completely remove the air in the stretched stretchable member. In this case, the expansion / contraction member is contracted by the substrate raising operation when the substrate is unloaded, and the air in the expansion / contraction member is ejected from the upper surface of the heat plate toward the substrate, so that it is mounted and supported on the substrate support pin. The printed circuit board may be displaced laterally or dust around it may be blown onto the circuit board. There is also a problem, such as lead to contamination of the substrate with.

The present invention has been made in view of the above circumstances, and is intended to prevent the substrate from slipping sideways when descending, and to complicate the structure and processing pointed out in the above-mentioned prior art. An object of the present invention is to provide a substrate heat treatment apparatus capable of solving various problems such as a decrease in efficiency and substrate contamination.

[0017]

The present invention has the following configuration in order to achieve the above object. That is, the present invention includes a heating plate that includes at least one of heating means and cooling means, supports a substrate on an upper surface to perform heating or cooling, a substrate support member that mounts and supports the substrate, and the heating plate. In a substrate heat treatment apparatus including a relative elevating unit that relatively elevates and lowers the substrate supporting member, when the lower surface of the substrate and the thermal plate are approached with the relative elevating operation of the thermal plate and the substrate supporting member, A groove for guiding air between the lower surface of the substrate and the hot plate to the outer peripheral direction of the hot plate is formed on the upper surface of the hot plate.

[0018]

The operation of the present invention is as follows. At the time of approaching the lower surface of the substrate and the hot plate with a relative lifting operation of the hot plate and the substrate supporting member for carrying the substrate into the hot plate,
Since the air sandwiched between the lower surface of the substrate and the hot plate escapes toward the outer periphery of the hot plate through the groove, the substrate is supported by the air and floats in the air just before being supported on the upper surface of the hot plate. And the substrate is supported on the hot plate by approaching the hot plate in synchronism with the relative raising and lowering operation of the hot plate and the substrate supporting member, and the substrate does not slide laterally.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a vertical sectional view showing the overall configuration of a substrate heat treatment apparatus according to the present invention. In this example,
The substrate heat treatment device for semiconductor wafers (substrates) will be described as an example, but the present invention is also applicable to substrate heat treatment devices for various substrates such as glass substrates for photomasks, glass substrates for liquid crystal display devices, and optical disc substrates. The invention can be similarly applied.

As shown in FIG. 1, in this substrate heat treatment apparatus, a substrate cooling apparatus 3 as a substrate heat treatment apparatus is provided in the lower part of a housing 2, and a substrate heating apparatus 4 as another substrate heat treatment apparatus is provided above it. It is provided.

A cooling plate 6 as a heating plate is provided in the processing chamber 5 of the substrate cooling device 3. Plural (for example, three) through holes 7 are formed in the cooling plate 6, and plural (for example, three) substrate support pins 8 as substrate supporting members can be moved up and down through these through holes 7. It is provided in. These substrate support pins 8 ... Are integrally attached to a pin attachment member 9, and the pin attachment member 9 is interlockingly connected to a rod 10a of an air cylinder 10 as a relative lifting means. By expanding and contracting the rod 10a of the air cylinder 10, the substrate supporting position on the upper surface of the cooling plate 6 (in this embodiment, the substrate W is placed and supported on the balls 16 provided on the upper surface of the cooling plate 6 as described later). Position) and a lower position lower than the substrate support position, the substrate support pins 8 are moved up and down. The substrate W is carried in and out of the cooling plate 6 by the cooperation of the ascending / descending operation of the substrate supporting pins 8 ... And the substrate carrying operation of the substrate carrying robot.
This will be described later.

The cooling plate 6 includes a heat transfer plate 11 made of aluminum for supporting the substrate W, a water-cooled water cooling plate 12 made of aluminum, and a quenching plate interposed between the heat transfer plate 11 and the water cooling plate 12. Of the Peltier device 13 ... The water cooling plate 12 and the Peltier element 13 constitute the cooling means in the present invention.

The substrate heating device 4 comprises a heating plate 15 as a heating plate provided with a heating means (not shown) such as a plate heater in the processing chamber 14, and the substrate cooling device 3 is provided.
Similarly to the above, a plurality of substrate supporting pins 8 are provided so as to be able to move up and down through the through holes 7 formed in the heating plate 15, and the air cylinder 10 is attached to the pin mounting member 9 to which the substrate supporting pins 8 are integrally mounted. The rods 10a are interlocked and coupled, and the substrate W is carried in and out of the heating plate 15 by the ascending / descending operation of the substrate support pins 8 ... And the substrate carrying operation of the substrate carrying robot. It is supposed to be supported by.

The heat transfer plate 11 and the heating plate 15 constituting the cooling plate 6 are respectively shown in FIG.
As shown in the perspective view of the main part of (the heating plate 15 is described here, the heat transfer plate 11 is also the same), three concave portions are formed in a positional relationship of the vertices of an equilateral triangle, and each of the concave portions is formed. A ball 16 is placed in the. Each of the balls 16 ... Is made of, for example, a low heat transfer member such as alumina or materatite, and the upper side of the balls 16 ...
The substrate W is mounted and supported on the balls 16 in a state where there is a predetermined gap called a so-called proximity gap, and the substrate W can be heated or cooled uniformly.

The heating plate 15 (heat transfer plate 1
One groove 20 is formed in the upper surface of the heating plate 15 so as to pass through the center PC of the upper surface of the heating plate 15 and cross the upper surface of the heating plate 15.

The loading / unloading operation of the substrate W in the apparatus having the above-mentioned structure will be described below. The operation of loading and unloading the substrate W with respect to the heating plate 15 and the operation of loading and unloading the substrate W with respect to the cooling plate 6 (heat transfer plate 11) are the same, so in the following, the loading and unloading of the substrate W with respect to the heating plate 15 is performed. The operation will be described as an example with reference to FIG.

First, the operation of loading the substrate W into the heating plate 15 will be described. During the carrying-in operation, the substrate support pins 8 ... Are previously positioned at the upper position. Then, a substrate transfer robot (not shown) provided outside the substrate heating device 4 (the same applies to the substrate cooling device 3) mounts and supports the arm 30 on which the outer peripheral edge of the substrate W is placed and supported in FIG. The substrate W is moved horizontally from the outside of the substrate heating device 4 into the device 4 by horizontally moving in the X-axis direction, and the substrate W is positioned at a predetermined position above the heating plate 15. The position of this position in the Z-axis direction is slightly above the position above the substrate support pins 8 ...
The position in the Y-axis direction is the same position as the position in the X-axis and Y-axis directions when supporting the substrate W on the heating plate 15 (cooling plate 6) (for example, the center of the upper surface of the heating plate 15 (cooling plate 6)). This is the position where the PC and the center WC of the substrate W coincide. In addition, as shown in FIG. 1, the substrate cooling device 3 and the substrate heating device 4 are stacked, and the substrate transportation robot is configured to carry in and carry out the substrate W to and from the plates 6 and 15 of these devices 3 and 4, respectively. Arm 30
Although it is also moved up and down in the axial direction, the movement in the Z-axis direction at this time is also appropriately controlled according to the position in the Z-axis direction of the delivery position of each device 3, 4.

Next, the arm 30 is lowered, and in the course of this lowering operation, the substrate support pins 8 ... Receive the substrate W from the arm 30 at the upper position and support it. Then, after the substrate transfer robot retracts the arm 30 from the substrate heating device 4, the substrate support pins 8 ... Are lowered to the lower position, and the lowering operation (the heating plate 15 and the substrate support pins 8) is performed.
The substrate W is heated by the heating plate 1
5 is placed on the balls 16 on the upper surface of the substrate 5, so that the substrate W is closely supported by the heating plate 15 at the substrate supporting position. In the lowering operation of the substrate support pins 8 ... (Substrate W), immediately before the substrate W is placed on the balls 16, that is, when the lower surface of the substrate W and the heating plate 15 approach each other, the substrate W.
The air between the lower surface of the heating plate 15 and the heating plate 15 is drawn from the groove 20 into the heating plate 1 as shown by the double-dashed line arrow in FIG.
5, the air between the lower surface of the substrate W and the heating plate 15 can prevent the occurrence of a so-called air bearing phenomenon in which the substrate W temporarily floats in the air and slides sideways. Heating at a substrate support position determined in the Y-axis direction (for example, a position where the center PC of the upper surface of the heating plate 15 (cooling plate 6) and the center WC of the substrate W match) and a substrate support position in the Z-axis direction. It will be closely supported by the plate 15. Therefore, it is possible to uniformly heat (or cool) the substrate W.

Next, the operation of unloading the substrate W from the heating plate 15 will be described. This carry-out operation is performed by the reverse operation of the carry-in operation. That is, the substrate support pins 8 are raised from the lower position to the upper position, and in the process of this raising operation,
The substrate W closely supported on the heating plate 15 (same for the cooling plate 6) is placed, supported, and lifted to position the substrate W at the upper position. Next, the substrate transfer robot uses the arm 3
0 is horizontally moved in the X-axis direction and inserted into the substrate heating device 4. The position of the arm 30 in the Y-axis direction and the horizontal movement amount in the X-axis direction at this time are the same as those at the time of the carry-in operation, but Z
The position in the axial direction is controlled so that the substrate support pins 8 ... Are located slightly below the upper position supporting the substrate W. Then, by raising the arm 30 from that position, the outer peripheral edge of the substrate W is placed and supported on the arm 30 in the raising process, and the substrate W is supported by the substrate support pins 8 ...
Passed to 0. Then, the arm 30 is withdrawn to the outside of the substrate heating device 4, and the substrate W is transported to the outside of the substrate heating device 4.

When the substrate W is transferred from the substrate support pins 8 to the arm 30 when, for example, the substrate W is slid sideways by the air bearing during the carry-in operation described above, the substrate W is moved in the X-axis and Y-axis directions. Is displaced from a predetermined position, while the substrate transfer robot receives the substrate W at the delivery position (in other words,
Arm 30 (regardless of positional displacement due to side slip of substrate W)
Since the operation control is performed, the arm 30 may not be able to accurately place (support) the outer peripheral edge of the substrate W (cannot receive it), or the substrate W may be damaged. However, in the present embodiment, the sideslip of the substrate W is prevented during the loading operation of the substrate W, so that the arm 30 can accurately receive the substrate W from the substrate support pins 8.

As described above, according to this embodiment, the air between the lower surface of the substrate W and the heating plate (the heating plate 15 or the cooling plate 6) at the time of the lowering operation of the substrate W during the loading of the substrate W is supplied to the substrate W. Since the groove 20 is formed on the upper surface of the hot plate as an air escape path leading to the outer peripheral direction of the (hot plate), the side slip of the substrate W due to the air bearing during the loading of the substrate W is eliminated, and the predetermined substrate support is performed. The substrate W can be accurately loaded into the position, the heating or cooling of the substrate W can be performed uniformly, and the substrate support pins 8 when the substrate W is unloaded.
The transfer of the substrate W from the armature to the arm 30 can be performed accurately.

Further, in this embodiment, since the groove 20 is formed on the upper surface of the heating plate to prevent the displacement of the substrate W when the substrate W is carried in, a guide member for preventing the displacement of the substrate W is unnecessary. Becomes In the conventional example provided with the guide member, it was not possible to flexibly cope with the substrate size, but according to the present embodiment, even if the substrate size is changed, it is possible to prevent the sideslip of the substrate W when descending without changing the configuration, Groove 20 is X of arm 30
It does not hinder the movement in the direction.

Further, in this embodiment, in order to prevent the sideways sliding of the substrate W due to the air bearing when the substrate W is carried in, the posture of the substrate W when supported by the hot plate and the upper surface of the hot plate are accurately adjusted. Even if it is not kept horizontal, it may be kept horizontal to some extent, and the descending speed of the substrate can be increased to some extent. Therefore, it is possible to reduce the labor and time required for assembling the substrate support pins 8 ...
The processing efficiency can be improved.

The air cylinder 1 is used as an elevating means.
If 0 is used and the operation is performed at low speed, the air cylinder 1
Although the operating speed tends to be unstable as a characteristic of 0, in this embodiment, the side slip of the substrate W can be prevented even if the descending speed of the substrate supporting pins 8 is increased to some extent.
Since 0 can be used at high speed, even when the air cylinder 10 is used as the relative elevating means, it is convenient to avoid instability of the elevating operation.

In addition to the air cylinder 10, as the relative elevating means, for example, a rod is provided so as to project from the pin mounting member 9 and a screw is formed on the rod, while an inner screw meshing with the screw is formed. It is also possible to realize various structures such as a so-called ball screw structure in which the inner screw member is rotated by an electric motor.

In this embodiment, the heating plate 15
By moving the substrate support pins 8 up and down without moving the (cooling plate 6) up and down, the heating plate 15 (cooling plate 6)
Although the substrate support pin 8 is relatively moved up and down, the invention is not limited to this, and the substrate support pin 8 is not moved up and down and the heating plate 15 (cooling plate 6) is moved up and down. Plate 6) and substrate support pin 8
You may make it raise / lower relatively between and.

Further, in this embodiment, the sideslip of the substrate W at the time of lowering is prevented by forming the groove 20 on the upper surface of the hot plate, and therefore, it is disclosed in Japanese Utility Model Laid-Open No. 6-77231 and Japanese Utility Model Laid-Open No. 6-79140. No new parts are required unlike the device disclosed in Japanese Patent Publication, the configuration is simple, and since the air flow is not forcibly formed unlike these conventional techniques, the substrate W is contaminated. There is no inconvenience.

Further, in the above-mentioned embodiment, the substrate W is constructed so as to be closely supported by the heating plate. However, even if the proximity gap of this apparatus is made small, the sideslip of the substrate W at the time of descending is preferably prevented. Therefore, the processing efficiency is not reduced.

Even in the substrate heat treatment apparatus of the type in which the substrate W is placed in contact with the cooling plate 6 or the heating plate 15 without providing the balls 16 ... By forming the groove 20, it is possible to suitably prevent the substrate W from slipping sideways when it is lowered. It should be noted that the Z of the substrate supporting position in the apparatus of this type is
The position in the direction is the position where the substrate W is placed and supported on the upper surface of the hot plate (cooling plate 6 or heating plate 15).

Next, various modifications of the above embodiment will be introduced, but these modifications can be similarly modified and implemented in an apparatus of the type which contacts and supports the substrate W described above.

In the above embodiment, one groove 20 is formed, but as shown in the plan view of FIG. 4A, two grooves 20 are formed in a cross shape or the plane of FIG. As shown in the figure, a plurality of (three in the figure) grooves 20 may be radially formed to increase the air passageway between the substrate W and the heating plate 15 (6) when descending. . When a plurality of grooves 20 are formed, a line segment L passing through the center PC of the upper surface of the heating plate 15 (6) is virtually determined, and the grooves 20 are symmetrically sandwiched across the line segment L. It is preferably formed.

The depth of the groove 20 may be uniform as shown in the vertical sectional view of FIG. 5 (a), but it is also shown in FIG. 5 (b).
As shown in the vertical sectional view of FIG.
The air between 5 (6) may be easily guided to the outer peripheral direction of the hot plate 15 (6).

Further, the cross-sectional shape of the groove 20 may be semicircular as shown in FIG. 2, or may be rectangular, U-shaped, V-shaped or the like as shown in the sectional view of FIG. It may be.
If the side surface and the bottom surface of the groove 20 are substantially orthogonal to each other as shown in FIG. 6A, it becomes difficult to clean the groove 20. Therefore, in consideration of such a point, the groove 20 and FIG. , (C), a semicircular shape, a U-shape, a V-shape and the like are preferable.

[0044]

As is apparent from the above description, according to the present invention, when the lower surface of the substrate and the hot plate approach each other, the air between the lower surface of the substrate and the hot plate is guided in the outer peripheral direction of the hot plate. Since the groove as an air escape path is formed on the upper surface of the hot plate, it is possible to prevent the side surface of the substrate from slipping due to the air bearing when the lower surface of the substrate and the hot plate approach each other.

Further, according to the present invention, a groove is formed on the upper surface of the hot plate to prevent the side surface of the substrate from slipping when the lower surface of the substrate and the hot plate approach each other. There is also such an effect.

(1) No guide member is required to prevent the side surface of the substrate from slipping when the lower surface of the substrate and the heating plate approach each other, and the size of the substrate can be flexibly changed. Does not hinder the transfer of substrates.

(2) In the present invention, it suffices that the posture of the substrate and the upper surface of the heating plate are kept horizontal to some extent, and the labor and time required for assembling the substrate support pins and the heating plate can be reduced, Even if the approaching speed of the substrate and the hot plate is increased to some extent, the sideslip of the substrate can be prevented, so that the processing efficiency can be improved.

(3) Even in the case of a device in which the substrate is closely supported by the hot plate, the proximity gap of the device can be made small to prevent the side slip of the substrate when the lower surface of the substrate and the hot plate approach each other. The processing efficiency does not decrease.

(4) Japanese Utility Model Publication No. 6-77231 and Japanese Utility Model Publication No. 6-79
Unlike the device disclosed in Japanese Patent Publication No. 140, no new parts are required, the configuration is simple, and since the air flow is not forcedly formed unlike those of the prior art, it may cause contamination of the substrate. It's not convenient.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view showing the overall configuration of a substrate heat treatment apparatus according to the present invention.

FIG. 2 is a perspective view of a main part.

FIG. 3 is a diagram for explaining a substrate loading / unloading operation of the apparatus of this embodiment.

FIG. 4 is a plan view showing a configuration of a modified example.

FIG. 5 is a cross-sectional view showing the configuration of another modification.

FIG. 6 is a cross-sectional view showing the configuration of another modification.

[Explanation of symbols]

 3 ... Substrate cooling device (substrate heat treatment device) 4 ... Substrate heating device (substrate heat treatment device) 6 ... Cooling plate (hot plate) 8 ... Substrate support pin (substrate support member) 10 ... Air cylinder (relative lifting means) 11 ... Transmission Heat plate 12 ... Water cooling plate 13 ... Peltier element 15 ... Heating plate (heat plate) 20 ... Groove W ... Substrate

Claims (1)

[Claims] 1. A hot plate which comprises at least one of a heating unit and a cooling unit, supports a substrate on an upper surface to heat or cool the substrate, a substrate support member for mounting and supporting the substrate, and the hot plate. A substrate heat treatment apparatus comprising a relative elevating means for relatively elevating and lowering the substrate supporting member, wherein the substrate is brought into contact with the lower surface of the substrate and the thermal plate when the relative elevating operation of the thermal plate and the substrate supporting member is performed. A substrate heat treatment apparatus, wherein a groove for guiding air between a lower surface and the hot plate toward an outer peripheral direction of the hot plate is formed on the upper surface of the hot plate.