CN103779257A - Hot plate preventing drifting of wafer during placement - Google Patents
Hot plate preventing drifting of wafer during placement Download PDFInfo
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- CN103779257A CN103779257A CN201410057833.1A CN201410057833A CN103779257A CN 103779257 A CN103779257 A CN 103779257A CN 201410057833 A CN201410057833 A CN 201410057833A CN 103779257 A CN103779257 A CN 103779257A
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- hot plate
- hole
- plate body
- metal wire
- drift
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- Condensed Matter Physics & Semiconductors (AREA)
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a hot plate preventing drifting of a wafer during placement, and belongs to the technical field of semiconductor device tools. The hot plate comprises a hot plate body (10), wherein the hot plate body (10) is provided with through holes (11); the hot plate further comprises a plurality of drifting-preventing components (20) arranged on the hot plate body (10). Each drifting-preventing component (20) comprises a metal column (21) and a hard metal wire (22), wherein the diameter of the hard metal wire (22) is smaller than that of the metal column (21), and the hard metal wire (22) is perpendicularly fixed to the top of the metal column (21). The drifting-preventing components (20) are arranged on the circumference of the hot plate body (10), the height of the drifting-preventing components (20) can be adjusted vertically in the through holes (11) relative to the hot plate body (10), so that the tops of the hard metal wires (22) are exposed out of the front face of the hot plate body (10), and the endpoints of all the hard metal wires (22) are equal in height. The hot plate preventing drifting of the wafer during placement is good in safety performance, convenient and fast to replace, and capable of being repeatedly used for a long time.
Description
Technical field
The present invention relates to the hot plate of wafer-baking in chip manufacture processing procedure, especially a kind of hot plate that prevents from occurring when wafer from placing drift, belongs to semiconductor equipment frock technical field.
Background technology
In the photolithography process of manufacturing at semiconductor device, the heat treatment of wafer is extremely important processing step.In the heat treatment process of wafer, hot plate does not directly contact wafer, mainly by thermal radiation mode, wafer is heated.In general, be coated with photoresistance on wafer after, exposed after and developed after, all need to use hot plate to heat-treat wafer.The thickness of heat treatment meeting to photoresistance and final critical size have a huge impact.
Conventionally the surface of hot plate is very smooth, and wafer rear is also smooth, if hot plate surface is without any processing, when wafer transfer is to hot plate top, transferring to while approaching hot plate surface, due to the reason of air-flow, wafer can produce the drift of side direction, and affects the safety of wafer.Therefore, current industry is by installing anti-skidding contact and in hot plate periphery, anti-skid washer is installed the safety of protecting wafer on hot plate surface.Shown in Fig. 1 and Fig. 2, the end face periphery of hot plate 100 is provided with several anti-skid washers 110, spacing for wafer 200 is carried out, and maintains the gap between wafer 200 and hot plate 100.Each anti-skid washer 110 is up-small and down-big truncated cone shape.In the end face inside of hot plate 100, be provided with several less anti-skidding contacts 120, be generally pottery or quartzy material, it embeds in hot plate 100 in the process of making hot plate 100.
But still there are the following problems:
1, can drop in use for some time in the anti-skidding contact 120 that install on hot plate surface, so that the security presence hidden danger of wafer, and all disposable installations of this contact of industry, after dropping, cannot repair, and causes hot plate to scrap;
2, can surround wafer at the peripheral anti-skid washer 110 of installing of hot plate and place drift, for example, with direction shown in arrow A, by mechanical arm, wafer 200 is sent to hot plate 100, but the mechanical arm of working as transmission wafer is improper because position deviation causes wafer to place, so that a skew back of wafer leans against on peripheral anti-skid washer 110, there is the oblique sheet phenomenon of wafer, as shown in Figure 3, can make photoresistance membrane thickness unevenness, cause critical size inhomogeneous, when serious, can cause litho pattern to disappear; If abnormal wafer is not detected, and flow to final test, can cause product rejection.
Summary of the invention
The object of the invention is to overcome the deficiency of above-mentioned hot plate, provide a kind of security performance good, change the hot plate that prevents from occurring when wafer from placing drift convenient, can prolonged and repeated use.
the object of the present invention is achieved like this:
A kind of hot plate that prevents from occurring when wafer from placing drift of the present invention, comprises hot plate body, and described hot plate body is provided with through hole, and described through hole runs through hot plate body up and down.
The present invention also comprises several anti-drift parts that are arranged on hot plate body, described anti-drift parts comprise metal column and horminess metal wire, the diameter of described horminess metal wire is less than the diameter of metal column, and be vertically fixed on the top of metal column, described anti-drift parts are arranged on center take hot plate body as the center of circle, take wafer radius 1/4th to 3/4ths in arbitrary value on the circumference of the hot plate body of radius, described anti-drift parts can be adjusted up and down height with respect to hot plate body in through hole, the front of exposing hot plate body to the top of described horminess metal wire, and the end points of all described horminess metal wires is contour.
The positive height h that hot plate body is exposed at the top of horminess metal wire of the present invention is 0.1～0.3mm.
The number of turns of circumference of the present invention is 1～3 circle, and described anti-drift parts evenly arrange 3～4 on each circumference.
The inwall that the post jamb of metal column of the present invention is provided with external screw thread, through hole is provided with internal thread, and metal column with respect to the upper and lower turn of through hole, and drives horminess metal wire to move up and down by screw thread.
Through hole of the present invention is by hole I and be vertically connected at ⅠShang hole, hole II and form, described hole I overlaps with the central shaft of hole II, the diameter of described hole II is greater than the diameter of horminess metal wire and is less than the diameter of hole I, and described metal column is positioned at the degree of depth that length that hole I, horminess metal wire be positioned at hole II and described horminess metal wire is greater than hole II.
The inwall that the post jamb of metal column of the present invention is provided with external screw thread, hole I is provided with internal thread, and metal column with respect to the upper and lower turn of hole I, and drives horminess metal wire to move up and down in the II of hole by screw thread.
The degree of depth of hole of the present invention I is less than the thickness of hot plate body.
Alternatively, the degree of depth of described hole I be hot plate body thickness 2/9ths to 4/9ths.
A kind of manufacturing process that prevents from occurring when wafer from placing the hot plate of drift of the present invention, its technical process is as follows:
Step 1: mapping obtains the thickness of hot plate body;
Step 2: in the back side of hot plate body punching I;
Step 3: in the front of hot plate body, the circle centre position punching II of corresponding aperture I;
Step 4: several anti-drift parts as above are set on hot plate body, and it is contour to the end points of horminess metal wire to adjust all anti-drift parts.
Anti-drift parts of the present invention form as follows:
In the nose-circle of the described metal column III of punching in the heart, and horminess metal wire is vertically embedded and is fixed in metal column by hole III.
The present invention is owing to being evenly provided with several anti-drift parts on hot plate, when wafer is sent to hot plate by mechanical arm, some ground of the horminess metal wire of anti-drift parts has weakened the transmission inertia that air-flow causes, and makes wafer rely on self gravitation slowly to decline, and enters in the heat treatment space of hot plate; Afterwards, carry out heating processing by hot plate.
The invention has the beneficial effects as follows:
1, the anti-drift parts of installing on hot plate body can effectively prevent that wafer from approaching the drift that hot plate when surface, side direction occurred being put into, and have effectively reduced wafer and occur the phenomenon of oblique sheet, have guaranteed the safety of wafer, have improved the yield of wafer-baking;
2, it is convenient that anti-drift parts super quality and competitive price, making are simply, replacing facilitates, adjusts, and can prolonged and repeatedly use.
accompanying drawing explanation
Fig. 1 is the structural representation of existing a kind of hot plate, and wafer falls into the situation in spacing space;
Fig. 2 is the end view of Fig. 1, and wafer falls into the situation in spacing space;
Fig. 3 is the schematic diagram that the side-looking of oblique sheet phenomenon has occurred wafer;
Fig. 4 is a kind of structural representation that prevents from occurring when wafer from placing the hot plate of drift of the present invention;
Fig. 5 is the cutaway view that amplify the part of the embodiment mono-of Fig. 4;
Fig. 6 is the cutaway view that amplify the part of the embodiment mono-of Fig. 4;
Wherein, hot plate body 10
Through hole 11
Hole I 111
Hole II 112
Hole III 211
Horminess metal wire 22
Wafer 30.
Embodiment
Referring to Fig. 4 to Fig. 6, a kind of hot plate that prevents from occurring when wafer from placing drift of the present invention, it arranges hot plate body 10 relatively and adjusts up and down several anti-drift parts 20 highly on hot plate body 10, anti-drift parts 20 are arranged on take hot plate body 10 center as the center of circle, take wafer 30 radius r 1/4th to 3/4ths in arbitrary value on the circumference of the hot plate body 10 of radius, as shown in Figure 4.Usually, on a hot plate body 10, get 1～3 circumference, 3～4 anti-drift parts 20 are evenly set on each circumference.
Now will with reference to accompanying drawing, the present invention be described more fully hereinafter, exemplary embodiment of the present invention shown in the drawings, thus scope of the present invention is conveyed to fully those skilled in the art by the disclosure.But the present invention can realize in many different forms, and should not be interpreted as being limited to the embodiment setting forth here.
Embodiment mono-
Referring to Fig. 5, a kind of hot plate that prevents from occurring when wafer from placing drift of the present invention, hot plate body 10 is provided with the through hole 11 that runs through up and down hot plate body 10, and the inwall of through hole 11 is provided with internal thread, and the external screw thread arranging with the post jamb of metal column 21 mates.Metal column 21 with respect to through hole turn Shang Xia 11, and drives horminess metal wire 22 to move up and down the front of exposing hot plate body 10 to the top of horminess metal wire 22 by screw thread.Each anti-drift parts 20, by after calibrating, makes the end points of all horminess metal wires 22 contour.
Embodiment bis-
Referring to Fig. 6, a kind of hot plate that prevents from occurring when wafer from placing drift of the present invention, hot plate body 10 is provided with by hole I 111 and is connected in the through hole 11 that the hole II 112 in hole I 111 forms, through hole 11 runs through hot plate body 10 up and down, hole I 111 overlaps with the central shaft of hole II 112, the diameter of hole I 111 is greater than the diameter of hole II 112, and the diameter of hole II 112 is greater than the diameter of horminess metal wire 22.Metal column 21 is positioned at the depth H 2 that length that hole I 111, horminess metal wire 22 be positioned at hole II 112 and horminess metal wire 22 is greater than hole II 112.Usually, the diameter 0.2～0.5mm of hole II 112.The depth H 1 of hole I 111 is less than the thickness H of hot plate body 10.Preferably, the degree of depth of hole I 111 be hot plate body 10 thickness 2/9ths to 4/9ths.If, the thickness of hot plate body 10 is 10 to 20mm, the degree of depth of hole I 111 can be 3～6mm.The inwall that the post jamb of metal column 21 is provided with external screw thread, hole I 111 is provided with internal thread, and metal column 21 with respect to the turn Shang Xia 111 of hole I, and drives horminess metal wire 22 to move up and down in hole II 112 by screw thread.Each anti-drift parts 20, by after calibrating, makes the end points of all horminess metal wires 22 contour.
A kind of manufacturing process that prevents from occurring when wafer from placing the hot plate of drift of the present invention, its technical process is as follows:
Step 1: mapping obtains the thickness H of hot plate body 10;
Step 2: in the back side of hot plate body 10 punching I 111, the depth H 1 of hole I 111 is less than the thickness H of hot plate body 10;
Step 3: in the front of hot plate body 10, the circle centre position punching II 112 of corresponding aperture I 111, hole II 112 connects with hole I 111, and central shaft coincidence, the depth H 2:H-H1 of hole II 112;
Step 4: anti-drift parts 20 are set on hot plate body 10, the horminess metal wire 22 of anti-drift parts 20 passes hole I 111 from the bottom up to hole II 112, metal column 21 rotates up, drive horminess metal wire 22 upwards, expose hole II 112 to horminess metal wire 22, adjust all anti-drift parts 20 contour to the end points of horminess metal wire 22.
Wherein, anti-drift parts 20 form as follows: the III 211 of punching on the center of circle on metal column 21 tops, the internal diameter of hole III 211 is greater than the external diameter of horminess metal wire 22, generally get the diameter 0.2～0.5mm of hole III 211, the degree of depth 3～5mm, and horminess metal wire 22 is vertically embedded by hole III 211 and be fixed in metal column 21.Metal column 21 can be also common self-tapping screw, forms anti-drift parts 20 through repacking.Self-tapping screw super quality and competitive price, its hex(agonal)screw tail also contributes to rotation, changes conveniently.
In use, if the insufficient height of horminess metal wire 22, the upwards anti-drift parts 20 of turn, raise horminess metal wire 22 height; If horminess metal wire 22 serious wear, the anti-drift parts 20 that can more renew.
Due to anti-drift parts 20 super quality and competitive price, make simple, change convenient, adjust conveniently, can stably guarantee the security performance of hot plate, when wafer is placed, do not drift about and oblique sheet phenomenon do not occur, improved the heat treatment yield of wafer.
The present invention is a kind of prevents that the structure that the hot plate of drift occurs when wafer is placed is not limited to above preferred embodiment; therefore any those skilled in the art without departing from the spirit and scope of the present invention; any modification, equivalent variations and the modification above embodiment done according to technical spirit of the present invention, all fall in the protection range that the claims in the present invention define.
Claims (10)
1. a hot plate that prevents from occurring when wafer from placing drift, comprises hot plate body (10),
It is characterized in that: described hot plate body (10) is provided with through hole (11), described through hole (11) runs through hot plate body (10) up and down;
Also comprise several anti-drift parts (20) that are arranged on hot plate body (10), described anti-drift parts (20) comprise metal column (21) and horminess metal wire (22), the diameter of described horminess metal wire (22) is less than the diameter of metal column (21), and be vertically fixed on the top of metal column (21), described anti-drift parts (20) are arranged on center take hot plate body (10) as the center of circle, take wafer radius 1/4th to 3/4ths in arbitrary value on the circumference of the hot plate body (10) of radius, described anti-drift parts (20) can be adjusted up and down height with respect to hot plate body (10) in through hole (11), expose the front of hot plate body (10) to the top of described horminess metal wire (22), and the end points of all described horminess metal wires (22) is contour.
2. hot plate according to claim 1, is characterized in that: the positive height h that hot plate body (10) is exposed at the top of described horminess metal wire (22) is 0.1～0.3mm.
3. hot plate according to claim 1, is characterized in that: the number of turns of described circumference is 1～3 circle, and described anti-drift parts (20) evenly arrange 3～4 on each circumference.
4. according to the hot plate described in any one in claims 1 to 3, it is characterized in that: the inwall that the post jamb of described metal column (21) is provided with external screw thread, through hole (11) is provided with internal thread, metal column (21) with respect to the upper and lower turn of through hole (11), and drives horminess metal wire (22) to move up and down by screw thread.
5. according to the hot plate described in any one in claims 1 to 3, it is characterized in that: described through hole (11) is by hole I (111) and be vertically connected at hole II (112) formation in hole I (111), described hole I (111) overlaps with the central shaft of hole II (112), the diameter of described hole II (112) is greater than the diameter of horminess metal wire (22) and is less than the diameter of hole I (111), described metal column (21) is positioned at hole I (111), the length that horminess metal wire (22) is positioned at hole II (112) and described horminess metal wire (22) is greater than the degree of depth of hole II (112).
6. hot plate according to claim 5, it is characterized in that: the inwall that the post jamb of described metal column (21) is provided with external screw thread, hole I (111) is provided with internal thread, metal column (21) with respect to the upper and lower turn of hole I (111), and drives horminess metal wire (22) to move up and down in hole II (112) by screw thread.
7. hot plate according to claim 6, is characterized in that: the degree of depth of described hole I (111) is less than the thickness of hot plate body (10).
8. hot plate according to claim 7, is characterized in that: the degree of depth of described hole I (111) be hot plate body (10) thickness 2/9ths to 4/9ths.
9. a manufacturing process that prevents from occurring when wafer from placing the hot plate of drift, its technical process is as follows:
Step 1: mapping obtains the thickness of hot plate body (10);
Step 2: in the back side punching I (111) of hot plate body (10);
Step 3: in the front of hot plate body (10), the circle centre position punching II (112) of corresponding aperture I (111);
Step 4: several anti-drift parts (20) as described in any one in claim 1 to 8 are set on hot plate body (10), and it is contour to the end points of horminess metal wire (22) to adjust all described anti-drift parts (20).
10. the manufacturing process that prevents from occurring when wafer from placing the hot plate of drift according to claim 9, is characterized in that: described anti-drift parts (20) form as follows:
In the nose-circle of described metal column (21) III (211) of punching in the heart, and horminess metal wire (22) is vertically embedded by hole III (211) and be fixed in metal column (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410057833.1A CN103779257B (en) | 2014-02-20 | 2014-02-20 | Hot plate capable of preventing wafer from drifting when placed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410057833.1A CN103779257B (en) | 2014-02-20 | 2014-02-20 | Hot plate capable of preventing wafer from drifting when placed |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103779257A true CN103779257A (en) | 2014-05-07 |
| CN103779257B CN103779257B (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410057833.1A Active CN103779257B (en) | 2014-02-20 | 2014-02-20 | Hot plate capable of preventing wafer from drifting when placed |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148417A (en) * | 1995-11-24 | 1997-06-06 | Dainippon Screen Mfg Co Ltd | Heat-treating device for substrate |
| CN202473851U (en) * | 2011-12-02 | 2012-10-03 | 上海宏力半导体制造有限公司 | Hot plate device preventing wafer from overlapping |
-
2014
- 2014-02-20 CN CN201410057833.1A patent/CN103779257B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148417A (en) * | 1995-11-24 | 1997-06-06 | Dainippon Screen Mfg Co Ltd | Heat-treating device for substrate |
| CN202473851U (en) * | 2011-12-02 | 2012-10-03 | 上海宏力半导体制造有限公司 | Hot plate device preventing wafer from overlapping |
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| Publication number | Publication date |
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| CN103779257B (en) | 2017-03-15 |
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