JPH0864279A - Mounting structure of panel - Google Patents

Abstract

PURPOSE: To provide the mounting structure of a panel with which highly reliable connection between electrode terminals 13 of the panel 11 and electrode terminals 16 of a flexible substrate 15 can be achieved even if pitches P between the terminals are fine. CONSTITUTION: H and N are respectively defined as the extruded degree of a n electrode terminal 16 and the number of conductive particles per unit surface area of an anisotropic conductive film 17. While considering the position difference Z, practical overlapping width of respective electrode terminals 13, 16 in connected state in pitch direction is expressed as D and the practical overlapping width in the longitudinal direction is expressed as L (not shown in the figure). In the case the number of conductive particles 22 of the anisotropic conductive film 17 existing in an overlapping area D.L is expressed as n; n, H, and N values are so set as to satisfy the following expression; n=α(βH +1).N<1/2> .D.L (wherein α, β are constants determined based on the characteristics of the material for the anisotropic conductive film and the conditions such as the pressure, temperature, etc., at the time of connection).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel mounting structure designing method for connecting an electrode terminal of a panel and an electrode terminal of a flexible substrate through an anisotropic conductive film. It also relates to the mounting structure of the panel. The panel is a display panel using, for example, liquid crystal, electroluminescence plasma, or the like.

[0002]

2. Description of the Related Art Conventionally, electrode terminals provided on the peripheral portion of a panel and electrode terminals provided on a flexible substrate are connected as follows.

As shown in FIGS. 11 and 12 (a sectional view taken along the line AA of FIG. 11), the electrode terminals 4 on the flexible substrate 2 on which the driving IC (integrated circuit) 1 is mounted are connected to the conductive particles 5. diameter ^{d (8 × 10 -3 mm~10 ×} 10 -3 mm) with respect to the film thickness ^{b (20 × 10 -3 mm~30 ×} 10 -3 mm) is very thick (b "d) and thickness The anisotropic conductive film 6 having several conductive particles 5 in the direction is interposed and thermocompression-bonded to the electrode terminals 7 of the panel 8.

At this time, the electrode terminals 4 on the flexible substrate 2 are bonded to the flexible substrate 2 via a reinforcing adhesive sheet 3 with a copper foil sheet, and the copper foil sheet is etched to have a thickness a ( = 18 × 10 ^-3
mm or more). The thickness of the electrode terminal 7 on the panel 8 side is the thickness a of the electrode terminal 4 on the flexible substrate 2 side.
It is set to be sufficiently smaller than.

A panel 8 having electrode terminals with a finer pitch is formed on the flexible substrate 2 on which the above-mentioned driving IC is mounted.
When connecting to, the insulating film 9 is coated around the conductive particles 5 in the anisotropic conductive film 6. Then, the insulating film 9 in the thickness direction (electrode terminal connection direction) of the anisotropic conductive film 6 is peeled off by pressure when the electrode terminal 4 on the flexible substrate 2 side is thermocompression bonded to the electrode terminal 7 on the panel 8 side. The two electrode terminals 4 and 7 are electrically connected (for details, see Suzuki: "LCD panel-LSI joining technology" electronic material 19).
1992 November issue).

[0006]

When connecting fine pitch electrode terminals, it is necessary to have conductive particles 5 present between the electrode terminals 7 on the panel 8 side and the electrode terminals 4 on the flexible substrate 2 side during thermocompression bonding. Securing the number is most important.

With respect to this item, a method of connecting the panel 8 having the conventional electrode terminals 7 to the flexible substrate 2 will be examined below.

The number of the conductive particles 5 between the two electrode terminals 4, 7 at the time of thermocompression bonding is such that the conductive particles 5 existing in the anisotropic conductive film 6 are connected by thermocompression bonding.
Depends on the proportion located in between. In order to maintain reliable connection strength, the adhesive between the anisotropic conductive films 6 must be sufficiently filled in the space between the adjacent electrode terminals 4 and 4 on the flexible substrate 2 side. The anisotropic conductive film 6 needs to have a film thickness corresponding to the thickness a of the electrode terminal 4 on the flexible substrate 2 side.

However, as described above, since the thickness a of the electrode terminal 4 is sufficiently larger than the conductive particle diameter d, the thickness of the anisotropic conductive film 6 is also sufficiently larger than the conductive particle diameter d. Therefore, the flow of the resin of the anisotropic conductive film 6 increases during thermocompression bonding, and the conductive particles 5 also flow into the space between the electrode terminals 4 and 4 due to the stress during the resin flow. Therefore, the number of conductive particles 5 between the two electrode terminals 4 and 7 is reduced, and the number required for conduction cannot be secured.

There is also a problem that the conductive particles 5 flowing into the space between the adjacent electrode terminals 4 and 4 on the side of the flexible substrate 2 are aggregated to cause a leak between the adjacent electrode terminals 4 and 4. is there.

From the above points, in the conventional method of connecting the panel 8 having the electrode terminals 7 to the flexible substrate 2, it is difficult to connect the electrode terminals having a fine pitch of 8 × 10 ^-2 mm or less.

There is also a method of forming an insulating film 9 around the conductive particles 5 in the anisotropic conductive film 6 in order to reduce the leak between the adjacent electrode terminals 4 and 4. However, in that case, it is necessary to peel off the insulating film 9 by the pressure at the time of thermocompression bonding, and the panel 8 may be destroyed by the strong pressure at that time. In addition, the insulating film 9 may not be completely peeled off.

Therefore, an object of the present invention is to provide a highly reliable connection even with a fine pitch when connecting an electrode terminal of a panel and an electrode terminal of a flexible substrate through an anisotropic conductive film. It is to provide a method for designing a mounting structure of a panel.

Further, conventionally, as shown in FIG. 9, only alignment marks 10 are provided at the ends of the array of electrode terminals 4 on the flexible substrate 2. No special measures have been taken to prevent the membrane 6 from flowing out. Therefore, as shown in FIG.
(Corresponding to a section taken along the line D), the anisotropic conductive film 6 flows out at the end of the flexible substrate 2, resulting in poor connection reliability.

Therefore, a further object of the present invention is to provide a panel mounting structure capable of preventing the anisotropic conductive film 6 from flowing out from the end of the flexible substrate.

[0016]

In order to achieve the above object, a panel mounting structure according to a first aspect of the present invention is a strip-shaped first electrode provided in a line at a predetermined pitch P on the peripheral portion of the panel. In a mounting structure of a panel for connecting a terminal and a strip-shaped second electrode terminal provided on a flexible substrate corresponding to the first electrode terminal of the panel via an anisotropic conductive film, The height at which the second electrode terminal protrudes in a mesa shape from the substrate surface of the flexible substrate is H, and the number of conductive particles existing per unit area of the anisotropic conductive film is N, and the panel and the flexible substrate are In consideration of the positional deviation, the width L where the first and second electrode terminals actually overlap in the longitudinal direction in the connected state is L, and the first and second electrode terminals are in a direction perpendicular to the longitudinal direction. The width that actually overlaps with Serial respective first, in a region where the second electrode terminal overlaps in fact, when the number of conductive particles of the anisotropic conductive film exists was n, n = α (βH + 1) · N 1/2 · D L (1) (where α and β are constants determined by the material properties of the anisotropic conductive film and the conditions such as pressure and temperature at the time of connection) so that the above n is satisfied. , H and N are set, the uniform thickness of the anisotropic conductive film before connection is set to t, and the first and second anisotropic conductive films after connection are set to t.
The thickness between the electrode terminals is t ₀ , the distance between the shoulders of the mesas of the second electrode terminals adjacent to each other on the substrate surface is l ₁ , and the distance between the adjacent second electrode terminals on the substrate surface is l ₂ . Then, t = (l ₁ + l ₂ ) · H / (2 · P) + t ₀ + γ (2) (where γ is the material characteristics of the anisotropic conductive film and the conditions such as pressure and temperature at the time of connection) The value of t is set so that the relational expression is satisfied, and the values of the constants α, β, and γ are 0.015 ≦ α ≦ 0.035 (unit (pieces)). ^1/2 / mm) −0.005 ≧ β ≧ −0.025 (unit 1 / mm) 0 ≦ γ ≦ 9.0 (unit 10 ⁻³ mm).

The panel mounting structure described in claim 2 is characterized in that, in the panel mounting structure according to claim 1, the value of n is set within a range of 5 ≦ n.

According to a third aspect of the present invention, in the panel mounting structure, a plurality of strip-shaped first electrode terminals are provided side by side at a predetermined pitch P on the periphery of the panel, and the first panel of the panel is provided on the flexible substrate. In a mounting structure of a panel in which strip-shaped second electrode terminals provided corresponding to the electrode terminals are connected via an anisotropic conductive film, the arrangement of the second electrode terminals of the flexible substrate is arranged. Has a substantially U-shaped pattern open toward the second electrode terminal side at the end of
It is characterized in that a dummy electrode terminal which does not correspond to the first electrode terminal of the panel is provided.

[0019]

The mounting structure of the panel according to claim 1 will be described below.

In this mounting structure, each parameter important for fine pitch connection, that is, the height (protrusion amount) at which the second electrode terminal protrudes in a mesa shape from the substrate surface is H (mm). In addition, taking into account the positional shift Z (mm) between the panel and the flexible substrate, the width that actually overlaps in the longitudinal direction of each of the first and second electrode terminals in the connected state is L (mm), each of the first and second The width in which the second electrode terminals actually overlap in the direction perpendicular to the longitudinal direction (pitch direction) is D (mm). The number of conductive particles existing per unit area of the anisotropic conductive film is N (pieces /
mm ² ).

When the number of conductive particles of the anisotropic conductive film is n in the area D / L where the first and second electrode terminals actually overlap in the connected state, = Α (βH + 1) · N ^1/2 · D · L (1) (where α and β are constants determined by the material properties of the anisotropic conductive film and the pressure, temperature, etc. at the time of connection. ) Was obtained from various experiments.

Regarding this equation (1), each parameter is set by the following procedure.

First, a connection error (positional deviation) Z, a connection pitch P, a connection width D in the pitch direction, a minimum insulation width (an edge of one first electrode terminal on the panel side and a first electrode adjacent to this edge). From the geometrical relationship, the relational expression Z = [P− (D + S)] / 2 (3) is obtained between the minimum value (S) of the second electrode terminal on the flexible substrate side corresponding to the terminal. To establish.

Here, the connection error Z is determined from the mechanical error of the automatic connection device and the like. The connection pitch P is set as P = 50 × 10 ⁻³ mm as a target specification of the panel. The minimum insulation width S is determined by the resin characteristics of the anisotropic conductive film 17. Therefore, the minimum connection width D in the pitch direction is determined from the equation (3).

In order to realize the minute connection pitch P, the number n of conductive particles (the number of connection particles) existing in the connection area D / L is an important parameter. It is known from various experimental results that the number n of connecting particles capable of ensuring high reliability is 5 or more (preferably 10 or more). Therefore, even if the connection width becomes the minimum connection width D, it is necessary to secure a predetermined number (for example, 5) or more as the number n of connection particles.

Further, the values of α and β in the equation (1) have variations due to statistical errors. Therefore, in consideration of this variation, the values of H and N are determined so that the number of connected particles n is equal to or more than the above-mentioned predetermined number. As a result, the required number of connected particles n can be secured.

Next, the thickness t of the anisotropic conductive film used for connection is
Determine.

Let t be the uniform thickness of the anisotropic conductive film before connection. In addition, the thickness of the anisotropic conductive film between the first electrode terminal and the second electrode terminal after connection is t ₀ .

The second adjacent to each other on the board surface of the flexible board.
The distance between the shoulders of the mesas of the electrode terminals is l ₁ , the second adjacent
When the distance of the electrode terminal of the electrode terminal on the substrate surface is l ₂ , t = (l ₁ + l ₂ ) · H / (2 · P) + t ₀ + γ (2) (where γ is This is a constant determined by the material characteristics of the anisotropic conductive film and the conditions such as pressure and temperature at the time of connection.) The preset value of the protrusion amount H is substituted into this equation (2) to determine the set value of t.

In this case, the flow of the resin of the anisotropic conductive film during thermocompression bonding can be minimized. Therefore, it is possible to prevent the leak caused by the conductive particles 22 condensing in the space between the adjacent second electrode terminals. As a result, the reliability of connection can be improved even with a fine pitch.

In the mounting structure of this panel, the values of the constants α, β, γ are 0.015 ≦ α ≦ 0.035 (unit (piece) ^1/2 / mm) −0.005 ≧ β, respectively. Since it is set in the range of ≧ −0.025 (unit 1 / mm) 0 ≦ γ ≦ 9.0 (unit 10 ⁻³ mm), realistic material characteristics of anisotropic conductive film and pressure at the time of connection, Parameters H and N in equation (1) are set according to conditions such as temperature.

According to the panel mounting structure of claim 2,
Since the value of n is set within the range of 5 ≦ n, the necessary number n of conductive particles is secured in the area D / L where the first and second electrode terminals actually overlap in the connected state. It

According to the panel mounting structure of claim 3,
A dummy electrode that has a substantially U-shaped pattern that opens toward the second electrode terminal side at the end of the array of the second electrode terminals of the flexible substrate and does not correspond to the first electrode terminal of the panel. Since the terminal is provided, the resin of the anisotropic conductive film is prevented from flowing out at the end of the flexible substrate during connection. Therefore, the anisotropic conductive film is filled between the panel and the flexible substrate with a uniform thickness, and as a result, the reliability of connection is improved.

[0034]

EXAMPLES The panel mounting structure of the present invention will be described in detail below with reference to examples.

FIG. 1 shows a panel and a flexible substrate to be mounted. In addition, FIG. 2 is BB in FIG.
A line cross section is shown. As shown in these drawings, a plurality of strip-shaped first electrode terminals 13 are provided in the peripheral portion of the panel 11 (glass substrate 12) at a predetermined pitch P, and a flexible substrate 15 is provided with the first electrode 11 of the panel 11. Strip-shaped second electrode terminal 16 provided corresponding to the electrode terminal 13 of
And are connected via the anisotropic conductive film 17.

As shown in FIG. 1, the flexible substrate 15 is provided with a window 31 penetrating the substrate, and a driving IC 14 for driving the panel 11 is mounted on the window 31. The driving IC 14 is connected to a wiring patterned by etching, and the end portion of the wiring serves as the second electrode terminal 16.

Here, as shown in FIG. 2, each important parameter for fine pitch connection, that is, the height (protrusion amount) at which the second electrode terminal 16 protrudes from the substrate surface 23 in a mesa shape is H. (Mm). The thickness of the electrode terminal 13 on the panel 11 side is the same as that of the electrode terminal 16 on the flexible substrate 15 side.
Is set to be sufficiently smaller than the thickness of. Further, the positional deviation Z (m
m), the width in which the electrode terminals 13 and 16 actually overlap in the longitudinal direction in the connected state is L (mm) (see FIG. 1), and the electrode terminals 13 and 16 are perpendicular to the longitudinal direction (pitch). The width that actually overlaps with the (direction) is D (mm). The number of the conductive particles 22 existing per unit area of the anisotropic conductive film 17 is N (pieces / mm ² ).

When the number of the conductive particles 22 of the anisotropic conductive film 17 existing in the area of the area D · L where the electrode terminals 13 and 16 actually overlap in the connected state is n (n), n = α (βH + 1) · N ^1/2 · D · L (1) (where α and β are constants determined by the material properties of the anisotropic conductive film and the pressure, temperature, etc. at the time of connection.) It has been obtained from various experiments that the following relational expression holds. For example, as shown in FIG. 3, when the connection width L in the longitudinal direction of the terminal is set to L = 1.44 mm and various values of H and N are set as parameters, n and D are respectively set according to the values of H and N. A linear constant relationship is obtained between the two (see Fig. 3
Further, in FIG. 4, H and D are shown in μm units for convenience. ). In this example, α = 0.0243 ((pieces) ^1/2 / m
m) and β = −0.015 (1 / mm). In FIG. 3, the relationship of the formula (1) when H = 18 μm and N = 450 pieces / mm ² is represented by “◯”, H = 18 μm, N = 6500.
The relation of the formula (1) when the number of pieces / mm ² is represented by “●”, H = 3
The relation of the formula (1) when 5 μm and N = 750 / mm ² is marked with “□”, and the relation of the formula (1) when H = 25 μm and N = 750 / mm ² is marked with “Δ”, H = 18 μm, N = 7
The relationship of the formula (1) when the number is 50 / mm ² is represented by the symbol “◆”.

As shown in FIG. 4, it can be seen that this equation (1) is in very good agreement with the newly experimented value this time.
In FIG. 4, the connection width L in the terminal longitudinal direction is set to L = 2.0 mm,
The relationship of the formula (1) when H = 18 μm and N = 3300 / mm ² is represented by “◯”. In addition, the connection width L in the longitudinal direction of the terminal is the heating tool 50 for pressurizing and heating.
Since it depends on the durability (see FIG. 1), the same value as the current tool width L = 2.0 mm was adopted this time.

Regarding this equation (1), each parameter is set by the following procedure.

First, between the connection error (positional deviation) Z, the connection pitch P, the connection width D in the pitch direction, and the minimum insulation width S,
From the geometrical relationship shown in FIG. 2, the relational expression Z = [P- (D + S)] / 2 (3) holds.

Here, the connection error Z is determined by the mechanical error of the automatic connection device, etc., and Z = 17.5 × 10 ⁻³ mm. The connection pitch P is, for example, P as the target specification of the panel.
= 50 × 10 ⁻³ mm. The minimum insulation width S is determined by the resin characteristics of the anisotropic conductive film 17, and the panel 11
The minimum value of the distance between the edge of one electrode terminal 13 on the side and the electrode terminal 16 on the side of the flexible substrate 15 corresponding to the electrode terminal 13 adjacent thereto is defined. Minimum insulation width S = 1
When it is set to 0 × 10 ⁻³ mm, the minimum connection width D in the pitch direction is D = 5 × 10 ⁻³ mm from the formula (3).

The connection pitch P = 50 × 10 ^-3 mm
In order to realize the above, the number of conductive particles (the number of connected particles) n existing in the connection area D / L is an important parameter. The number n of connecting particles that can ensure high reliability based on various experimental results is 5 or more (preferably 10 or more)
I know that. Therefore, the minimum connection width D
= 5 × 10 ⁻³ mm, it is necessary to secure 5 or more as the number n of connecting particles.

FIG. 5A shows that in the equation (1), α =
0.0243 ((pieces) ^{1/2 /} mm), β = -0.015
(1 / mm), minimum connection width in the pitch direction D = 5 × 10 ⁻³
mm, connection width in the terminal longitudinal direction L = 2.0 mm, H,
It is a table showing the values of the number of connected particles n when various values of N are set. H = 1 × 10 ⁻³ to 15 × 10 ⁻³ mm,
It can be seen that the number n of connecting particles can be secured to be 5 or more in the range of N = 1000 to 5000 / mm ² .

However, in reality, the values of α and β have variations due to statistical errors. Therefore, in the range of 0.015 ≦ α ≦ 0.035 (unit (pieces) ^1/2 / mm) −0.005 ≧ β ≧ −0.025 (unit 1 / mm), the number n of connected particles is the minimum. The value α = 0.015 (unit (piece) ^1/2 / mm) β = −0.005 (unit 1 / mm) is adopted. At this time, the minimum connection width in the pitch direction D = 5
× to 10 ^-3 mm, and terminal longitudinal direction of the connection width L = 2.0 mm, H, the value of the connecting particle number n when the set variously the value of N is as shown in Figure 5 (b). From FIG. 5 (b), H, N
Values of H = 1 × 10 ⁻³ to 10 × 10 ⁻³ mm, N
It can be seen that the number of connecting particles n can be 5 or more in the range of 3000 to 5000 particles / mm ² . In addition, H is 1 ×
It may be 10 ⁻³ mm or less.

In this way, the connection pitch P = 50 × 1
In order to realize 0 ⁻³ mm, it is possible to set n, H, and N to predetermined values so as to satisfy the expression (1).

If the number N of conductive particles existing per unit area of the anisotropic conductive film 17 shown in FIG. 2 is increased,
The protrusion amount H of the electrode terminal 16 from the substrate surface is 10 × 10 ^−3.
It is also considered that it may be mm or more. However, in such a case, the number of conductive particles 22 flowing between the electrode terminals 16 and 16 increases, which causes a leak between the electrode terminals 16 and 16, which is not preferable. That is, it is most preferable to set the value of N to the necessary minimum.

Next, the thickness t of the anisotropic conductive film 17 used for connection is determined.

As shown in FIG. 2, it is assumed that the uniform thickness of the anisotropic conductive film 17 before connection is t. Further, as shown in FIG. 6, the first electrode terminal 13 and the second electrode terminal 16 after connection are formed.
The thickness of the anisotropic conductive film 17 between and is set to t ₀ .

The distance between the mesa shoulders of the second electrode terminals 16 and 16 adjacent to each other on the substrate surface of the flexible substrate 15 is l ₁ , and the distance between the adjacent second electrode terminals 16 and 16 on the substrate surface is l ₂ From the geometrical relationship, t = (l ₁ + l ₂ ) · H / (2 · P) + t ₀ + γ (2) (where γ is the material property of the anisotropic conductive film and the It is a constant determined by conditions such as pressure and temperature.) The preset value of the protrusion amount H is substituted into this equation (2) to determine the set value of t. The value of γ is set in the range of 0 ≦ γ ≦ 9.0 (unit 10 ⁻³ mm).

In this case, the flow of the resin of the anisotropic conductive film 17 can be suppressed to the necessary minimum during thermocompression bonding. Therefore, the adjacent second electrode terminals 16, 16
It is possible to prevent the leak due to the aggregation of the conductive particles 22 in the space portion between them. As a result, the reliability of connection can be improved.

Further, FIG. 7 shows the flexible substrate 15 described above.
The second electrode terminals 16, 16, ...
The example in which the dummy electrode terminal 100 having a substantially U-shaped pattern opened toward the electrode terminal 16 side is provided. Inside the U-shaped pattern, as in the past,
Alignment mark 101 used for alignment with the panel
Is provided. This dummy electrode terminal 100 is shown in FIG.
As shown in FIG. 5, it does not correspond to the first electrode terminal 13 of the panel 11. When the dummy electrode terminal 100 is provided on the flexible substrate 15 as described above, the resin of the anisotropic conductive film 17 can be prevented from flowing out at the end of the flexible substrate 15 at the time of connection. Therefore, the anisotropic conductive film 17 can be filled between the panel 11 and the flexible substrate 15 with a uniform thickness, and the reliability of connection can be improved.

[0053]

As is apparent from the above, according to the panel mounting structure of the first aspect, a panel mounting structure with high connection reliability is realized even with a fine pitch.

The values of the constants α, β and γ are 0.015 ≦ α ≦ 0.035 (unit (pieces) ^1/2 / mm) −0.005 ≧ β ≧ −0.025 (unit 1 / mm) 0 ≤ γ ≤ 9.0 (unit: 10 ^-3 mm), so that it depends on realistic material properties of the anisotropic conductive film and conditions such as pressure and temperature at the time of connection. , The parameters H and N in the equation (1) can be set.

Further, in the panel mounting structure designing method of the second aspect, since the value of n is set within the range of 5 ≦ n, the area where the first and second electrode terminals actually overlap in the connected state. The required number n of conductive particles can be secured in the area D / L.

In the panel mounting structure according to claim 3,
A dummy electrode that has a substantially U-shaped pattern that opens toward the second electrode terminal side at the end of the array of the second electrode terminals of the flexible substrate and does not correspond to the first electrode terminal of the panel. Since the terminal is provided, it is possible to prevent the resin of the anisotropic conductive film from flowing out at the end of the flexible substrate during connection. Therefore, the anisotropic conductive film can be filled with a uniform thickness between the panel and the flexible substrate, and as a result, the reliability of the connection can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a panel and a flexible substrate in a panel mounting structure according to an embodiment of the present invention.

FIG. 2 is a view showing a cross section taken along the line BB in FIG.

FIG. 3 is a diagram showing a relationship between the number of connected particles n and a connection width D.

FIG. 4 is a diagram showing a relationship between the number of connected particles n and a connection width D.

FIG. 5 is a diagram showing a simulation result for determining parameters H and N in the mounting structure of the panel.

FIG. 6 is a diagram showing a state after the panel and the flexible substrate are connected.

FIG. 7 is a diagram showing dummy electrode terminals provided at the end of the array of electrode terminals of the flexible substrate.

FIG. 8 is a view showing a cross section taken along line CC of FIG.

FIG. 9 is a diagram showing an end portion of an array of electrode terminals of a flexible substrate used in a conventional panel mounting structure.

10 is a diagram showing a cross section taken along the line DD in FIG.

FIG. 11 is a diagram showing a panel and a flexible substrate in a conventional panel mounting structure.

12 is a diagram showing a cross section taken along the line AA in FIG.

[Explanation of symbols]

 11 Panel 12 Glass Substrate 13 First Electrode Terminal 14 Driving IC 15 Flexible Substrate 16 Second Electrode Terminal 17 Anisotropic Conductive Film 22 Conductive Particles 23 Top Surface of Second Electrode Terminal 50 Heater Tool for Pressing and Heating 100 dummy electrode terminal

Claims (3)

[Claims] 1. A strip-shaped first electrode terminal provided on the peripheral portion of the panel side by side at a predetermined pitch P, and a strip-shaped first electrode terminal provided on a flexible substrate corresponding to the first electrode terminal of the panel. In the mounting structure of the panel for connecting the second electrode terminal to the second electrode terminal via the anisotropic conductive film, the height of the second electrode terminal protruding from the substrate surface of the flexible substrate in a mesa shape is H. , N is the number of conductive particles existing per unit area of the anisotropic conductive film, and the first and second electrode terminals are long in the connected state in consideration of the positional deviation between the panel and the flexible substrate. The width that actually overlaps in the direction is L, the width that each of the first and second electrode terminals actually overlaps in the direction perpendicular to the longitudinal direction is D, and the first and second electrode terminals are in the connected state. The conductive particles of the anisotropic conductive film are placed in the actual overlapping area. When the number of children is n, n = α (βH + 1) · N ^1/2 · D · L (1) (where α and β are material characteristics of the anisotropic conductive film and The values of n, H, and N are set so as to satisfy the relational expression, which is determined by the conditions such as pressure and temperature.), And the uniform thickness of the anisotropic conductive film before connection is set. the t, the first of the anisotropic conductive film after the connection, the thickness between the second electrode terminals and t _0, the distance between the shoulder between the mesa of the second electrode terminal adjacent in the substrate surface l ₁ , where l ₂ is the distance between the adjacent second electrode terminals on the substrate surface, t = (l ₁ + l ₂ ) · H / (2 · P) + t ₀ + γ (2) (where γ Is a constant determined by the material properties of the anisotropic conductive film and the conditions such as pressure and temperature at the time of connection.) The value of t is set so as to satisfy the relational expression Constant alpha, beta, the value of γ are respectively 0.015 ≦ α ≦ 0.035 (unit ^{(pieces) 1/2 / mm) -0.005 ≧ β} ≧ -0.025 ( Unit 1 / mm) 0 ≦ A panel mounting structure characterized by being set in a range of γ ≦ 9.0 (unit: 10 ⁻³ mm). 2. The panel mounting structure according to claim 1, wherein the value of n is set within a range of 5 ≦ n. 3. A strip-shaped first electrode terminal provided in a line at a predetermined pitch P on the periphery of the panel, and a strip-shaped strip provided on the flexible substrate corresponding to the first electrode terminal of the panel. The second electrode terminal is connected to the second electrode terminal via an anisotropic conductive film. In the mounting structure of the panel, the second electrode terminal side is provided at an end portion of the array of the second electrode terminals of the flexible substrate. A panel mounting structure, characterized in that a dummy electrode terminal that has a substantially U-shaped pattern that opens toward the side and that does not correspond to the first electrode terminal of the panel is provided.