JPH0832492B2 - IC card manufacturing method - Google Patents
IC card manufacturing methodInfo
- Publication number
- JPH0832492B2 JPH0832492B2 JP63260561A JP26056188A JPH0832492B2 JP H0832492 B2 JPH0832492 B2 JP H0832492B2 JP 63260561 A JP63260561 A JP 63260561A JP 26056188 A JP26056188 A JP 26056188A JP H0832492 B2 JPH0832492 B2 JP H0832492B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- card
- frame
- battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はICカードの製造方法に係り、さらに詳しく
は、剛性が高く曲げ応力によるICチップ等の電子部品や
プリント配線基板との接続部が損傷することを防止する
ようにしたＩカードの製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing an IC card, and more specifically, to a connection part with an electronic component such as an IC chip having high rigidity and bending stress and a printed wiring board. The present invention relates to a method of manufacturing an I card that is prevented from being damaged.
［従来の技術］ 従来、キャッシュカード、クレジットカード等のカー
ドは磁気カードが主流をなしていたが、この磁気カード
は記憶容量が小さい、偽造、改造が容易なため安全性、
信頼性の面で限界があるなどの理由から、これらの欠点
を解決したICカードが実用化されつゝある。[Prior Art] Conventionally, magnetic cards have been the mainstream for cards such as cash cards and credit cards. However, this magnetic card has a small storage capacity, is easy to forge, and is easy to modify.
IC cards that overcome these drawbacks are still in practical use because of their limited reliability.
ICカードは磁気カードと同形のプラスチックカード
（厚さ0.76mm±10％）に、マイクロプロセッサ、メモリ
等のICチップを内蔵したもので、磁気カードに比べて記
憶容量が大きいだけでなく、演算、情報処理などの複合
機能を付与することができ、その上安全性、信頼性が高
いという特徴がある。The IC card is a plastic card (0.76mm ± 10% in thickness) of the same shape as a magnetic card with an IC chip such as a microprocessor and memory built in. It is possible to add complex functions such as information processing, and is characterized by high safety and reliability.
第２図は従来のICカードの一例の平面図、第３図はそ
の分解図、第４図及び第５図は第１図のＡ−Ａ、Ｂ−Ｂ
断面図である。図において、１はICカード、２はバック
パネル（基板）、３はプリント配線基板、４はフレー
ム、５はフロントパネルで、第２図はフロントパネル５
を剥離した状態を示してある。プリント配線基板３の表
面には入出力端子７が、また裏面には操作キー８がそれ
ぞれ設けられており、またプリント配線基板３に設けた
窓穴９内にはICチップ10が実装されている。11はプリン
ト配線基板３に取付けられたバッテリ、12は数字等を表
示する表示パネルである。FIG. 2 is a plan view of an example of a conventional IC card, FIG. 3 is an exploded view thereof, and FIGS. 4 and 5 are AA and BB of FIG.
It is sectional drawing. In the figure, 1 is an IC card, 2 is a back panel (board), 3 is a printed wiring board, 4 is a frame, 5 is a front panel, and FIG. 2 is a front panel 5.
The peeled state is shown. Input / output terminals 7 are provided on the front surface of the printed wiring board 3, operation keys 8 are provided on the back surface thereof, and an IC chip 10 is mounted in a window hole 9 provided in the printed wiring board 3. . Reference numeral 11 is a battery mounted on the printed wiring board 3, and reference numeral 12 is a display panel for displaying numbers and the like.
このようなICカード１は、入出力端子７やICチップ1
0、バッテリ11、表示パネル12等が実装されたプリント
配線基板３及びフレーム４を例えば両面テープの如き接
着剤６でバックパネル２の上に貼付け、さらにその上に
両面テープの如き接着剤６でフロントパネル５を貼付け
て一体化したものである。Such an IC card 1 has an input / output terminal 7 and an IC chip 1
0, the battery 11, the display panel 12, etc. are mounted on the back panel 2 with the adhesive 6 such as a double-sided tape, and the printed wiring board 3 and the frame 4, and the adhesive 6 such as a double-sided tape is further applied thereon. The front panel 5 is attached and integrated.
［発明が解決しようとする課題］ 上記のようなICカード１は、通常札入れ等に入れて携
帯することが多く、衣服のポケットに収容された場合、
携帯者の姿勢によって弧状に曲げられることが屡々あ
る。[Problems to be Solved by the Invention] Usually, the IC card 1 as described above is usually carried in a wallet or the like, and when stored in a pocket of clothes,
It is often bent in an arc depending on the posture of the wearer.
ところで、ICカード１を構成するバックパネル２、プ
リント配線基板３、フレーム４及びフロントパネル５
は、前述のように両面テープの如き接着剤６で貼合わせ
て一体化しているため、プリント配線基板３に設けた窓
穴９とICチップ10、フレーム４とバッテリ11及び表示パ
ネル12との間、さらにはこれらとプリント配線基板３と
の接続部の周囲にはそれぞれ隙間ｇが形成されている。
このため、ICカード１が曲げられると、これらの隙間ｇ
に曲げ応力が集中し、ICチップ10、バッテリ11、表示パ
ネル12等が破損するなどの悪影響を及ぼして機能低下を
来すばかりでなく、接続部が断線するなど、信頼性を損
うことがある。特に上記の隙間ｇがあることによりその
部分が曲り易く、接続部の不良発生を促進している。By the way, the back panel 2, the printed wiring board 3, the frame 4 and the front panel 5 which constitute the IC card 1
Since it is bonded and integrated with the adhesive 6 such as the double-sided tape as described above, the window hole 9 provided on the printed wiring board 3 and the IC chip 10, the frame 4, the battery 11, and the display panel 12 are connected. Further, a gap g is formed around each of the connecting portions between these and the printed wiring board 3.
Therefore, when the IC card 1 is bent, these gaps g
Bending stress concentrates on the IC chip, which adversely affects the IC chip 10, the battery 11, the display panel 12, etc. and causes a decline in function, as well as the disconnection of the connection part, which may impair reliability. is there. In particular, the presence of the above-mentioned gap g facilitates the bending of that portion, which promotes the occurrence of defects in the connecting portion.
また、ICカード１を構成するバックパネル１、フレー
ム４及びフロントパネル５の大きさは必ずしも同一とは
限らないため、これらを貼合せた際第４図、第５図に示
すように端部が整合せず、凹凸を生ずることがあり、こ
ゝから剥れ易くまた凹部ａに塵埃が溜ることもあって好
ましくなかった。Further, the sizes of the back panel 1, the frame 4 and the front panel 5 which compose the IC card 1 are not necessarily the same, and therefore, when these are pasted together, the end portions as shown in FIG. 4 and FIG. They are not preferable because they may not align with each other and may have irregularities, which may be easily peeled off and dust may be accumulated in the concave portions a.
本発明は、上記のような課題を解決すべくなされたも
ので、上記すき間に合成樹脂を充填することにより、剛
性が高く、一部に応力が集中することを防止して信頼性
の高いICカードを得ることを目的としたものである。The present invention has been made to solve the above problems, by filling the gap with a synthetic resin, high rigidity, high reliability IC to prevent the concentration of stress in a part The purpose is to get a card.
［課題を解決するための手段］ 本発明の製造方法は、バックパネル、ICチップを配置
したプリント配線基板、バッテリ、表示パネル、フレー
ム及びフロントパネルを重ね合わせて型に入れ、型内を
負圧状態にして流動性の合成樹脂を注入することによ
り、前記フレームと前記プリント配線基板、前記バッテ
リ及び前記表示パネルとの隙間、前記プリント配線基板
と前記ICチップとの隙間、前記プリント配線基板と前記
バッテリ及び前記表示パネルとの隙間、前記凹凸部を前
記合成樹脂で充填したものである。[Means for Solving the Problems] The manufacturing method of the present invention is such that a back panel, a printed wiring board on which an IC chip is arranged, a battery, a display panel, a frame and a front panel are superposed and put into a mold, and a negative pressure is applied inside the mold. By injecting a fluid synthetic resin in the state, a gap between the frame and the printed wiring board, the battery and the display panel, a gap between the printed wiring board and the IC chip, the printed wiring board and the The gap between the battery and the display panel and the uneven portion are filled with the synthetic resin.
［作用］ 本発明においては、バックパネル、ICチップを配置し
たプリント配線基板、バッテリ、表示パネル、フレーム
及びフロントパネルを重ね合わせて型に入れ、型内を負
圧状態にして流動性の合成樹脂を注入することにより、
前記フレームと前記プリント配線基板、前記バッテリ及
び前記表示パネルとの隙間、前記プリント配線基板と前
記ICチップとの隙間、前記プリント配線基板と前記バッ
テリ及び前記表示パネルとの隙間、前記凹凸部を前記合
成樹脂で充填したので、前記バックパネルと前記フロン
トパネルの間で合成樹脂によりフレーム、プリント配線
基板、ICチップ、バッテリ及び表示パネルが一体化さ
れ、製造されるICカード自体の剛性が向上して曲げ応力
の集中を防止できると共に、製造されるICカードはカー
ド端部に凹凸がなく、カード端部から剥がれにくくな
り、従来のようにカード端部に塵埃が溜まることもなく
なった。[Operation] In the present invention, the back panel, the printed wiring board on which the IC chip is arranged, the battery, the display panel, the frame and the front panel are superposed and put into a mold, and a negative pressure is applied to the inside of the mold to form a fluid synthetic resin. By injecting
The gap between the frame and the printed wiring board, the battery and the display panel, the gap between the printed wiring board and the IC chip, the gap between the printed wiring board and the battery and the display panel, the uneven portion Since it is filled with synthetic resin, the frame, the printed wiring board, the IC chip, the battery and the display panel are integrated by the synthetic resin between the back panel and the front panel to improve the rigidity of the manufactured IC card itself. The bending stress can be prevented from concentrating, and the manufactured IC card has no unevenness on the card edge, which makes it difficult to peel off from the card edge, and dust does not accumulate on the card edge as in the past.
［発明の実施例］ 本発明は、プリント配線基板３の窓穴９とICチップ10
との間に形成された隙間ｇ、フレーム４とバッテリ11、
表示パネル12との間に形成されたすき間ｇ及び各接続部
の周囲の隙間、さらに必要に応じてICカード１の端部の
凹部ａに合成樹脂を充填することにより、剛性を高める
と共に、曲り等による応力の集中を防止し、信頼性が高
く長期の使用に耐えうることのできるICカードを実現し
たものである。[Embodiment of the Invention] The present invention relates to the window hole 9 and the IC chip 10 of the printed wiring board 3.
A gap g formed between the frame 4 and the battery 11,
By filling the gap g formed between the display panel 12 and the gaps around each connecting portion, and the concave portion a at the end of the IC card 1 with synthetic resin as necessary, rigidity is increased and bending is performed. This is an IC card that is highly reliable and can withstand long-term use by preventing stress concentration due to factors such as the above.
実施例 １ バックパネル２、プリント配線基板３にバッテリ11、
表示パネル12等を実装したモジュール、フレーム４及び
フロントパネル５等を重ね合せて型に入れ、負圧状態に
して流動性の合成樹脂を注入し、これらを接着する。Example 1 A back panel 2, a battery 11 on a printed wiring board 3,
The module on which the display panel 12 and the like are mounted, the frame 4 and the front panel 5 and the like are overlapped and put in a mold, and a negative pressure is applied to inject a fluid synthetic resin, and these are bonded.
これにより、前記各隙間ｇ及び端部の凹部ａに合成樹
脂が充填され、隙間ｇや凹凸のないICカードが得られ
る。As a result, the respective gaps g and the recesses a at the ends are filled with the synthetic resin, and an IC card without the gaps g and the unevenness is obtained.
一般に、ICチップ10等の内蔵部品を保護するために
は、ICカード自体にある程度の剛性をもたせることが必
要であり、ICチップの割れその他の不良品の発生は、バ
ックパネル２の厚さに左右されることが多いが、前述の
ようにICカード１の厚さには制限があるため（0.76mm±
10％）、バックパネル２をあまり厚くすることはできな
い。Generally, in order to protect built-in parts such as the IC chip 10, it is necessary for the IC card itself to have a certain degree of rigidity, and cracks in the IC chip and other defective products are caused by the thickness of the back panel 2. This is often affected, but the thickness of the IC card 1 is limited as described above (0.76mm ±
10%), the back panel 2 cannot be made too thick.
各種厚さのバックパネル２を用い、前記実施例１の手
法により製造したICカードを折曲げて、樹脂充填の効果
を調査したところ、表１の通りであった。Table 1 shows the results of examining the effect of resin filling by bending the IC card manufactured by the method of Example 1 using back panels 2 having various thicknesses.
表１から明らかなように、バックパネル２が薄いほど
樹脂充填の効果が顕著であることがわかった。 As is clear from Table 1, the thinner the back panel 2 is, the more remarkable the effect of resin filling is.
上述の説明では、樹脂の充填につき３つの手法につい
て説明したが、本発明はこれに限定するものではなく、
他の手法を用いてもよい。In the above description, three methods for filling the resin have been described, but the present invention is not limited to this.
Other techniques may be used.
［発明の効果］ 以上の説明から明らかなように、本発明の製造方法
は、バックパネル、ICチップを配置したプリント配線基
板、バッテリ、表示パネル、フレーム及びフロントパネ
ルを重ね合わせて型に入れ、型内を負圧状態にして流動
性の合成樹脂を注入することにより、前記フレームと前
記プリント配線基板、前記バッテリ及び前記表示パネル
との隙間、前記プリント配線基板と前記ICチップとの隙
間、前記プリント配線基板と前記バッテリ及び前記表示
パネルとの隙間、前記凹凸部を前記合成樹脂で充填する
ようにしたので、前記バックパネルと前記フロントパネ
ルの間で合成樹脂によりフレーム、プリント配線基板、
ICチップ、バッテリ及び表示パネルが一体化され、かつ
前記フレームと前記プリント配線基板、前記バッテリ及
び前記表示パネルとの隙間、前記プリント配線基板と前
記ICチップとの隙間、前記プリント配線基板と前記バッ
テリ及び前記表示パネルとの隙間、前記凹凸部が埋めら
れ、製造されるICカード自体の剛性が向上して曲げ応力
の集中を防止できると共に、製造されるICカードはカー
ド端部に凹凸がなく、カード端部から剥がれにくくな
り、従来のようにカード端部に塵埃が溜まることもなく
なるという効果を有する。[Effects of the Invention] As is clear from the above description, the manufacturing method of the present invention is such that the back panel, the printed wiring board on which the IC chip is arranged, the battery, the display panel, the frame and the front panel are superposed and put into a mold. By injecting a fluid synthetic resin in a negative pressure state in the mold, a gap between the frame and the printed wiring board, the battery and the display panel, a gap between the printed wiring board and the IC chip, the Since the gap between the printed wiring board and the battery and the display panel, and the uneven portion are filled with the synthetic resin, a frame, a printed wiring board, and a frame made of synthetic resin between the back panel and the front panel.
An IC chip, a battery and a display panel are integrated and a gap between the frame and the printed wiring board, the battery and the display panel, a gap between the printed wiring board and the IC chip, the printed wiring board and the battery And the gap with the display panel, the uneven portion is filled, the rigidity of the manufactured IC card itself can be improved and the concentration of bending stress can be prevented, and the manufactured IC card has no unevenness at the card end, It has an effect that it is less likely to be peeled off from the card edge and dust is not accumulated at the card edge unlike the conventional case.
第１図は本発明実施例の断面図、第２図は従来のICカー
ドのフロントパネルを剥した状態を示す平面図、第３図
はその分解図、第４図、第５図は第１図のＡ−Ａ、Ｂ−
Ｂ拡大断面図である。 1:ICカード、2:バックパネル、3:プリント配線基板、4:
フレーム、5:フロントパネル、10:ICチップ、11:バッテ
リ、12:表示パネル、14:合成樹脂。FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view showing a state in which a front panel of a conventional IC card is peeled off, FIG. 3 is an exploded view thereof, FIG. 4 and FIG. AA, B- in the figure
It is a B expanded sectional view. 1: IC card, 2: back panel, 3: printed wiring board, 4:
Frame, 5: front panel, 10: IC chip, 11: battery, 12: display panel, 14: synthetic resin.
Claims (1)
の周辺に設置されたフレームと、前記フレームを介して
前記バックパネルと対向するように設置されたフロント
パネルと、前記バックパネルと前記フレームと前記フロ
ントパネルとの間に位置するプリント配線基板、バッテ
リ及び表示パネルと、前記プリント配線基板に設けられ
た窓穴と、前記窓穴内に設置されたICチップと、前記フ
ロントパネル外周と前記バックパネル外周と前記フレー
ム側面とから形成される凹凸部とを有するICカードの製
造方法において、 前記バックパネル、前記ICチップを配置したプリント配
線基板、前記バッテリ、前記表示パネル、前記フレーム
及び前記フロントパネルを重ね合わせて型に入れ、型内
を負圧状態にして流動性の合成樹脂を注入することによ
り、前記フレームと前記プリント配線基板、前記バッテ
リ及び前記表示パネルとの隙間、前記プリント配線基板
と前記ICチップとの隙間、前記プリント配線基板と前記
バッテリ及び前記表示パネルとの隙間、前記凹凸部を前
記合成樹脂で充填することを特徴とするICカードの製造
方法。1. A back panel, a frame installed around one surface of the back panel, a front panel installed so as to face the back panel through the frame, the back panel and the frame. A printed wiring board, a battery and a display panel located between the front panel, a window hole provided in the printed wiring board, an IC chip installed in the window hole, the outer periphery of the front panel and the back panel. In a method for manufacturing an IC card having an outer periphery and an uneven portion formed from the frame side surface, the back panel, a printed wiring board on which the IC chip is arranged, the battery, the display panel, the frame and the front panel are By stacking them in a mold, putting a negative pressure inside the mold and injecting a fluid synthetic resin , A gap between the frame and the printed wiring board, the battery and the display panel, a gap between the printed wiring board and the IC chip, a gap between the printed wiring board and the battery and the display panel, the uneven portion A method for manufacturing an IC card, which comprises filling with the synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63260561A JPH0832492B2 (en) | 1988-10-18 | 1988-10-18 | IC card manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63260561A JPH0832492B2 (en) | 1988-10-18 | 1988-10-18 | IC card manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02107496A JPH02107496A (en) | 1990-04-19 |
| JPH0832492B2 true JPH0832492B2 (en) | 1996-03-29 |
Family
ID=17349665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63260561A Expired - Lifetime JPH0832492B2 (en) | 1988-10-18 | 1988-10-18 | IC card manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0832492B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214957A (en) * | 1994-01-31 | 1995-08-15 | Mitsubishi Electric Corp | Ic card |
| EP0692771A3 (en) * | 1994-07-15 | 1997-07-16 | Shinko Name Plate Kabushiki Ka | Memory card and its manufacturing method |
| FR2831332B1 (en) * | 2001-10-19 | 2006-05-05 | Technopuce | METHOD FOR MANUFACTURING AN INFORMATION DEVICE AND DEVICE OBTAINED THEREBY |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056573U (en) * | 1983-09-28 | 1985-04-20 | 共同印刷株式会社 | ID card |
| JPS6076146A (en) * | 1983-10-03 | 1985-04-30 | Nitto Electric Ind Co Ltd | Thin type semiconductor device |
| JPH0312554Y2 (en) * | 1984-11-12 | 1991-03-25 | ||
| JPS62179994A (en) * | 1986-02-04 | 1987-08-07 | カシオ計算機株式会社 | electronic card |
| JPS6337998A (en) * | 1986-08-01 | 1988-02-18 | シ−アイ化成株式会社 | Ic card and manufacture thereof |
| JPS63144095A (en) * | 1986-12-09 | 1988-06-16 | 株式会社東芝 | Ic card |
-
1988
- 1988-10-18 JP JP63260561A patent/JPH0832492B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02107496A (en) | 1990-04-19 |
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